Patents by Inventor Yuka AKAHANE

Yuka AKAHANE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing molding mold and molding mold
    Patent number: 11951676
    Abstract: A method for manufacturing a molding mold used in an injection molding apparatus includes: generating a first plasticized material by plasticizing a first shaping material containing an amorphous metal and a resin; and shaping a laminate that is a part of the molding mold by discharging the first plasticized material toward a stage to laminate a layer.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 9, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Kenta Anegawa, Tatsuya Tsuboi, Fumiaki Akahane, Yuka Wakuda
  • Semiconductor device and manufacturing method thereof
    Patent number: 10854576
    Abstract: A semiconductor device includes a wiring substrate having a first surface, a stacked body on the first surface, the stacked body comprising a first chip, a second chip having a through via and positioned between the first chip and the first surface, and a third chip, a first resin contacting the first surface and the third chip, and a second resin sealing the stacked body. The first and second resins are made of different materials.
    Type: Grant
    Filed: September 3, 2017
    Date of Patent: December 1, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Yuji Karakane, Masatoshi Fukuda, Soichi Homma, Masayuki Miura, Naoyuki Komuta, Yuka Akahane, Yukifumi Oyama
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180261574
    Abstract: A semiconductor device includes a wiring substrate having a first surface, a stacked body on the first surface, the stacked body comprising a first chip, a second chip having a through via and positioned between the first chip and the first surface, and a third chip, a first resin contacting the first surface and the third chip, and a second resin sealing the stacked body. The first and second resins are made of different materials.
    Type: Application
    Filed: September 3, 2017
    Publication date: September 13, 2018
    Inventors: Yuji KARAKANE, Masatoshi FUKUDA, Soichi HOMMA, Masayuki MIURA, Naoyuki KOMUTA, Yuka AKAHANE, Yukifumi OYAMA