Patents by Inventor Yuki HOGA

Yuki HOGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for curing adhesive composition and method for manufacturing bonded structure
    Patent number: 11773296
    Abstract: A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: October 3, 2023
    Assignee: OMRON Corporation
    Inventors: Takekazu Komori, Daisuke Sato, Kyoji Kitamura, Yosuke Tatsuno, Yuki Hoga
  • METHOD FOR CURING ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING BONDED STRUCTURE
    Publication number: 20200140720
    Abstract: A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.
    Type: Application
    Filed: February 16, 2018
    Publication date: May 7, 2020
    Applicant: OMRON Corporation
    Inventors: Takekazu KOMORI, Daisuke SATO, Kyoji KITAMURA, Yosuke TATSUNO, Yuki HOGA