Patents by Inventor Yuju Endo

Yuju Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10930988
    Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: February 23, 2021
    Assignee: Hitachi Metals, Ltd.
    Inventors: Kazufumi Suenaga, Yuju Endo, Hideyuki Sagawa, Takahiro Sugiyama, Hiroshi Ishikawa
  • Patent number: 10770772
    Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: September 8, 2020
    Assignee: Hitachi Metals, Ltd.
    Inventors: Kazufumi Suenaga, Yuju Endo, Hideyuki Sagawa, Takahiro Sugiyama, Hiroshi Ishikawa
  • Publication number: 20200168971
    Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.
    Type: Application
    Filed: January 29, 2020
    Publication date: May 28, 2020
    Inventors: Kazufumi SUENAGA, Yuju ENDO, Hideyuki SAGAWA, Takahiro SUGIYAMA, Hiroshi ISHIKAWA
  • Patent number: 10615477
    Abstract: Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of ?26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: April 7, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Kazufumi Suenaga, Setsuo Andoh, Hisashi Tate, Yuju Endo, Takahiro Sugiyama
  • Patent number: 10597790
    Abstract: A method of producing a refined copper includes depositing the refined copper on a cathode by an electroplating process or an electroless plating process in an alkaline plating bath including a solution of a copper compound that includes none of sulfur, chlorine and oxygen elements and produces copper ions having a valence of +1 in the solution.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: March 24, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Kazufumi Suenaga, Setsuo Ando, Yuju Endo
  • Patent number: 10312604
    Abstract: A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a fine protrusion on a surface of the microscopic particle.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: June 4, 2019
    Assignee: HITACHI METALS, LTD.
    Inventors: Kazufumi Suenaga, Setsuo Ando, Hisashi Tate, Yuju Endo
  • Publication number: 20190013560
    Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.
    Type: Application
    Filed: July 2, 2018
    Publication date: January 10, 2019
    Inventors: Kazufumi SUENAGA, Yuju ENDO, Hideyuki SAGAWA, Takahiro SUGIYAMA, Hiroshi ISHIKAWA
  • Publication number: 20190013559
    Abstract: Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of ?26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface.
    Type: Application
    Filed: April 27, 2018
    Publication date: January 10, 2019
    Inventors: Kazufumi Suenaga, Setsuo Andoh, Hisashi Tate, Yuju Endo, Takahiro Sugiyama
  • Publication number: 20180358712
    Abstract: A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a fine protrusion on a surface of the microscopic particle.
    Type: Application
    Filed: June 7, 2017
    Publication date: December 13, 2018
    Inventors: Kazufumi SUENAGA, Setsuo ANDO, Hisashi TATE, Yuju ENDO
  • Patent number: 9842953
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: December 12, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Publication number: 20170327961
    Abstract: A method of producing a refined copper includes depositing the refined copper on a cathode by an electroplating process or an electroless plating process in an alkaline plating bath including a solution of a copper compound that includes none of sulfur, chlorine and oxygen elements and produces copper ions having a valence of +1 in the solution.
    Type: Application
    Filed: June 27, 2016
    Publication date: November 16, 2017
    Inventors: Kazufumi SUENAGA, Setsuo ANDO, Yuju ENDO
  • Patent number: 9530918
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: December 27, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Patent number: 9508883
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: November 29, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Publication number: 20160133760
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material. The thickness of the oxide film on a surface to the molten solder plate layer is suppressed to be not more than 7 nm.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Inventors: Hajime NISHI, Yuju ENDO, Ken TAKAHASHI, Hiromitsu KURODA, Hiroyuki AKUTSU, Katsunori SAWAHATA, Hiroshi BANDO, Iku HIGASHIDANI, Hiroshi OKIKAWA
  • Publication number: 20160079458
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Application
    Filed: November 20, 2015
    Publication date: March 17, 2016
    Applicant: HITACHI METALS, LTD.
    Inventors: Yuju ENDO, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Patent number: 9279176
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: March 8, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Publication number: 20140216545
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Yuju ENDO, Takashi NEMOTO, Hiromitsu KURODA, Atsushi OOTAKE, Syuji KAWASAKI, Hiroshi BANDO
  • Publication number: 20140205491
    Abstract: A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33?M/O?1.5.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 24, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Keisuke FUJITO, Seigi AOYAMA, Toru SUMI, Hideyuki SAGAWA, Yuju ENDO
  • Patent number: 8748734
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: June 10, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Patent number: 8715798
    Abstract: A resin composition includes a polyolefin resin. A viscosity of the resin composition is within a range of not less than 500 Pa·s and not more than 2300 Pa·s under measurement conditions of a measurement temperature of 170° C. and a measurement frequency of 1 Hz. A strain hardening rate of the resin composition in uniaxial elongational viscosity measured under measurement conditions of a measurement temperature of 150° C. and a strain rate of 3.0 s?1 is not less than 800%. A foam insulated wire includes a conductor, and a foam insulation of the resin composition extruded on an outer periphery of thereof. A diameter of the conductor is 3.5 to 18 mm, and an outer diameter of the foam insulation is not less than 8 mm.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: May 6, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hideyuki Suzuki, Yuju Endo, Sohei Kodama, Masahiro Abe, Akinari Nakayama