Patents by Inventor Yukari Inoue

Yukari Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11411164
    Abstract: A piezoelectric thin film device 10 includes a conductive layer 4 and a piezoelectric thin film 2 laminated directly on a surface of the conductive layer 4. The piezoelectric thin film 2 contains a plurality of crystalline grains having a wurtzite structure, a (001) plane of at least a part of the crystalline grains is oriented in a normal direction DN of the surface of the conductive layer 4, and a median diameter of the plurality of crystalline grains in a direction parallel to the surface of the conductive layer 4 is 30 nm or more and 80 nm or less.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: August 9, 2022
    Assignee: TDK Corporation
    Inventors: Junichi Kimura, Yukari Inoue
  • Publication number: 20210126185
    Abstract: Provided is a piezoelectric thin film device containing: a first electrode layer; and a piezoelectric thin film. The first electrode layer contains a metal Me having a crystal structure. The piezoelectric thin film contains aluminum nitride having a wurtzite structure. The aluminum nitride contains a divalent metal element Md and a tetravalent metal element Mt. [Al] is an amount of Al contained in the aluminum nitride, [Md] is an amount of Md contained in the aluminum nitride, [Mt] is an amount of Mt contained in the aluminum nitride, ([Md]+[Mt])/([Al]+[Md]+[Mt]) is 36 to 70 atom %. LALN is a lattice length of the aluminum nitride in a direction that is approximately parallel to a surface of the first electrode layer with which the piezoelectric thin film is in contact, LMETAL is a lattice length of Me in a direction, and LALN is longer than LMETAL.
    Type: Application
    Filed: October 27, 2020
    Publication date: April 29, 2021
    Applicant: TDK Corporation
    Inventors: Junichi KIMURA, Yukari INOUE
  • Publication number: 20200176667
    Abstract: A piezoelectric thin film device 10 includes a conductive layer 4 and a piezoelectric thin film 2 laminated directly on a surface of the conductive layer 4. The piezoelectric thin film 2 contains a plurality of crystalline grains having a wurtzite structure, a (001) plane of at least a part of the crystalline grains is oriented in a normal direction DN of the surface of the conductive layer 4, and a median diameter of the plurality of crystalline grains in a direction parallel to the surface of the conductive layer 4 is 30 nm or more and 80 nm or less.
    Type: Application
    Filed: November 26, 2019
    Publication date: June 4, 2020
    Applicant: TDK Corporation
    Inventors: Junichi KIMURA, Yukari INOUE
  • Patent number: 10505514
    Abstract: A piezoelectric thin film comprises aluminum nitride containing a monad and at least one type among a tetrad and a pentad. The piezoelectric thin film having a large electromechanical coupling factor and a small stiffness.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: December 10, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Yukari Inoue, Tomohiro Terada, Junichi Kimura
  • Publication number: 20190319604
    Abstract: A piezoelectric thin film comprises aluminum nitride containing a monad and at least one type among a tetrad and a pentad. The piezoelectric thin film having a large electromechanical coupling factor and a small stiffness.
    Type: Application
    Filed: April 11, 2018
    Publication date: October 17, 2019
    Inventors: Yukari Inoue, Tomohiro Terada, Junichi Kimura
  • Patent number: 8749076
    Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: June 10, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Chiaki Okada, Kazuhiko Yamada, Yukari Inoue
  • Patent number: 8553390
    Abstract: A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: October 8, 2013
    Assignee: TDK Corporation
    Inventors: Susumu Taniguchi, Miyuki Yanagida, Hisayuki Abe, Yukari Inoue, Masataka Kitagami
  • Publication number: 20130113121
    Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.
    Type: Application
    Filed: June 10, 2011
    Publication date: May 9, 2013
    Inventors: Chiaki Okada, Kazuhiko Yamada, Yukari Inoue
  • Patent number: 8258400
    Abstract: A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304), an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between the case body (320) and the closure member (14), and a foreign-matter guide portion (10) provided on an outer surface of the case body (320), aside from the joint structure (303a, 303b, 304), such that the foreign-matter guide portion is located above the seal structure in the vertical direction of the storage case.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: September 4, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yukari Inoue, Hitoshi Imura
  • Publication number: 20120007709
    Abstract: A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.
    Type: Application
    Filed: July 7, 2011
    Publication date: January 12, 2012
    Applicant: TDK Corporation
    Inventors: Susumu Taniguchi, Miyuki Yanagida, Hisayuki Abe, Yukari Inoue, Masataka Kitagami
  • Patent number: 8020656
    Abstract: An inflow conduit through which coolant flows into a hybrid radiator that is arranged in front of an engine radiator is arranged on an upper portion of a bumper reinforcement and attached to the front of the hybrid radiator. As a result, damage to the inflow conduit can be inhibited and the coolant can be cooled by running air before it is cooled in the hybrid radiator.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: September 20, 2011
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yukari Inoue, Sachio Kiduka
  • Publication number: 20110114402
    Abstract: An inflow conduit through which coolant flows into a hybrid radiator that is arranged in front of an engine radiator is arranged on an upper portion of a bumper reinforcement and attached to the front of the hybrid radiator. As a result, damage to the inflow conduit can be inhibited and the coolant can be cooled by running air before it is cooled in the hybrid radiator.
    Type: Application
    Filed: June 30, 2009
    Publication date: May 19, 2011
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yukari Inoue, Sachio Kiduka
  • Publication number: 20090223695
    Abstract: A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304) an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between the case body (320) and the closure member (14), and a foreign-matter guide portion (10) provided on an outer surface of the case body (320), aside from the joint structure (303a, 303b, 304), such that the foreign-matter guide portion is located above the seal structure in the vertical direction of the storage case.
    Type: Application
    Filed: April 18, 2007
    Publication date: September 10, 2009
    Applicant: Toyota Judosha Kabushiki Kaisha
    Inventors: Yukari Inoue, Hitoshi Imura
  • Publication number: 20090120661
    Abstract: A protective structure for a high voltage cable includes a boost converter and a rear inverter installed in a hybrid vehicle and disposed to be separated from each other; a cable extending between the boost converter and the rear inverter; a protector provided in at least a section of a route along which the cable extends; and a flexible tube surrounding a circumference of the cable inside the protector and freely curved along a direction in which the cable extends. When external force is applied to the cable, the external force is reduced by the protector and the flexible tube. With such a configuration, a protective structure for a high voltage cable that prevents an excessive impact from being exerted on the cable in the event of a vehicle crash is provided.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 14, 2009
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yukari Inoue, Hitoshi Imura