Patents by Inventor Yukari Shirahata

Yukari Shirahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 8076755
    Abstract: Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate. Furthermore, on a back surface of the semiconductor substrate, a backside electrode is formed. Moreover, the emitter pad electrodes connected to a grounding potential are connected to the backside electrode through feedthrough electrodes penetrating the semiconductor substrate in a thickness direction.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: December 13, 2011
    Inventors: Mitsuo Umemoto, Shigehito Matsumoto, Hirotoshi Kubo, Yukari Shirahata, Masamichi Yamamuro, Koujiro Kameyama
  • Semiconductor Device and Method of Manufacturing the Same
    Publication number: 20080237808
    Abstract: Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate. Furthermore, on a back surface of the semiconductor substrate, a backside electrode is formed. Moreover, the emitter pad electrodes connected to a grounding potential are connected to the backside electrode through feedthrough electrodes penetrating the semiconductor substrate in a thickness direction.
    Type: Application
    Filed: June 6, 2008
    Publication date: October 2, 2008
    Applicants: Sanyo Electric Co., Ltd., Kanto Semiconductors Co., Ltd.
    Inventors: Hirotoshi Kubo, Yukari Shirahata, Shigehito Matsumoto, Masamichi Yamamuro, Koujiro Kameyama, Mitsuo Umemoto
  • Semiconductor device and method of manufacturing the same
    Patent number: 7397128
    Abstract: Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate. Furthermore, on a back surface of the semiconductor substrate, a backside electrode is formed. Moreover, the emitter pad electrodes connected to a grounding potential are connected to the backside electrode through feedthrough electrodes penetrating the semiconductor substrate in a thickness direction.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: July 8, 2008
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Hirotoshi Kubo, Yukari Shirahata, Shigehito Matsumoto, Masamichi Yamamuro, Koujiro Kameyama, Mitsuo Umemoto
  • Semiconductor device and method of manufacturing the same
    Publication number: 20060220178
    Abstract: Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate. Furthermore, on a back surface of the semiconductor substrate, a backside electrode is formed. Moreover, the emitter pad electrodes connected to a grounding potential are connected to the backside electrode through feedthrough electrodes penetrating the semiconductor substrate in a thickness direction.
    Type: Application
    Filed: March 28, 2006
    Publication date: October 5, 2006
    Inventors: Hirotoshi Kubo, Yukari Shirahata, Shigehito Matsumoto, Masamichi Yamamuro, Koujiro Kameyama, Mitsuo Umemoto