Patents by Inventor Yukari Terakawa
Yukari Terakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8792755Abstract: A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H2; wherein a relational expression H3<H2<H1 is satisfied where the height H1 is a distance in the normal line direction from the substrate surface to a surface of the light guide facing the substrate surface, and the height H3 is a length in the normal line direction from the substrate surface in the light emitting/receiving element. The sealing resin is filled so as to cover the first and second sealing surface adjustment members and so as not to come in contact with the light transmission path.Type: GrantFiled: March 12, 2008Date of Patent: July 29, 2014Assignee: OMRON CorporationInventors: Junichi Tanaka, Hayami Hosokawa, Naru Yasuda, Yukari Terakawa
-
Patent number: 8457499Abstract: A semiconductor laser drive apparatus comprises a bias current setting section (232) which sets a bias current value on the basis of the drive temperature so that the temperature characteristic of the bias current value with respect to the drive temperature may be a linear function having a slope except zero and a drive current setting section (233) for setting the drive current value on the basis of the drive temperature so that the temperature characteristic of the drive current value with respect to the drive temperature may be a function having a slope except zero. The temperature characteristic of the bias current and that of the drive current are functions different from each other. With this, low cost, space-saving, and power-saving of a semiconductor laser are achieved, and a semiconductor laser drive apparatus enabling a good transmission characteristic on the reception side and a high optical output over the whole drive temperature range when driving the semiconductor laser can be provided.Type: GrantFiled: August 8, 2008Date of Patent: June 4, 2013Assignee: OMRON CorporationInventors: Kentaro Hamana, Akira Enami, Yukari Terakawa, Keisuke Uno, Hayami Hosokawa
-
Patent number: 8457455Abstract: A light guide includes a core and a clad made of a material having an index of refraction different from an index of refraction of the core and covering the core, in which at least one of a light incident surface or a light exit surface of the core is arranged while shifted in parallel without changing respective inclined angles so that the inclined surface is divided into a plurality of inclined surfaces parallel in a longitudinal direction (X direction) of the rectangular shape in the orthogonal projection and the plurality of inclined surfaces closer to the light emitting portion are positioned in a direction (Z direction) of moving away from the end face to be in a shape extending in the direction (Z direction) of moving away from the end face in a stepwise manner as a whole.Type: GrantFiled: March 14, 2008Date of Patent: June 4, 2013Assignee: OMRON CorporationInventors: Yukari Terakawa, Hayami Hosokawa
-
Publication number: 20120134681Abstract: A semiconductor laser drive apparatus comprises a bias current setting section (232) which sets a bias current value on the basis of the drive temperature so that the temperature characteristic of the bias current value with respect to the drive temperature may be a linear function having a slope except zero and a drive current setting section (233) for setting the drive current value on the basis of the drive temperature so that the temperature characteristic of the drive current value with respect to the drive temperature may be a function having a slope except zero. The temperature characteristic of the bias current and that of the drive current are functions different from each other. With this, low cost, space-saving, and power-saving of a semiconductor laser are achieved, and a semiconductor laser drive apparatus enabling a good transmission characteristic on the reception side and a high optical output over the whole drive temperature range when driving the semiconductor laser can be provided.Type: ApplicationFiled: August 8, 2008Publication date: May 31, 2012Applicant: OMRON CORPORATIONInventors: Kentaro Hamana, Akira Enami, Yukari Terakawa, Keisuke Uno, Hayami Hosokawa
-
Publication number: 20100135613Abstract: A light guide includes a core and a clad made of a material having an index of refraction different from an index of refraction of the core and covering the core, in which at least one of a light incident surface or a light exit surface of the core is arranged while shifted in parallel without changing respective inclined angles so that the inclined surface is divided into a plurality of inclined surfaces parallel in a longitudinal direction (X direction) of the rectangular shape in the orthogonal projection and the plurality of inclined surfaces closer to the light emitting portion are positioned in a direction (Z direction) of moving away from the end face to be in a shape extending in the direction (Z direction) of moving away from the end face in a stepwise manner as a whole.Type: ApplicationFiled: March 14, 2008Publication date: June 3, 2010Applicant: OMRON CORPORATIONInventors: Yukari Terakawa, Hayami Hosokawa
