Abstract: An ammonia manufacturing apparatus includes: an ammonia synthesis unit synthesizing ammonia under a chemical reaction using hydrogen and nitrogen as a raw material gas in a reactor; and a heat storage unit including a heating medium. The heat storage unit can supply heat from the heating medium to the ammonia synthesis unit when an amount of the raw material gas supplied to the ammonia synthesis unit increases.

Abstract: A resolver stator is a resolver stator to be applied to a variable reluctance resolver. The resolver stator includes a plurality of magnetic poles and three winding wires (an excitation winding wire, a first detection winding wire, and a second detection winding wire). The plurality of magnetic poles are annularly arranged in an alignment. Each of the three winding wires is wound around each of the plurality of magnetic poles while being circulated along the alignment of the plurality of magnetic poles. One of the clockwise direction and the counterclockwise direction is the first turning direction, and the other of the clockwise direction and the counterclockwise direction is the second turning direction. At least one winding wire of the three winding wires wraps around each of the plurality of magnetic poles in a second turning direction while orbiting along the plurality of magnetic poles in the first turning direction.

Abstract: The plant control method includes the following. Calculating a first reference amount to be supplied for an amount of hydrogen to be supplied to a second production device (40). Making a decision on whether or not the amount of remaining hydrogen in a storage device (20) at the beginning of a subject term falls within a reference range.

Abstract: Included are: a raw material component storage unit that stores the raw material component supplied to the ammonia synthesis unit; a high-pressure raw material component storage unit that stores the raw material component at a pressure higher than a pressure at which the raw material component is stored in the raw material component storage unit; and a surplus electric power processing unit including a high-pressure raw material component transfer unit that boosts and transfers the raw material component from the raw material component storage unit to the high-pressure raw material component storage unit, and an expander that converts pressure energy of the raw material component supplied from the high-pressure raw material component storage unit into motive power to generate power.

Abstract: The plant control method includes the following. Calculating a first reference amount to be supplied for an amount of hydrogen to be supplied to a second production device (40). Making a decision on whether or not the amount of remaining hydrogen in a storage device (20) at the beginning of a subject term falls within a reference range.

Abstract: This cured film-forming resin composition is characterized in comprising: as a component (A), a polymer containing a structural unit derived from a first monomer having the structure with formula (1); a photoacid generator as a component (B); fine particles as a component (C); and a solvent (in the formula, R1 represents hydrogen or a methyl group and R2 represents an organic group capable of undergoing elimination with the oxygen atom bonded thereto). The cured film-forming resin composition forms a cured film that has solvent resistance to organic solvents and a high liquid repellency (lyophobicity) wherein the lyophilicity/lyophobicity can be easily varied using small ultraviolet exposure doses and the lyophilic areas have a high lyophilicity even for high surface tension liquids.

Abstract: An electronic device includes a bus bar that includes a first terminal and a second terminal and extends between the first terminal and the second terminal on a side of a first surface of a substrate; first solder configured to pass through the substrate in a thickness direction and connect a first through terminal connected to a first electronic component that is disposed on a second surface side of the substrate and the first terminal; and second solder configured to pass through the substrate in the thickness direction and connect a second through terminal connected to a second electronic component disposed on the second surface side of the substrate and the second terminal.

Abstract: Included are: a raw material component storage unit that stores the raw material component supplied to the ammonia synthesis unit; a high-pressure raw material component storage unit that stores the raw material component at a pressure higher than a pressure at which the raw material component is stored in the raw material component storage unit; and a surplus electric power processing unit including a high-pressure raw material component transfer unit that boosts and transfers the raw material component from the raw material component storage unit to the high-pressure raw material component storage unit, and an expander that converts pressure energy of the raw material component supplied from the high-pressure raw material component storage unit into motive power to generate power.

Abstract: An endoscope includes a grasp section. The grasp section includes: a first surface adjacent, in the longitudinal axis, to a surface where the bending operation knob is provided, a protruding portion radially outwardly protruding to the longitudinal axis at a position adjacent to the first surface around the longitudinal axis, a first inclined surface provided on the protruding portion at a side adjacent to the first surface and inclined to the first surface, and a second inclined surface which is provided, on the protruding portion, at a side opposite to the first inclined surface across the protruding portion, and which is inclined to the first surface.

