Abstract: A circuit structure of the present disclosure includes: a heat-generating member; at least one connection conductor; at least one insulative heat transfer member; and an insulative base member. The heat-generating member generates heat as a result of being energized, the connection conductor is connected to the heat-generating member in a heat-transferable state, the heat transfer member is formed in the shape of a heat-transferable sheet, the base member includes a base main body and a positioning portion, the base main body, together with the connection conductor, sandwiches the heat transfer member, and the positioning portion is formed so as to protrude from the base main body, and positions the connection conductor relative to the base main body as a result of coming into contact with the connection conductor.

Abstract: A relay unit includes: bus bars serving as conductive paths; relays including contact portions for turning on and off energization of the bus bars, and a plurality of terminals connected to the contact portions, the bus bars being fixed to the terminals; and heat dissipation members that are fixed to the terminals of the relays, receive heat of the terminals, and dissipate the heat.

Abstract: A conduction path includes: a wire that has a circular cross section and includes a conductive body having an outer periphery covered by an insulating cover; a routing member that includes a routing groove in which the wire is routed; and a cover that is configured to be attached to the routing member and to cover the routing groove, wherein a curved surface having a curvature radius that is larger than the radius of the wire is formed in an inner surface of the routing groove, and in a state in which the cover is attached to the routing member, a distance between the cover and the inner surface of the routing groove in a direction that is perpendicular to an inward surface of the cover is the same length as the diameter of the wire.

Abstract: A first busbar includes a first electrical connection portion that is electrically connected to a main relay, a first heat transfer connection portion that is thermally connected to the insulating plate, and a first detour portion that connects the first electrical connection portion and the first heat transfer connection portion to each other. A second busbar includes a second electrical connection portion that is electrically connected to the main relay , a second heat transfer connection portion that is thermally connected to the insulating plate, and a lateral detour portion and a lower detour portion that connect the second electrical connection portion and the second heat transfer connection portion to each other.

Abstract: The invention provides: an exhaust-gas-purifying metal substrate capable of achieving both low pressure loss and high purification performance; and an exhaust gas purification device using the metal substrate. The invention relates to an exhaust-gas-purifying perforated metal substrate in which a corrugated foil and a flat foil are layered and made into a cylindrical shape, wherein: the perforated metal substrate includes from 50/in2 to 800/in2 of cells; the corrugated foil includes a plurality of first holes having an area that is from 2.0 to 50 times the average opening area of the cells; the flat foil includes a plurality of second holes having an area that is from 3.0 to 100 times the average opening area of the cells; and the average value of the area of the first holes in the corrugated foil is smaller than the average value of the area of the second holes in the flat foil.

Abstract: A conduction path includes: a wire that has a circular cross section and includes a conductive body having an outer periphery covered by an insulating cover; a routing member that includes a routing groove in which the wire is routed; and a cover that is configured to be attached to the routing member and to cover the routing groove, wherein a curved surface having a curvature radius that is larger than the radius of the wire is formed in an inner surface of the routing groove, and in a state in which the cover is attached to the routing member, a distance between the cover and the inner surface of the routing groove in a direction that is perpendicular to an inward surface of the cover is the same length as the diameter of the wire.

Abstract: The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissipation member that is provided on a side of the base member opposite to a side on which the relay is attached; a first busbar that is connected to the terminal of the relay at a position spaced apart from the base member; and a heat transfer member that is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole, and that comes into contact with the first busbar and the heat dissipation member.

Abstract: Provided is a technique that improves the heat dissipation properties of a wire that is arranged in a conduction path. A conduction path has a wire, a routing member that is made of a metal and has a routing groove in which the wire is routed, a bracket that is made of a metal and has a first mounting portion that is mounted to the routing member and has a second mounting portion that is mounted to an electrical connection box, and a heat transfer member that is made of a synthetic resin having a higher heat conductivity than air and is arranged in the routing groove and interposed between the wire and the routing member, in a region that corresponds to a portion of the routing member to which the first mounting portion is mounted.

Abstract: The invention provides: an exhaust-gas-purifying metal substrate capable of achieving both low pressure loss and high purification performance; and an exhaust gas purification device using the metal substrate. The invention relates to an exhaust-gas-purifying perforated metal substrate in which a corrugated foil and a flat foil are layered and made into a cylindrical shape, wherein: the perforated metal substrate includes from 50/in2 to 800/in2 of cells; the corrugated foil includes a plurality of first holes having an area that is from 2.0 to 50 times the average opening area of the cells; the flat foil includes a plurality of second holes having an area that is from 3.0 to 100 times the average opening area of the cells; and the average value of the area of the first holes in the corrugated foil is smaller than the average value of the area of the second holes in the flat foil.

