Patents by Inventor Yukako Senga

Yukako Senga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for suppressing aggregation of polypeptide
    Patent number: 10941179
    Abstract: The present invention relates to a method for suppressing aggregation of polypeptide. Specifically, the present invention relates to a method for suppressing, in a solution comprising an antibody or an Fc region-containing protein, formation of an aggregate derived from an antibody or an Fc region-containing protein having a non-native conformation, the method comprising: the steps of (i) binding an AF.2A1 polypeptide or an analog thereof with an aggregate derived from the antibody or Fc region-containing protein having a non-native conformation in the solution; and (ii) collecting the aggregate bound to the polypeptide or analog thereof from the solution.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: March 9, 2021
    Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Yukako Senga, Hideki Watanabe, Shinya Honda
  • METHOD FOR SUPPRESSING AGGREGATION OF POLYPEPTIDE
    Publication number: 20190135860
    Abstract: The present invention relates to a method for suppressing aggregation of polypeptide. Specifically, the present invention relates to a method for suppressing, in a solution comprising an antibody or an Fc region-containing protein, formation of an aggregate derived from an antibody or an Fc region-containing protein having a non-native conformation, the method comprising: the steps of (i) binding an AF.2A1 polypeptide or an analog thereof with an aggregate derived from the antibody or Fc region-containing protein having a non-native conformation in the solution; and (ii) collecting the aggregate bound to the polypeptide or analog thereof from the solution.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 9, 2019
    Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Yukako Senga, Hideki Watanabe, Shinya Honda