Patents by Inventor Yuki HIWATASHI

Yuki HIWATASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230174776
    Abstract: A resin composition that is laser-weldable under broad conditions of laser irradiation. A formed article formed of the resin composition. A kit for Galvano-scanning laser welding with a transmissive resin composition and a light-absorptive resin composition. A car-borne camera component formed of the resin composition. A car-borne camera module with the car-borne camera component. A UV exposed article formed of the resin composition. A method for manufacturing a formed article by welding a transmissive resin member and an absorptive resin member by Galvano-scanning laser welding. The resin composition for Galvano-scanning laser welding, contains 0.1 to 20 parts by mass of a reactive compound, per 100 parts by mass of a thermoplastic resin.
    Type: Application
    Filed: May 7, 2021
    Publication date: June 8, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Yuki HIWATASHI, Rina TAKEUCHI
  • Publication number: 20230159745
    Abstract: A resin composition may suppress color fading after a weathering test and excel in heat resistance. A formed article may use of such resin composition, as may a kit, a car-borne camera component, a car-borne camera module. A resin composition may include: per 100 parts by mass of a resin component that contains 50 to 95% by mass of a polybutylene terephthalate resin (A), and 5 to 50% by mass of a thermoplastic resin (B) that demonstrates a glass transition temperature, measured with use of a differential scanning calorimeter, higher by 15 to 150° C. than that of the polybutylene terephthalate resin (A); 0.001 to 5 parts by mass of a dye; and 5 to 100 parts by mass of an inorganic filler.
    Type: Application
    Filed: May 7, 2021
    Publication date: May 25, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventor: Yuki HIWATASHI
  • Patent number: 11441031
    Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: September 13, 2022
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke Yamada, Tatsuya Kikuchi, Yuki Hiwatashi
  • Patent number: 11390037
    Abstract: Regarding a laser welded body in which a laser transmissive/absorptive molding member containing a PBT-based material and a laser absorptive molding member containing a PBT-based material are integrated with each other by laser welding, the following laser welded body is proposed as a laser welded body in which a bond strength can be further increased. A laser welded body having a structure in which a member I and a member II are integrally bonded to each other, the member I contains 0.0005 to 5.0 parts by mass, with respect to 100 parts by mass of a polyester-based resin A, of a laser transmissive/absorptive coloring material capable of transmitting and absorbing laser beam, and the polyester-based resin A contains at least a polybutylene terephthalate copolymer resin, the member II contains 0.15 to 10.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 19, 2022
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Akihiro Oka, Yuki Hiwatashi, Yasushi Yamanaka
  • Publication number: 20210032461
    Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.
    Type: Application
    Filed: February 25, 2019
    Publication date: February 4, 2021
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke YAMADA, Tatsuya KIKUCHI, Yuki HIWATASHI
  • Publication number: 20200307112
    Abstract: Regarding a laser welded body in which a laser transmissive/absorptive molding member containing a PBT-based material and a laser absorptive molding member containing a PBT-based material are integrated with each other by laser welding, the following laser welded body is proposed as a laser welded body in which a bond strength can be further increased. A laser welded body having a structure in which a member I and a member II are integrally bonded to each other, the member I contains 0.0005 to 5.0 parts by mass, with respect to 100 parts by mass of a polyester-based resin A, of a laser transmissive/absorptive coloring material capable of transmitting and absorbing laser beam, and the polyester-based resin A contains at least a polybutylene terephthalate copolymer resin, the member II contains 0.15 to 10.
    Type: Application
    Filed: October 30, 2018
    Publication date: October 1, 2020
    Applicant: Mitsubishi Engineering-Plastics Corporation
    Inventors: Akihiro OKA, Yuki HIWATASHI, Yasushi YAMANAKA
  • Publication number: 20200224028
    Abstract: Provided is a thermoplastic resin composition capable of yielding a resin molding well suppressed from warping after heating, while successfully maintaining high mechanical strength, and such resin molding. Provided is a thermoplastic resin composition containing LDS and capable of yielding a resin molding on which a plating layer can be formed, and, well suppressed from warping after heating while successfully maintaining high mechanical strength, such resin molding, and methods for manufacturing a plated resin molding and a portable electronic device part. The thermoplastic resin composition containing 10 to 100 parts by mass of a reinforcing filler, per 100 parts by mass of a crystalline thermoplastic resin, the reinforcing filler containing a reinforcing fiber and a glass flake having a thickness of 0.1 to 2 ?m, with reinforcing fiber/glass flake, which is mass ratio of the reinforcing fiber and the glass flake, adjusted to 0.1 to 1.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 16, 2020
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke YAMADA, Yuki HIWATASHI