Patents by Inventor Yu-Jing Wang

Yu-Jing Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955547
    Abstract: An integrated circuit device includes a gate stack disposed over a substrate. A first L-shaped spacer is disposed along a first sidewall of the gate stack and a second L-shaped spacer is disposed along a second sidewall of the gate stack. The first L-shaped spacer and the second L-shaped spacer include silicon and carbon. A first source/drain epitaxy region and a second source/drain epitaxy region are disposed over the substrate. The gate stack is disposed between the first source/drain epitaxy region and the second source/drain epitaxy region. An interlevel dielectric (ILD) layer disposed over the substrate. The ILD layer is disposed between the first source/drain epitaxy region and a portion of the first L-shaped spacer disposed along the first sidewall of the gate stack and between the second source/drain epitaxy region and a portion of the second L-shaped spacer disposed along the second sidewall of the gate stack.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Te-Jen Pan, Yu-Hsien Lin, Hsiang-Ku Shen, Wei-Han Fan, Yun Jing Lin, Yimin Huang, Tzu-Chung Wang
  • Publication number: 20240096835
    Abstract: A method of manufacturing an electronic package is provided, in which an electronic element is disposed on a carrier structure; a heat dissipation body of a heat dissipation structure is disposed on the electronic element via a heat dissipation material; the heat dissipation material is cured; supporting legs of the heat dissipation structure are fixed on the carrier structure via a bonding layer; and the bonding layer is cured. Therefore, the heat dissipation structure can be effectively fixed to the heat dissipation material and the bonding layer by completing the arrangements of the heat dissipation material and the bonding layer in stages.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 21, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Pin-Jing SU, Liang-Yi HUNG, Yu-Po WANG
  • Publication number: 20150077358
    Abstract: An electronic device and method for controlling the same are provided. The electronic device includes a touch-sensitive screen and a controller. The touch-sensitive screen receives a first touch-moving path and a second touch-moving path thereon, wherein at least a part of the first touch-moving path is highlighted by the second touch-moving path. The controller recognizes and stores the highlighted part of the first touch-moving path.
    Type: Application
    Filed: July 23, 2014
    Publication date: March 19, 2015
    Inventor: Yu-Jing Wang
  • Publication number: 20140191985
    Abstract: A method and a device for controlling an electronic device having a touch screen are provided. The present method includes displaying a plurality of first type sub-images on the touch screen at an original angle when the electronic device is in a first state, where the first type sub-images constitute a first operation screen of the first state. The present method also includes detecting a sliding operation performed on the touch screen and flipping at least one of the first type sub-images according to the sliding operation. The present method further includes when the sliding operation corresponds to a specific gesture, flipping all the first type sub-images to a maximum angle to display a second operation screen of a second state of the electronic device and switching the electronic device from the first state to the second state.
    Type: Application
    Filed: July 5, 2013
    Publication date: July 10, 2014
    Inventors: Yu-Mao Feng, Chia-Hui Feng, Yu-Jing Wang
  • Patent number: 8062663
    Abstract: Methods and compositions for enhancing transdermal delivery of a bioactive agent. The method contains the step of applying to a skin tissue an effective amount of a composition comprising: (a) a drug vehicle; (b) a bioactive agent encapsulated within the drug vehicle; (c) a plurality of proteolytic enzyme molecules conjugated onto the surface of the drug vehicle; and (d) a pharmaceutically acceptable carrier, for a period of time effective to deliver the bioactive agent across the skin tissue at a desired dosage.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: November 22, 2011
    Assignee: National Health Research Instittues
    Inventors: Yu-Jing Wang, Yu-Chao Wang, Yi-Ting Wu, Lin-Ai Tai, Leu-Wei Lo, Chung-Shi Yang
  • Publication number: 20090291133
    Abstract: Methods and compositions for enhancing transdermal delivery of a bioactive agent. The method contains the step of applying to a skin tissue an effective amount of a composition comprising: (a) a drug vehicle; (b) a bioactive agent encapsulated within the drug vehicle; (c) a plurality of proteolytic enzyme molecules conjugated onto the surface of the drug vehicle; and (d) a pharmaceutically acceptable carrier, for a period of time effective to deliver the bioactive agent across the skin tissue at a desired dosage.
    Type: Application
    Filed: May 14, 2009
    Publication date: November 26, 2009
    Applicant: NATIONAL HEALTH RESEARCH INSTITUTES
    Inventors: Yu-Jing WANG, Yu-Chao Wang, Yi-Ting Wu, Lin-Ai Tai, Leu-Wei Lo, Chung-Shi Yang