Patents by Inventor Yukari Inoue
Yukari Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11647676Abstract: Provided is a piezoelectric thin film device containing: a first electrode layer; and a piezoelectric thin film. The first electrode layer contains a metal Me having a crystal structure. The piezoelectric thin film contains aluminum nitride having a wurtzite structure. The aluminum nitride contains a divalent metal element Md and a tetravalent metal element Mt. [Al] is an amount of Al contained in the aluminum nitride, [Md] is an amount of Md contained in the aluminum nitride, [Mt] is an amount of Mt contained in the aluminum nitride, ([Md]+[Mt])/([Al]+[Md]+[Mt]) is 36 to 70 atom %. LALN is a lattice length of the aluminum nitride in a direction that is approximately parallel to a surface of the first electrode layer with which the piezoelectric thin film is in contact, LMETAL is a lattice length of Me in a direction, and LALN is longer than LMETAL.Type: GrantFiled: October 27, 2020Date of Patent: May 9, 2023Assignee: TDK CorporationInventors: Junichi Kimura, Yukari Inoue
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Patent number: 11411164Abstract: A piezoelectric thin film device 10 includes a conductive layer 4 and a piezoelectric thin film 2 laminated directly on a surface of the conductive layer 4. The piezoelectric thin film 2 contains a plurality of crystalline grains having a wurtzite structure, a (001) plane of at least a part of the crystalline grains is oriented in a normal direction DN of the surface of the conductive layer 4, and a median diameter of the plurality of crystalline grains in a direction parallel to the surface of the conductive layer 4 is 30 nm or more and 80 nm or less.Type: GrantFiled: November 26, 2019Date of Patent: August 9, 2022Assignee: TDK CorporationInventors: Junichi Kimura, Yukari Inoue
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Publication number: 20210126185Abstract: Provided is a piezoelectric thin film device containing: a first electrode layer; and a piezoelectric thin film. The first electrode layer contains a metal Me having a crystal structure. The piezoelectric thin film contains aluminum nitride having a wurtzite structure. The aluminum nitride contains a divalent metal element Md and a tetravalent metal element Mt. [Al] is an amount of Al contained in the aluminum nitride, [Md] is an amount of Md contained in the aluminum nitride, [Mt] is an amount of Mt contained in the aluminum nitride, ([Md]+[Mt])/([Al]+[Md]+[Mt]) is 36 to 70 atom %. LALN is a lattice length of the aluminum nitride in a direction that is approximately parallel to a surface of the first electrode layer with which the piezoelectric thin film is in contact, LMETAL is a lattice length of Me in a direction, and LALN is longer than LMETAL.Type: ApplicationFiled: October 27, 2020Publication date: April 29, 2021Applicant: TDK CorporationInventors: Junichi KIMURA, Yukari INOUE
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Publication number: 20200176667Abstract: A piezoelectric thin film device 10 includes a conductive layer 4 and a piezoelectric thin film 2 laminated directly on a surface of the conductive layer 4. The piezoelectric thin film 2 contains a plurality of crystalline grains having a wurtzite structure, a (001) plane of at least a part of the crystalline grains is oriented in a normal direction DN of the surface of the conductive layer 4, and a median diameter of the plurality of crystalline grains in a direction parallel to the surface of the conductive layer 4 is 30 nm or more and 80 nm or less.Type: ApplicationFiled: November 26, 2019Publication date: June 4, 2020Applicant: TDK CorporationInventors: Junichi KIMURA, Yukari INOUE
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Patent number: 10505514Abstract: A piezoelectric thin film comprises aluminum nitride containing a monad and at least one type among a tetrad and a pentad. The piezoelectric thin film having a large electromechanical coupling factor and a small stiffness.Type: GrantFiled: April 11, 2018Date of Patent: December 10, 2019Assignee: QUALCOMM IncorporatedInventors: Yukari Inoue, Tomohiro Terada, Junichi Kimura
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Publication number: 20190319604Abstract: A piezoelectric thin film comprises aluminum nitride containing a monad and at least one type among a tetrad and a pentad. The piezoelectric thin film having a large electromechanical coupling factor and a small stiffness.Type: ApplicationFiled: April 11, 2018Publication date: October 17, 2019Inventors: Yukari Inoue, Tomohiro Terada, Junichi Kimura