Abstract: Provided are: a cured film-forming composition whereby a underlayer film for image formation formed from the composition exhibits high liquid repellency (lyophobicity) and lyophilic/liquid-repellent properties of the underlayer film can be easily changed even when exposed to a low amount of ultraviolet radiation; and a cured film obtained using the composition. The cured film-forming resin composition is characterized by containing: a polymer comprising a structural unit derived from a first monomer having the structure of formula (1) as component (A); a polymer other than component (A), which is a polymer in which the content of fluorine relative to the overall weight of the polymer is lower than in component (A), as component (B); a photoacid generator as component (C); and a solvent. (In the formula, R1 denotes hydrogen or a methyl group, and R2 denotes a fluorine-containing group able to be detached together with the oxygen atom bonded to R2.

Abstract: A near-infrared fluorescent probe has fluorescence in the near-infrared region. Like CaSiR-1, the probe has rhodamines as the fluorescent mother nucleus and accumulates in the cytoplasm. The probe makes it possible to visualize concentration fluctuations in metal ions, such as calcium ions, within the body.

Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Abstract: This cured film-forming resin composition is characterized in comprising: as a component (A), a polymer containing a structural unit derived from a first monomer having the structure with formula (1); a photoacid generator as a component (B); fine particles as a component (C); and a solvent (in the formula, R1 represents hydrogen or a methyl group and R2 represents an organic group capable of undergoing elimination with the oxygen atom bonded thereto). The cured film-forming resin composition forms a cured film that has solvent resistance to organic solvents and a high liquid repellency (lyophobicity) wherein the lyophilicity/lyophobicity can be easily varied using small ultraviolet exposure doses and the lyophilic areas have a high lyophilicity even for high surface tension liquids.

Abstract: An operation device for an into-bore introduction device, includes: a projecting portion formed to project from a grasping section in a radial direction to a longitudinal axis of the grasping section, in a surface between a surface on which a bending operation knob is disposed and a surface on which operator's palm abuts to grasp the grasping section, in the grasping section; a pressing switch disposed on the projecting portion; and an inclined surface formed distantly by as much as a predetermined distance from the pressing switch, and in which an amount of the inclined surface to project outside in the radial direction is decreased on an insertion section side of the projecting portion.

Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

Abstract: A BGA package substrate includes a substrate, a resist formed over the substrate and includes an opening, a land formed over the substrate in the opening, and a solder ball fused to the land, wherein the resist includes a notch at an edge of the opening through which the land is exposed, the notch having a bottom at a position lower than a surface of the land.

Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Abstract: Provided are: a cured film-forming composition whereby a underlayer film for image formation formed from the composition exhibits high liquid repellency (lyophobicity) and lyophilic/liquid-repellent properties of the underlayer film can be easily changed even when exposed to a low amount of ultraviolet radiation; and a cured film obtained using the composition. The cured film-forming resin composition is characterized by containing: a polymer comprising a structural unit derived from a first monomer having the structure of formula (1) as component (A); a polymer other than component (A), which is a polymer in which the content of fluorine relative to the overall weight of the polymer is lower than in component (A), as component (B); a photoacid generator as component (C); and a solvent. (In the formula, R1 denotes hydrogen or a methyl group, and R2 denotes a fluorine-containing group able to be detached together with the oxygen atom bonded to R2.

Abstract: A package substrate includes a substrate, a first connection terminal mounted over the substrate, the first connection terminal including a first land and a second land on the substrate, a first solder resist surrounding the first land and the second land, and a first solder ball formed straddling the first land and the second land; and a second connection terminal which is mounted over the substrate and disposed adjacent to the first connection terminal, the second connection terminal including a third land and a fourth land on the substrate, a second solder resist surrounding the third land and the fourth land, and a second solder ball formed straddling the third land and the fourth land.

Abstract: A BGA package substrate includes a substrate, a resist formed over the substrate and includes an opening, a land formed over the substrate in the opening, and a solder ball fused to the land, wherein the resist includes a notch at an edge of the opening through which the land is exposed, the notch having a bottom at a position lower than a surface of the land.