Patents by Inventor Yuki Ebihara
Yuki Ebihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11805638Abstract: Apparatuses including a first-in first-out circuit are described. An example apparatus includes: a first-in first-out circuit including a first latch, a second latch and a logic circuit coupled in series. The first latch receives first data and latches the first data responsive to a first input pointer signal. The second latch receives the latched first data from the first latch and latches the received first data responsive to a second input pointer signal that has a different phase from the first input pointer signal and thus provides a second data. The logic circuit receives the second data and an output pointer signal and further provides an output data responsive to the output pointer signal.Type: GrantFiled: March 15, 2021Date of Patent: October 31, 2023Inventors: Seiji Narui, Yuki Ebihara
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Publication number: 20210225848Abstract: Apparatuses including a first-in first-out circuit are described. An example apparatus includes: a first-in first-out circuit including a first latch, a second latch and a logic circuit coupled in series. The first latch receives first data and latches the first data responsive to a first input pointer signal. The second latch receives the latched first data from the first latch and latches the received first data responsive to a second input pointer signal that has a different phase from the first input pointer signal and thus provides a second data. The logic circuit receives the second data and an output pointer signal and further provides an output data responsive to the output pointer signal.Type: ApplicationFiled: March 15, 2021Publication date: July 22, 2021Applicant: Micron Technology, Inc.Inventors: Seiji Narui, Yuki Ebihara
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Patent number: 10964702Abstract: Apparatuses including a first-in first-out circuit are described. An example apparatus includes: a first-in first-out circuit including a first latch, a second latch and a logic circuit coupled in series. The first latch receives first data and latches the first data responsive to a first input pointer signal. The second latch receives the latched first data from the first latch and latches the received first data responsive to a second input pointer signal that has a different phase from the first input pointer signal and thus provides a second data. The logic circuit receives the second data and an output pointer signal and further provides an output data responsive to the output pointer signal.Type: GrantFiled: October 17, 2018Date of Patent: March 30, 2021Assignee: Micron Technology, Inc.Inventors: Seiji Narui, Yuki Ebihara
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Patent number: 10922262Abstract: Apparatuses and methods of data transmission between semiconductor chips are described. An example apparatus includes: a data bus inversion (DBI) circuit that receives first, second and third input data in order, and further provides first, second and third output data, either with or without data bus inversion. The DBI circuit includes a first circuit that latches the first input data and the third input data; a second circuit that latches the second input data; a first DBI calculator circuit that performs first DBI calculation on the latched first input data and the latched second input data responsive to the first circuit latching the first input data and the second circuit latching the second input data, respectively; and a second DBI calculator circuit that performs second DBI calculation on the latched second data and the latched third input data responsive to the first circuit latching the third input data.Type: GrantFiled: April 3, 2020Date of Patent: February 16, 2021Assignee: Micron Technology, Inc.Inventors: Yuki Ebihara, Seiji Narui
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Patent number: 10854310Abstract: Apparatuses and methods for an interface chip that interfaces with chips are described. An example apparatus includes: first terminals; circuit groups, each of the circuit groups including circuit blocks being configured to electrically couple to the first terminals; a control circuit that selects one of the circuit groups and electrically couple the first terminals to the circuit blocks of the one of the circuit groups; terminal groups, each of the terminal groups including second terminals, each of the terminal groups being provided correspondingly to each of the circuit groups, the second terminals of each of the terminal groups being smaller in number than the circuit blocks of a corresponding one of the circuit groups; and a remapping circuit that couples the second terminals of each of the terminal groups to selected ones of the circuit blocks of the corresponding one of the circuit groups.Type: GrantFiled: June 10, 2019Date of Patent: December 1, 2020Assignee: Micron Technology, Inc.Inventors: Chiaki Dono, Taihei Shido, Yuki Ebihara
