Abstract: A conductive member includes an adhesive layer and a metal foil layer. The adhesive layer consists of an adhesive composition containing conductive particles. The metal foil layer is disposed on the adhesive layer. The conductive member can be used to form, for example, a predetermined metal film.

Abstract: A method for manufacturing a substrate with built-in components includes providing an intermediate member including an electronic component with a first electrode provided on a first surface thereof, and a first electrically conductive layer provided on the first surface of the electronic component so as to cover the first electrode, and forming a first insulating resin layer on a first surface of the intermediate member. The first electrically conductive layer includes a first curable adhesive layer formed from a curable adhesive layer including electrically conductive particles and a cured adhesive composition, and a first metal foil layer disposed on the first curable adhesive layer that is a surface on a side opposite to the electronic component. The electrically conductive particles of the first curable adhesive layer electrically connect the first electrode of the electronic component and the first metal foil layer.

Abstract: A member for forming a wiring includes an adhesive layer and a metal foil layer. The adhesive layer is formed from an adhesive composition including electrically conductive particles. The metal foil layer is disposed on the adhesive layer. In this member for forming a wiring, a ratio of surface roughness Rz of a first surface of the metal foil layer on a side attached to the adhesive layer with respect to an average particle diameter of the electrically conductive particles is 0.05 to 3.