Abstract: The function input means 71 accepts input of a cost function that calculates a cost incurred in at least one of a selection of a candidate relay point and a design of a route, the cost function being represented as a linear sum of terms weighted by degree of importance attached to each of the features that an expert is assumed to intend when selecting the candidate relay point and design of the route. The learning means 72 learns the cost function by inverse reinforcement learning using training data that includes relay point information which is data that maps information indicating a relay point with surrounding information of the relay point and usage information of the relay point, and route result information which is result data of a route that pass through each relay point.

Abstract: To provide a tubular container which has non-absorbing properties with respect to contents as well as gas barrier properties. A tubular container 1 comprises at least an outlet unit 20 provided with an outlet part 21 through which contents are dispensed and a shoulder part 24 that extends radially outward from the outlet part 21; and a body part 10 that is welded to the shoulder part 24 of the outlet unit 20 and stores the contents therein, wherein the body part 10 comprises at least an innermost layer formed from a non-absorbing resin on an inner side that comes into contact with the contents, an outermost layer formed on an outermost side, and an intermediate layer formed between the innermost layer and the outermost layer and including a gas barrier layer. This tubular container 1 is characterized by a structural form wherein all surfaces coming into contact with the contents are formed from a non-absorbing resin or a structural form with a transparent body part including a gas barrier layer.

Abstract: To provide a tubular container which has non-absorbing properties with respect to contents as well as gas barrier properties. A tubular container 1 comprises at least an outlet unit 20 provided with an outlet part 21 through which contents are dispensed and a shoulder part 24 that extends radially outward from the outlet part 21; and a body part 10 that is welded to the shoulder part 24 of the outlet unit 20 and stores the contents therein, wherein the body part 10 comprises at least an innermost layer formed from a non-absorbing resin on an inner side that comes into contact with the contents, an outermost layer formed on an outermost side, and an intermediate layer formed between the innermost layer and the outermost layer and including a gas barrier layer. This tubular container 1 is characterized by a structural form wherein all surfaces coming into contact with the contents are formed from a non-absorbing resin or a structural form with a transparent body part including a gas barrier layer.

Abstract: The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Abstract: To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

Abstract: To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

Abstract: The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Abstract: An adhesive sheet includes a base film, an anchor coat layer including a compound having an energy ray polymerizable group, and an energy ray curable adhesive layer that are stacked in this order.