Abstract: The present invention related to an resin compound, especially to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition of the present invention employs ester compound and flexible amine hardener to cure the epoxy resin, and the resin composition possesses excellent dielectric properties as well as high glass transition temperature and good toughness. The epoxy resin composition of the present invention, which applied in a prepreg and a copper-clad laminate, possesses excellent dielectric properties, high glass transition temperature and good impact toughness.

Abstract: The present invention relates to a thermosetting resin composition, wherein the resin composition comprises: (A) an epoxy resin with main chain containing naphthol structure; (B) a cyanate ester compound or/and an isocyanate ester prepolymer; (C) a poly phosphonate ester or/and phosphonate-carbonate copolymer. The thermosetting resin provided by the present invention has low dielectric constant and dielectric loss angular tangent value. The prepreg and copper-clad laminate made from the thermosetting resin composition above has excellent dielectrical properties, wet-heat resistance, flame resistance of UL94 V-0 grade and good technical processing performance.