Patents by Inventor Yuka WAKUDA

Yuka WAKUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing molding mold and molding mold
    Patent number: 11951676
    Abstract: A method for manufacturing a molding mold used in an injection molding apparatus includes: generating a first plasticized material by plasticizing a first shaping material containing an amorphous metal and a resin; and shaping a laminate that is a part of the molding mold by discharging the first plasticized material toward a stage to laminate a layer.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 9, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Kenta Anegawa, Tatsuya Tsuboi, Fumiaki Akahane, Yuka Wakuda
  • METHOD FOR MANUFACTURING MOLDING MOLD AND MOLDING MOLD
    Publication number: 20220176620
    Abstract: A method for manufacturing a molding mold used in an injection molding apparatus includes: generating a first plasticized material by plasticizing a first shaping material containing an amorphous metal and a resin; and shaping a laminate that is a part of the molding mold by discharging the first plasticized material toward a stage to laminate a layer.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 9, 2022
    Inventors: Kenta ANEGAWA, Tatsuya TSUBOI, Fumiaki AKAHANE, Yuka WAKUDA