Patents by Inventor Yuk Fung Chan

Yuk Fung Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9956703
    Abstract: A method for cleaning batch material from an extrusion die includes introducing at least one gel composition into the die in a manner sufficient to purge the batch material from the die. After the batch material is purged from the die, the die can be treated further so that the gel composition is liquefied and flows from the die.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: May 1, 2018
    Assignee: Corning Incorporated
    Inventors: Dana Craig Bookbinder, Yuk Fung Chan, Lung-Ming Wu
  • Patent number: 9578778
    Abstract: An apparatus and corresponding memory card holder wherein the apparatus includes: a casing configured to enable a plurality of memory cards to be removably inserted into the casing; contact pads located within the casing configured to enable an electrical connection to be established between the contact pads and at least one memory card when the plurality of memory cards are inserted within the casing; and at least one mounting portion configured to enable the apparatus to be mounted on a circuit board such that a first portion of the apparatus is positioned above the circuit board and a second portion of the apparatus is positioned below the circuit board.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: February 21, 2017
    Assignee: Nokia Corporation
    Inventors: Bocheng Hou, Shixiang Wu, Henrik Franck, Morten Rolighed Christensen, Han Tao, Yuk Fung Chan
  • Publication number: 20150098194
    Abstract: An apparatus and corresponding memory card holder wherein the apparatus includes: a casing configured to enable a plurality of memory cards to be removably inserted into the casing; contact pads located within the casing configured to enable an electrical connection to be established between the contact pads and at least one memory card when the plurality of memory cards are inserted within the casing; and at least one mounting portion configured to enable the apparatus to be mounted on a circuit board such that a first portion of the apparatus is positioned above the circuit board and a second portion of the apparatus is positioned below the circuit board.
    Type: Application
    Filed: May 4, 2012
    Publication date: April 9, 2015
    Inventors: Bocheng Hou, Shixiang Wu, Henrik Franck, Morten Rolighed Christensen, Han Tao, Yuk Fung Chan
  • Patent number: 8192680
    Abstract: A method for fabricating ceramic honeycomb structural bodies that includes conveying at least one green honeycomb structural body of a first type and at least one green honeycomb structural body of a second type through a kiln in a manner which reduces cracking or fissures in the fired objects.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: June 5, 2012
    Assignee: Corning Incorporated
    Inventors: Yuk Fung Chan, Gregory Paul Dillon, Tudor Constantin Gheorghiu, Mahesh Chandra Mathur, Adedoyin Ademola Oyelaran, David Robert Potts
  • Publication number: 20100164131
    Abstract: A method for cleaning batch material from an extrusion die includes introducing at least one gel composition into the die in a manner sufficient to purge the batch material from the die. After the batch material is purged from the die, the die can be treated further so that the gel composition is liquefied and flows from the die.
    Type: Application
    Filed: December 30, 2008
    Publication date: July 1, 2010
    Inventors: Dana Craig Bookbinder, Yuk Fung Chan, Lung-Ming Wu
  • Publication number: 20090057963
    Abstract: A method for fabricating ceramic honeycomb structural bodies that includes conveying at least one green honeycomb structural body of a first type and at least one green honeycomb structural body of a second type through a kiln in a manner which reduces cracking or fissures in the fired objects.
    Type: Application
    Filed: August 27, 2008
    Publication date: March 5, 2009
    Inventors: Yuk Fung Chan, Gregory Paul Dillon, Tudor Constantin Gheorghiu, Mahesh Chandra Mathur, Adedoyin Ademola Oyelaran, David Robert Potts
  • Patent number: 7016708
    Abstract: The invention involves a hands-free device and method of use with a mobile phone and a vehicle seat headrest support structure. The hands-free device includes a speaker and a microphone for use in combination with a connecting structure that couples the device to the connecting structure and simultaneously allows the connecting structure to engage the vehicle headrest support structure to secure the speaker and the microphone of the device adjacent the head of an occupant of the seat to thereby allow the seat occupant to hear information communicated via the mobile phone and the speaker of the device while the occupant may simultaneously communicate via the microphone of the device.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: March 21, 2006
    Assignee: Nokia Corporation
    Inventors: Arnold Yuk Fung Chan, Alan Ka Lun Wong, Heli Säde, Valtteri Eroma