Patents by Inventor Yuki HORIKAWA

Yuki HORIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072239
    Abstract: A laminated body contains a first metal layer containing copper and a second metal layer containing nickel and directly laminated on the first metal layer. A full width at half maximum of an X-ray diffraction peak having the maximum intensity among at least one X-ray diffraction peak derived from a nickel-containing crystal in the second metal layer is 0.3° or more and 1.2° or less.
    Type: Application
    Filed: December 13, 2021
    Publication date: February 29, 2024
    Applicant: TDK CORPORATION
    Inventors: Yuhei HORIKAWA, Makoto ENDO, Takuya KAKIUCHI, Miyuki YANAGIDA, Yuki NAITO, Takahiro TASHIRO
  • Publication number: 20230341281
    Abstract: A semiconductor pressure sensor includes a first silicon substrate and a second silicon substrate. One main surface of the second silicon substrate has a recess formed therein. The recess has a support that protrudes toward the first silicon substrate formed therein. The support includes four side parts that are arranged to form a rectangular frame shape. The recess and the first silicon substrate have an inner cavity and an outer cavity that are formed therebetween. The inner cavity is arranged on an inner side of the support, and the outer cavity is arranged on an outer side of the support. The other main surface of the first silicon substrate has piezoresistive elements formed therein. The piezoresistive elements are arranged at or in the vicinity of a position overlapping the support, as seen from a normal direction of the first silicon substrate.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 26, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuki HORIKAWA, Hirofumi KONISHI, Fusako TANABE, Mayumi FUJIWARA