Patents by Inventor Yukari IMAIZUMI

Yukari IMAIZUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing semiconductor device
    Patent number: 9685376
    Abstract: A semiconductor device including: a support plate 1; a semiconductor chip 2 mounted on one principal surface of the support plate 1 via an adhesive layer, with the element circuit surface of the chip being directed upward; an insulation material layer 4 that seals the semiconductor chip 2 and the periphery of the semiconductor chip; openings formed on an electrode arranged on the element circuit surface of the semiconductor chip 2 in the insulation material layer 4; conductive portions 6 formed in the openings so as to be connected to the electrode of the semiconductor chip; a wiring layer 5 formed on the insulation material layer 4 so as to be connected to the conductive portions 6 and partially extending to the peripheral region of the semiconductor chip 2; and external electrodes 7 formed on the wiring layer 5.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: June 20, 2017
    Assignee: J-DEVICES CORPORATION
    Inventors: Yoshihiko Ikemoto, Hiroshi Inoue, Kiminori Ishido, Hiroaki Matsubara, Yukari Imaizumi
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20160027695
    Abstract: The invention provides a semiconductor device low in height and having low heat resistance, and a method of manufacturing the semiconductor device.
    Type: Application
    Filed: July 16, 2015
    Publication date: January 28, 2016
    Inventors: Yoshihiko IKEMOTO, Hiroshi INOUE, Kiminori ISHIDO, Hiroaki MATSUBARA, Yukari IMAIZUMI
  • Semiconductor device
    Patent number: 9059143
    Abstract: A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: June 16, 2015
    Assignee: J-DEVICES CORPORATION
    Inventors: Yukari Imaizumi, Goshi Kawazu, Isao Kudo, Akio Katsumata, Yoichi Hiruta
  • SEMICONDUCTOR DEVICE
    Publication number: 20120025367
    Abstract: A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.
    Type: Application
    Filed: March 30, 2011
    Publication date: February 2, 2012
    Applicants: Toshiba Corporation, J-DEVICES CORPORATION
    Inventors: Yukari IMAIZUMI, Goshi Kawazu, Isao Kudo, Akio Katsumata, Yoichi Hiruta