-
Publication number: 20100119238Abstract: A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H2; wherein a relational expression H3<H2<H1 is satisfied where the height H1 is a distance in the normal line direction from the substrate surface to a surface of the light guide facing the substrate surface, and the height H3 is a length in the normal line direction from the substrate surface in the light emitting/receiving element. The sealing resin is filled so as to cover the first and second sealing surface adjustment members and so as not to come in contact with the light transmission path.Type: ApplicationFiled: March 12, 2008Publication date: May 13, 2010Applicant: OMRON CORPORATIONInventors: Junichi Tanaka, Hayami Hosokawa, Naru Yasuda, Yukari Terakawa
-
Patent number: 7300183Abstract: On a front wall of a mold resin (13) sealing a light emitter (12), a direct emission region (18), through which the light emitted from the light emitter (12) directly passes to the outside, and a total reflection region (19), by which the light emitted from the light emitter (12) is totally reflected, are formed. The direct emission region (18) is formed into a shape of a convex lens. A light reflection portion (20) which is made of a concave mirror is provided on the rear face of the mold resin (13). When a part of the light emitted from the light emitter (12) passes through the direct emission region (18), it is affected by the lens to be emitted to the front direction. After another part of the light emitted from the light emitter (12) is totally reflected by the total reflection region (19), it is reflected by the light reflection portion (20) to be emitted to the front direction through the total reflection region (19).Type: GrantFiled: May 23, 2005Date of Patent: November 27, 2007Assignee: Omron CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
-
Patent number: 7283690Abstract: An optical wave guide device is manufactured by bonding an optical wave guide to an optical modulator through an upper cladding layer. The optical wave guide includes a glass substrate, a lower cladding layer and cores, and the optical modulator includes elements (heaters), which are disposed on the lower surface of a glass substrate, for modulating the light propagating in the cores, and electrodes and wire bond pads which are disposed on the front surface thereof. The elements are connected to the electrodes via through-holes. With this arrangement, there can be provided an optical waveguide device, in which cores are not degraded in manufacturing processes and elements for modulating the light propagating in the cores are unlikely to be exfoliated.Type: GrantFiled: June 30, 2003Date of Patent: October 16, 2007Assignee: OMRON CorporationInventors: Yoshiyuki Komura, Kazuyuki Hayamizu, Yukari Terakawa, Hayami Hosokawa
-
Patent number: 7269309Abstract: The spacers 3 and 4 and the recess is formed on the supporting substrate 2 to support the upper cladding layer 7. The intermediate surface 22 and 23 lower than the top surface of the spacers 3 and 4 and higher than the inner bottom surface of the recess is formed on the supporting substrate 2. Each of the height between the top surface of the spacers 3 and 4 and the intermediate surfaces 22 and 23, and the height between the intermediate surfaces 22 and 23 and the inner bottom surface of the recess of the second substrate 2 becomes thin compared with the total thickness of the lower cladding layer. Thus, when the resin for the lower cladding layer 9 is cured to shrinkage, the inner stress in the resin is dispersed and the occurrence of the wrinkle 12 and the void decreases.Type: GrantFiled: March 17, 2005Date of Patent: September 11, 2007Assignee: Omron CorporationInventors: Yoshiyuki Komura, Kazuyuki Hayamizu, Masayoshi Higuchi, Hisashi Taniguchi, Yukari Terakawa, Hayami Hosokawa
-
Patent number: 7244924Abstract: This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.Type: GrantFiled: February 7, 2006Date of Patent: July 17, 2007Assignee: Omron CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
-
Patent number: 7174081Abstract: An optical waveguide device includes a first substrate, where the first substrate includes a first plate and an optical waveguide region disposed on the first plate, and where the optical waveguide region includes a core for transmitting light and a cladding surrounding the core. The optical waveguide device further includes a second substrate, where the second substrate includes a second plate having a spacer. Additionally, a surface including the optical waveguide region of the first substrate opposes a surface including the spacer of the second substrate, the spacer is formed the region which is out of the core of the first substrate, a top surface of the spacer is in contact with the first substrate, the first substrate and the second substrate are bound with adhesive material, and the entire surface of the core is in contact with the adhesive material.Type: GrantFiled: December 20, 2005Date of Patent: February 6, 2007Assignee: Omron CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
