Abstract: To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board includes a substrate including a hole portion that penetrates the substrate in a plate thickness direction, and a connector region including a first conductor layer that closes one side of the hole portion, liquid metal disposed in a recess formed by the hole portion and the first conductor layer, and a sealing layer that is the liquid metal cured on a liquid surface side. The liquid metal may be in contact with a second conductor layer formed in the recess.

Abstract: To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board 100 includes a substrate 101 including a hole portion 110 that penetrates the substrate 101 in a plate thickness direction, and a connector region including a first conductor layer 202 that closes one side of the hole portion 110, liquid metal 210 disposed in a recess 201 formed by the hole portion 110 and the first conductor layer 202, and a sealing layer 212 that is the liquid metal 210 cured on a liquid surface side. The liquid metal 210 may be in contact with a second conductor layer 204 formed in the recess 201.