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Publication number: 20200233828Abstract: Apparatuses and methods of data transmission between semiconductor chips are described. An example apparatus includes: a data bus inversion (DBI) circuit that receives first, second and third input data in order, and further provides first, second and third output data, either with or without data bus inversion. The DBI circuit includes a first circuit that latches the first input data and the third input data; a second circuit that latches the second input data; a first DBI calculator circuit that performs first DBI calculation on the latched first input data and the latched second input data responsive to the first circuit latching the first input data and the second circuit latching the second input data, respectively; and a second DBI calculator circuit that performs second DBI calculation on the latched second data and the latched third input data responsive to the first circuit latching the third input data.Type: ApplicationFiled: April 3, 2020Publication date: July 23, 2020Applicant: Micron Technology, Inc.Inventors: Yuki Ebihara, Seiji Narui
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Patent number: 10664432Abstract: Apparatuses and methods of data transmission between semiconductor chips are described. An example apparatus includes: a data bus inversion (DBI) circuit that receives first, second and third input data in order, and further provides first, second and third output data, either with or without data bus inversion. The DBI circuit includes a first circuit that latches the first input data and the third input data; a second circuit that latches the second input data; a first DBI calculator circuit that performs first DBI calculation on the latched first input data and the latched second input data responsive to the first circuit latching the first input data and the second circuit latching the second input data, respectively; and a second DBI calculator circuit that performs second DBI calculation on the latched second data and the latched third input data responsive to the first circuit latching the third input data.Type: GrantFiled: May 23, 2018Date of Patent: May 26, 2020Assignee: Micron Technology, Inc.Inventors: Yuki Ebihara, Seiji Narui
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Publication number: 20200126993Abstract: Apparatuses including a first-in first-out circuit are described. An example apparatus includes: a first-in first-out circuit including a first latch, a second latch and a logic circuit coupled in series. The first latch receives first data and latches the first data responsive to a first input pointer signal. The second latch receives the latched first data from the first latch and latches the received first data responsive to a second input pointer signal that has a different phase from the first input pointer signal and thus provides a second data. The logic circuit receives the second data and an output pointer signal and further provides an output data responsive to the output pointer signal.Type: ApplicationFiled: October 17, 2018Publication date: April 23, 2020Applicant: Micron Technology, Inc.Inventors: Seiji Narui, Yuki Ebihara
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Patent number: 10614024Abstract: Apparatuses and methods of data transmission between semiconductor chips are described. An example apparatus includes: a data bus inversion (DBI) circuit that receives first, second and third input data in order, and further provides first, second and third output data, either with or without data bus inversion. The DBI circuit includes a first circuit that latches the first input data and the third input data; a second circuit that latches the second input data; a first DBI calculator circuit that performs first DBI calculation on the latched first input data and the latched second input data responsive to the first circuit latching the first input data and the second circuit latching the second input data, respectively; and a second DBI calculator circuit that performs second DBI calculation on the latched second data and the latched third input data responsive to the first circuit latching the third input data.Type: GrantFiled: May 23, 2018Date of Patent: April 7, 2020Assignee: Micron Technology, Inc.Inventors: Yuki Ebihara, Seiji Narui
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Publication number: 20190361835Abstract: Apparatuses and methods of data transmission between semiconductor chips are described. An example apparatus includes: a data bus inversion (DBI) circuit that receives first, second and third input data in order, and further provides first, second and third output data, either with or without data bus inversion. The DBI circuit includes a first circuit that latches the first input data and the third input data; a second circuit that latches the second input data; a first DBI calculator circuit that performs first DBI calculation on the latched first input data and the latched second input data responsive to the first circuit latching the first input data and the second circuit latching the second input data, respectively; and a second DBI calculator circuit that performs second DBI calculation on the latched second data and the latched third input data responsive to the first circuit latching the third input data.Type: ApplicationFiled: May 23, 2018Publication date: November 28, 2019Applicant: Micron Technology, Inc.Inventors: Yuki Ebihara, Seiji Narui