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Patent number: 8749076Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.Type: GrantFiled: June 10, 2011Date of Patent: June 10, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Chiaki Okada, Kazuhiko Yamada, Yukari Inoue
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Patent number: 8553390Abstract: A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.Type: GrantFiled: July 7, 2011Date of Patent: October 8, 2013Assignee: TDK CorporationInventors: Susumu Taniguchi, Miyuki Yanagida, Hisayuki Abe, Yukari Inoue, Masataka Kitagami
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Publication number: 20130113121Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.Type: ApplicationFiled: June 10, 2011Publication date: May 9, 2013Inventors: Chiaki Okada, Kazuhiko Yamada, Yukari Inoue
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Patent number: 8258400Abstract: A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304), an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between the case body (320) and the closure member (14), and a foreign-matter guide portion (10) provided on an outer surface of the case body (320), aside from the joint structure (303a, 303b, 304), such that the foreign-matter guide portion is located above the seal structure in the vertical direction of the storage case.Type: GrantFiled: April 18, 2007Date of Patent: September 4, 2012Assignee: Toyota Jidosha Kabushiki KaishaInventors: Yukari Inoue, Hitoshi Imura
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Publication number: 20120007709Abstract: A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.Type: ApplicationFiled: July 7, 2011Publication date: January 12, 2012Applicant: TDK CorporationInventors: Susumu Taniguchi, Miyuki Yanagida, Hisayuki Abe, Yukari Inoue, Masataka Kitagami
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Patent number: 8020656Abstract: An inflow conduit through which coolant flows into a hybrid radiator that is arranged in front of an engine radiator is arranged on an upper portion of a bumper reinforcement and attached to the front of the hybrid radiator. As a result, damage to the inflow conduit can be inhibited and the coolant can be cooled by running air before it is cooled in the hybrid radiator.Type: GrantFiled: June 30, 2009Date of Patent: September 20, 2011Assignee: Toyota Jidosha Kabushiki KaishaInventors: Yukari Inoue, Sachio Kiduka
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Publication number: 20110114402Abstract: An inflow conduit through which coolant flows into a hybrid radiator that is arranged in front of an engine radiator is arranged on an upper portion of a bumper reinforcement and attached to the front of the hybrid radiator. As a result, damage to the inflow conduit can be inhibited and the coolant can be cooled by running air before it is cooled in the hybrid radiator.Type: ApplicationFiled: June 30, 2009Publication date: May 19, 2011Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yukari Inoue, Sachio Kiduka
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Publication number: 20090223695Abstract: A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304) an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between the case body (320) and the closure member (14), and a foreign-matter guide portion (10) provided on an outer surface of the case body (320), aside from the joint structure (303a, 303b, 304), such that the foreign-matter guide portion is located above the seal structure in the vertical direction of the storage case.Type: ApplicationFiled: April 18, 2007Publication date: September 10, 2009Applicant: Toyota Judosha Kabushiki KaishaInventors: Yukari Inoue, Hitoshi Imura
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Publication number: 20090120661Abstract: A protective structure for a high voltage cable includes a boost converter and a rear inverter installed in a hybrid vehicle and disposed to be separated from each other; a cable extending between the boost converter and the rear inverter; a protector provided in at least a section of a route along which the cable extends; and a flexible tube surrounding a circumference of the cable inside the protector and freely curved along a direction in which the cable extends. When external force is applied to the cable, the external force is reduced by the protector and the flexible tube. With such a configuration, a protective structure for a high voltage cable that prevents an excessive impact from being exerted on the cable in the event of a vehicle crash is provided.Type: ApplicationFiled: November 8, 2006Publication date: May 14, 2009Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yukari Inoue, Hitoshi Imura