Abstract: A relay unit includes: bus bars serving as conductive paths; relays including contact portions for turning on and off energization of the bus bars, and a plurality of terminals connected to the contact portions, the bus bars being fixed to the terminals; and heat dissipation members that are fixed to the terminals of the relays, receive heat of the terminals, and dissipate the heat.

Abstract: A carrier leakage correction method for a quadrature modulator according to an embodiment includes inputting a test signal with a frequency fBB to a transmitter and up-converting the test signal with a frequency fL0 and down-converting with the frequency fL0. A frequency 2fBB component is detected in the down-converted test signal. One or a plurality of parameters of the transmitter is/are adjusted so as to reduce a magnitude of the detected frequency 2fBB component in the test signal.

Abstract: Disclosed is a base plate structure for an electricity storage pack including an electricity storage module including a plurality of electricity storage elements, the base plate structure including: a unit base plate that has a shape having a plurality of sides in a plan view, and on which at least one electricity storage module is to be placed; and a wiring member that is to be connected to the electricity storage module. The unit base plate includes: a plurality of unit routing grooves configured to route the wiring member such that a routing direction of the wiring member can be changed; and a unit coupling portion that is formed on each of the sides, and that is configured to couple the unit base plate to another unit base plate.

Abstract: A control device for the component mounting machine is provided with an error detecting section configured to detect a pickup error in which the electronic component was not picked up during pickup operation; a recovery control section configured to perform recovery processing of picking up the electronic component by performing the pickup operation again in a case in which a quantity of the pickup errors that has occurred consecutively during multiple attempts at the pickup operation is less than a threshold value; a tape management section configured to acquire a remaining amount of the carrier tape at the feeder; and a threshold changing section configured to change the threshold value in accordance with the acquired remaining amount of the carrier tape.

Abstract: Provided is a technique that improves the heat dissipation properties of a wire that is arranged in a conduction path. A conduction path has a wire, a routing member that is made of a metal and has a routing groove in which the wire is routed, a bracket that is made of a metal and has a first mounting portion that is mounted to the routing member and has a second mounting portion that is mounted to an electrical connection box, and a heat transfer member that is made of a synthetic resin having a higher heat conductivity than air and is arranged in the routing groove and interposed between the wire and the routing member, in a region that corresponds to a portion of the routing member to which the first mounting portion is mounted.

Abstract: The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissipation member that is provided on a side of the base member opposite to a side on which the relay is attached; a first busbar that is connected to the terminal of the relay at a position spaced apart from the base member; and a heat transfer member that is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole, and that comes into contact with the first busbar and the heat dissipation member.

Abstract: Provided is a feeder management device that appropriately controls editing of management information related to feeders so as to prevent electronic components of an incorrect type being supplied. The feeder management device includes: a data management section including management data in which a component type of an electronic component loaded on each of the feeders is linked to an identification code that specifies each of the multiple feeders; and an editing control section configured to determine whether editing is allowable based on a loading state of the electronic component on the feeder in a case in which editing of the management information is attempted to be performed in accordance with a change to the component type linked to the identification code of the feeder.

Abstract: According to an embodiment, a communication device includes a phase-shifting circuit that shifts a phase of a local signal and supplies it to an orthogonal demodulator. The phase-shifting circuit includes first and second signal input ends that are supplied with an output signal of a local oscillator between both ends thereof, a frequency divider that has first and second input ends, and a switching part that is provided between the first and second signal input ends and the first and second input ends of the frequency divider and switches connection between the first and second signal input ends and the first and second input ends of the frequency divider.

Abstract: A control device for the component mounting machine is provided with an error detecting section configured to detect a pickup error in which the electronic component was not picked up during pickup operation; a recovery control section configured to perform recovery processing of picking up the electronic component by performing the pickup operation again in a case in which a quantity of the pickup errors that has occurred consecutively during multiple attempts at the pickup operation is less than a threshold value; a tape management section configured to acquire a remaining amount of the carrier tape at the feeder; and a threshold changing section configured to change the threshold value in accordance with the acquired remaining amount of the carrier tape.

Abstract: A carrier leakage correction method for a quadrature modulator according to an embodiment includes inputting a test signal with a frequency fBB to a transmitter and up-converting the test signal with a frequency fL0 and down-converting with the frequency fL0. A frequency 2fBB component is detected in the down-converted test signal. One or a plurality of parameters of the transmitter is/are adjusted so as to reduce a magnitude of the detected frequency 2fBB component in the test signal.

Abstract: A carrier leakage correction method for a quadrature modulator according to an embodiment includes inputting a test signal with a frequency fBB to a transmitter and up-converting the test signal with a frequency fL0 and down-converting with the frequency fL0. A frequency 2fBB component is detected in the down-converted test signal. One or a plurality of parameters of the transmitter is/are adjusted so as to reduce a magnitude of the detected frequency 2fBB component in the test signal.