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Patent number: 10468114Abstract: Apparatuses and methods for an interface chip that interfaces with chips are described. An example apparatus includes: first terminals; circuit groups, each of the circuit groups including circuit blocks being configured to electrically couple to the first terminals; a control circuit that selects one of the circuit groups and electrically couple the first terminals to the circuit blocks of the one of the circuit groups; terminal groups, each of the terminal groups including second terminals, each of the terminal groups being provided correspondingly to each of the circuit groups, the second terminals of each of the terminal groups being smaller in number than the circuit blocks of a corresponding one of the circuit groups; and a remapping circuit that couples the second terminals of each of the terminal groups to selected ones of the circuit blocks of the corresponding one of the circuit groups.Type: GrantFiled: June 20, 2018Date of Patent: November 5, 2019Assignee: Micron Technology, Inc.Inventors: Chiaki Dono, Taihei Shido, Yuki Ebihara
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Publication number: 20190295679Abstract: Apparatuses and methods for an interface chip that interfaces with chips are described. An example apparatus includes: first terminals; circuit groups, each of the circuit groups including circuit blocks being configured to electrically couple to the first terminals; a control circuit that selects one of the circuit groups and electrically couple the first terminals to the circuit blocks of the one of the circuit groups; terminal groups, each of the terminal groups including second terminals, each of the terminal groups being provided correspondingly to each of the circuit groups, the second terminals of each of the terminal groups being smaller in number than the circuit blocks of a corresponding one of the circuit groups; and a remapping circuit that couples the second terminals of each of the terminal groups to selected ones of the circuit blocks of the corresponding one of the circuit groups.Type: ApplicationFiled: June 10, 2019Publication date: September 26, 2019Applicant: Micron Technology, Inc.Inventors: Chiaki Dono, Taihei Shido, Yuki Ebihara
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Publication number: 20180301202Abstract: Apparatuses and methods for an interface chip that interfaces with chips are described. An example apparatus includes: first terminals; circuit groups, each of the circuit groups including circuit blocks being configured to electrically couple to the first terminals; a control circuit that selects one of the circuit groups and electrically couple the first terminals to the circuit blocks of the one of the circuit groups; terminal groups, each of the terminal groups including second terminals, each of the terminal groups being provided correspondingly to each of the circuit groups, the second terminals of each of the terminal groups being smaller in number than the circuit blocks of a corresponding one of the circuit groups; and a remapping circuit that couples the second terminals of each of the terminal groups to selected ones of the circuit blocks of the corresponding one of the circuit groups.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Applicant: Micron Technology, Inc.Inventors: Chiaki Dono, Taihei Shido, Yuki Ebihara
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Patent number: 10008287Abstract: Apparatuses and methods for an interface chip are described. An example apparatus includes a first chip. The first chip includes, on a single semiconductor substrate, first terminals, circuit groups, and terminal groups corresponding to the circuit groups, each of the circuit groups including circuit blocks. A control circuit in the first chip selects one of the circuit groups and electrically couples the first terminals to the circuit blocks of the selected circuit group. Second terminals are included in each of the terminal groups. A number of all of the second terminals in each of the terminal groups is smaller than a number of all of the circuit blocks in the corresponding circuit group. The first chip further includes, for example, a remapping circuit.Type: GrantFiled: July 22, 2016Date of Patent: June 26, 2018Assignee: Micron Technology, Inc.Inventors: Chiaki Dono, Taihei Shido, Yuki Ebihara
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Publication number: 20180025789Abstract: Apparatuses and methods for an interface chip that interfaces with chips are described. An example apparatus includes: first terminals; circuit groups, each of the circuit groups including circuit blocks being configured to electrically couple to the first terminals; a control circuit that selects one of the circuit groups and electrically couple the first terminals to the circuit blocks of the one of the circuit groups; terminal groups, each of the terminal groups including second terminals, each of the terminal groups being provided correspondingly to each of the circuit groups, the second terminals of each of the terminal groups being smaller in number than the circuit blocks of a corresponding one of the circuit groups; and a remapping circuit that couples the second terminals of each of the terminal groups to selected ones of the circuit blocks of the corresponding one of the circuit groups.Type: ApplicationFiled: July 22, 2016Publication date: January 25, 2018Applicant: Micron Technology, Inc.Inventors: Chiaki Dono, Taihei Shido, Yuki Ebihara