Patents by Inventor Yuk Cheung Au
Yuk Cheung Au has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10475763Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.Type: GrantFiled: May 20, 2016Date of Patent: November 12, 2019Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Siu Wing Lau, Kin Yik Hung, Yuk Cheung Au, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go
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Publication number: 20160351527Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.Type: ApplicationFiled: May 20, 2016Publication date: December 1, 2016Inventors: Siu Wing LAU, Kin Yik HUNG, Yuk Cheung AU, Wing Chiu LAI, Leo Man LEE, Sai Yuen GO
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Publication number: 20150251195Abstract: Disclosed is a fluid dispenser, comprising a main body having an elongate bore formed therethrough; a dispensing rod having a tip, the dispensing rod being extendably movable along an axis of the elongate bore to dispense fluid; and a nozzle assembly comprising a nozzle having a contact surface that includes an exit orifice for dispensing the fluid from the elongate bore, and a nozzle holder for holding the nozzle. The nozzle is received by the main body to define a transverse gap that allows the nozzle to be movable transversely within the nozzle holder and with respect to the axis of the elongate bore to align the exit orifice with the dispensing rod, upon the tip of the dispensing rod being urged against the contact surface of the nozzle. Also disclosed is a nozzle assembly for a fluid dispenser, as well as a method of assembling a fluid dispenser.Type: ApplicationFiled: March 5, 2014Publication date: September 10, 2015Inventors: Dazhang LIAO, Hon Yu NG, Xiong LI, Tsz Kit YU, Yuk Cheung AU
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Patent number: 8470130Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.Type: GrantFiled: October 14, 2010Date of Patent: June 25, 2013Assignee: ASM Assembly Automation LtdInventors: Chi Ming Chong, Jin Hui Meng, Man Wai Chan, Yuk Cheung Au
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Patent number: 8141612Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.Type: GrantFiled: April 2, 2009Date of Patent: March 27, 2012Assignee: ASM Assembly Automation LtdInventors: Man Wai Chan, Yuk Cheung Au, Kwok Wai Wong, Chi Ming Chong
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Publication number: 20110088845Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.Type: ApplicationFiled: October 14, 2010Publication date: April 21, 2011Inventors: Chi Ming CHONG, Jin Hui MENG, Man Wai CHAN, Yuk Cheung AU
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Publication number: 20100252205Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.Type: ApplicationFiled: April 2, 2009Publication date: October 7, 2010Inventors: Man Wai CHAN, Yuk Cheung AU, Kwok Wai WONG, Chi Ming CHONG
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Patent number: 7667355Abstract: A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.Type: GrantFiled: January 4, 2008Date of Patent: February 23, 2010Assignee: ASM Assembly Automation Ltd.Inventors: Yuk Cheung Au, Kin Yik Hung, Wing Chiu Derek Lai, Pak Kin Leung, Cheuk Wah Chester Tang, Wai Lam
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Publication number: 20090195088Abstract: A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.Type: ApplicationFiled: January 4, 2008Publication date: August 6, 2009Inventors: Yuk Cheung AU, Kin Yik HUNG, Wing Chiu Derek LAI, Pak Kin LEUNG, Cheuk Wah Chester TANG, Wai LAM
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Patent number: 7240711Abstract: The invention provides an apparatus and method for aligning a bonding tool. A force sensor having a plurality of force sensing sections is configured to measure a force generated by the bonding tool on the force sensor. Each sensing section is adapted to individually detect an amount of force from a part of the bonding tool acting on that sensing section, so that an alignment of the bonding tool may be determined.Type: GrantFiled: January 21, 2004Date of Patent: July 10, 2007Assignee: ASM Assembly Automation Ltd.Inventors: Lai Wa Helen Chan, Siu Hong Choy, Chou Kee Peter Liu, Ming Wai Kelvin Ng, Yuk Cheung Au
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Patent number: 6543513Abstract: Die bonding apparatus is provided in which in order to move a target die to a pick-up position, a wafer table is moved by rotation and along one linear axis. This reduces the footprint of the apparatus in comparison to prior art apparatus in which this movement is accomplished by movement along two orthogonal linear axes. In an embodiment of the invention, however, movement along a second orthogonal liner axis may also be provided whereby a user may select the method of moving a target die to the pick-up position.Type: GrantFiled: November 27, 2000Date of Patent: April 8, 2003Assignee: ASM Assembly Automation Ltd.Inventors: Siu Wing Lau, Yuk Cheung Au
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Publication number: 20030044534Abstract: A writing head for an epoxy writing apparatus is formed with two outlet pins to enable two locations to be provided with liquid epoxy at the same time, thus doubling the operational speed of the writing apparatus. The writing head may be provided with a removable and replaceable discharge member so that different outlet pin spacings can be provided.Type: ApplicationFiled: September 6, 2001Publication date: March 6, 2003Inventors: Siu Wing Lau, Yuk Cheung Au
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Patent number: 6367669Abstract: Fluid dispensing apparatus for dispensing small precise metered quantities of fluid, for example in a semiconductor manufacturing process, comprises two metering chambers disposed in series. Each metering chamber has an associated piston rod and fluid is dispensed therefrom alternately. Twice the volume of fluid is displaced from the upstream metering chamber so that when it dispenses fluid at the same time it can refill the second downstream metering chamber.Type: GrantFiled: December 14, 2000Date of Patent: April 9, 2002Assignee: ASM Assembly Automation Ltd.Inventors: Yuk Cheung Au, Man Wai Chan