Abstract: A semiconductor device includes first and second processor cores configured to perform a lock step operation and including first and second scan chains. The semiconductor device further includes a scan test control unit that controls a scan test of the first and second processor cores using the first and second scan chains, and a start-up control unit that outputs a reset signal for bringing the first and second processor cores into a reset state. The start-up control unit outputs an initialization scan request before the start of a lock step operation, and the scan test control unit performs an initialization scan test operation on the first and second processor cores by using an initialization pattern.

Abstract: The present invention provides a Co-free heat-resistant alloy for a hearth metal member that has properties superior to or equal to those of Co-containing heat resistant steel. The heat-resistant alloy for a hearth metal member according to the present invention is a heat-resistant alloy used in a hearth metal member of a steel heating furnace, the heat resistant alloy containing: 0.05% to 0.5% of C; more than 0% and 0.95% or less of Si, where 0.05%?C+Si?1.0%; more than 0% and 1.0% or less of Mn; 40% to 50% of Ni; 25% to 35% of Cr; 1.0% to 3.0% of W; and 10% or more of Fe and inevitable impurities as the balance, with all percentages being in mass %. The heat-resistant alloy for a hearth metal member may further contain 0.05% to 0.5% of Ti and/or 0.02% to 1.0% of Zr, with all percentages being in mass %.

Abstract: The present invention provides a Co-free heat-resistant alloy for a hearth metal member that has properties superior to or equal to those of Co-containing heat resistant steel. The heat-resistant alloy for a hearth metal member according to the present invention is a heat-resistant alloy used in a hearth metal member of a steel heating furnace, the heat resistant alloy containing: 0.05% to 0.5% of C; more than 0% and 0.95% or less of Si, where 0.05% ?C+Si?1.0%; more than 0% and 1.0% or less of Mn; 40% to 50% of Ni; 25% to 35% of Cr; 1.0% to 3.0% of W; and 10% or more of Fe and inevitable impurities as the balance, with all percentages being in mass %. The heat-resistant alloy for a hearth metal member may further contain 0.05% to 0.5% of Ti and/or 0.02% to 1.

Abstract: A method for producing polyethylene-based resin foamed particles includes a first-step foaming process. The first-step foaming process includes: producing an aqueous dispersion by dispersing polyethylene-based resin particles in an aqueous dispersing medium in a sealed vessel, adding a carbon dioxide-containing foaming agent to the aqueous dispersion in the sealed vessel, heating and pressurizing the aqueous dispersion in the sealed vessel, and releasing the aqueous dispersion in the sealed vessel to a pressure region where a pressure is lower than an internal pressure of the sealed vessel. The foaming ratio in the first-step foaming process is 10 to 18 times. The polyethylene-based resin particles have a polyethylene-based base resin and a melting point of 105 to 125° C., a tan ? of 0.3 to 0.7, and a complex viscosity of 5000 to 20000 Pa·s.

Abstract: A method of producing a polyethylene resin expanded molded product includes filling a mold with expanded polyethylene resin particles, wherein an internal pressure of 0.12 to 0.16 MPa is applied to the expanded polyethylene resin particles in the mold, and forming the polyethylene resin expanded molded product by heating the expanded polyethylene resin particles and fusing the expanded polyethylene resin particles. The expanded polyethylene resin particles includes 100 parts by weight of a polyethylene resin, 0.08 to 0.25 parts by weight of a cell nucleating agent, 0.3 to 0.8 parts by weight of a polyhydric alcohol fatty acid ester, and 0.01 to 10 parts by weight of a hydrophilic compound, each of the expanded polyethylene resin particles having a weight of 2.5 to 3.5 mg. The polyethylene resin expanded molded product has a density of 0.017 to 0.021 g/cm3 and a thickness of 10 to 40 mm.

Abstract: A method of producing a polyethylene resin expanded molded product includes filling a mold with expanded polyethylene resin particles, wherein an internal pressure of 0.12 to 0.16 MPa is applied to the expanded polyethylene resin particles in the mold, and forming the polyethylene resin expanded molded product by heating the expanded polyethylene resin particles and fusing the expanded polyethylene resin particles. The expanded polyethylene resin particles includes 100 parts by weight of a polyethylene resin, 0.08 to 0.25 parts by weight of a cell nucleating agent, 0.3 to 0.8 parts by weight of a polyhydric alcohol fatty acid ester, and 0.01 to 10 parts by weight of a hydrophilic compound, each of the expanded polyethylene resin particles having a weight of 2.5 to 3.5 mg. The polyethylene resin expanded molded product has a density of 0.017 to 0.021 g/cm3 and a thickness of 10 to 40 mm.