-
Patent number: 7130503Abstract: Light of wavelengths ?2 and ?3 (?2<?3) is propagated in a first core. The light emitted form the first core is divided at a filter. That is, the light of the wavelength ?2 transmits through the filter and is made incident onto a third core while the light of the wavelength ?3 is reflected from a filter and is made incident onto a second core. The second core has a sectional area which works in a single mode for the light of the wavelength ?3 and works in a multiple mode for the light of the wavelength ?2. It is therefore possible to prevent noise or stray light in an optical multiplexer/demultiplexer.Type: GrantFiled: May 11, 2004Date of Patent: October 31, 2006Assignee: OMRON CorporationInventors: Yukari Terakawa, Toshinari Mori, Hayami Hosokawa
-
Patent number: 7113683Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: GrantFiled: December 20, 2005Date of Patent: September 26, 2006Assignee: OMRON CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
-
Publication number: 20060124835Abstract: This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.Type: ApplicationFiled: February 7, 2006Publication date: June 15, 2006Applicant: OMRON CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
-
Publication number: 20060110098Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: ApplicationFiled: December 20, 2005Publication date: May 25, 2006Applicant: OMRON CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
-
Publication number: 20060104587Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: ApplicationFiled: December 20, 2005Publication date: May 18, 2006Inventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
-
Patent number: 7013055Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: GrantFiled: July 1, 2003Date of Patent: March 14, 2006Assignee: Omron CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
-
Patent number: 6957006Abstract: An optical element that realizes light path conversion of transmitting light at low loss, allows easy incorporation of functions such as light convergence or the like, and can be easily made into a compact size includes upper and lower main surfaces of a light path converting element of a plane shape are facing each other, and a light incoming surface and a light outgoing surface are adjacent surfaces at about 90 degrees. A curved light path converting surface is formed so as to face the light incoming surface and the light outgoing surface. Light coming in from the light incoming surface repeats full reflection between the upper main surface and the lower main surface and goes on, and is reflected by the light path converting surface, thereby the light path thereof is converted, and light is ejected from the light outgoing surface.Type: GrantFiled: February 14, 2003Date of Patent: October 18, 2005Assignee: Omron CorporationInventors: Yukari Terakawa, Hayami Hosokawa, Yasunari Kitajima, Toshifumi Sumino, Yoshihisa Ishida
-
Publication number: 20050212089Abstract: On a front wall of a mold resin (13) sealing a light emitter (12), a direct emission region (18), through which the light emitted from the light emitter (12) directly passes to the outside, and a total reflection region (19), by which the light emitted from the light emitter (12) is totally reflected, are formed. The direct emission region (18) is formed into a shape of a convex lens. A light reflection portion (20) which is made of a concave mirror is provided on the rear face of the mold resin (13). When a part of the light emitted from the light emitter (12) passes through the direct emission region (18), it is affected by the lens to be emitted to the front direction. After another part of the light emitted from the light emitter (12) is totally reflected by the total reflection region (19), it is reflected by the light reflection portion (20) to be emitted to the front direction through the total reflection region (19).Type: ApplicationFiled: May 23, 2005Publication date: September 29, 2005Applicant: OMRON CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
-
Patent number: 6950588Abstract: An optical wave guide has a lower cladding layer formed on a substrate, and a Y-branched optical wave guide arranged on the lower cladding layer. The optical wave guide is covered with an upper cladding layer. Curved portions of the optical wave guide are tapered at the external circumferential sides and formed into a trapezoidal cross sectional shape, and effective refractive index of the optical wave guide is made small at the tapered external circumferential sides. Meanwhile, end surfaces of the optical wave guide are formed into a rectangular shape, thereby joint efficiency with optical fibers is increased.Type: GrantFiled: February 18, 2003Date of Patent: September 27, 2005Assignee: Omron CorporationInventors: Yukari Terakawa, Hayami Hosokawa