Abstract: Provided are a solder alloy, a solder ball, a solder preform, a solder paste, and a solder joint which have excellent wettability and high reliability by prevention of rupture of solder joints. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.8%, Cu: 0.4 to 0.8%, Sb: 0.03 to 2.90%, In: 1.1 to 4.2%, Ni: 0.01 to 0.14%, Bi: 0.1 to 5.0%, with the balance being Sn.

Abstract: An apparatus for processing a substrate includes a step of providing a substrate and a first step. In the step of providing a substrate, a substrate having a first film and a second film formed on the first film and having a pattern formed thereon is provided. In the first step, a protective film is formed on a side wall of the first film by a product generated by sputtering of the second film while a first processing gas is turned into plasma and the first film is etched simultaneously with the sputtering of the second film.

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: more than 0.008% and 0.020% or less, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

Abstract: An apparatus for processing a substrate includes a step of providing a substrate and a first step. In the step of providing a substrate, a substrate having a first film and a second film formed on the first film and having a pattern formed thereon is provided. In the first step, a protective film is formed on a side wall of the first film by a product generated by sputtering of the second film while a first processing gas is turned into plasma and the first film is etched simultaneously with the sputtering of the second film.

Abstract: A pump unit for a chromatograph includes a plunger pump and an upstream check valve. The plunger pump has a pump head and pumps a mobile phase. The upstream check valve is provided upstream of the pump head. The upstream check valve includes a flow-path portion and a temperature regulator. The flow-path portion guides the mobile phase to the plunger pump. The temperature regulator regulates a temperature of the mobile phase passing through the flow-path portion.

Abstract: The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.

Abstract: A detector for a liquid chromatograph, includes a detector that detects components in liquid, a pipe that guides liquid to the detector, a casing that contains at least part of the pipe and the detector and has a bottom portion, and a thermal insulator provided on the bottom portion in the casing, wherein a discharge port is provided in the bottom portion of the casing, the thermal insulator has an upper surface and a lower surface, a first opening is provided in the upper surface of the thermal insulator, and a second opening is provided in the lower surface of the thermal insulator to overlap with the discharge port in a plan view, a flow path that guides liquid from the first opening to the second opening is provided in the thermal insulator, and the flow path has a bend portion.

Abstract: A detector for a liquid chromatograph includes a detector that detects components in liquid, and a heat exchanger that adjusts a temperature of liquid introduced into the detector, wherein the heat exchanger includes a pipe having a winding portion, and a cast in which the winding portion is embedded, the pipe is formed of resin, and the cast is formed of an alloy having a melting point lower than a continuous use temperature of the resin.

Abstract: A detector (50) for a liquid chromatograph includes a tube (56) and a flow cell (52) arranged so that a mobile phase and a sample exiting from a column (10) in a liquid chromatograph (100) flow through the tube into the flow cell which is configured to allow for detection of a component in a sample flowing within the flow cell. The tube includes a first wetted member (56) made of a PEEK resin material. The flow cell has a passage surface formed by a second wetted member (521) including a non-metallic material having a lower electric resistivity than the first wetted member. The use of those wetted members facilitates the discharging of electric charges from the flow cell while preventing adsorption of sample components to the inner surface of the flow cell.

Abstract: A detector for a liquid chromatograph includes a detector that detects components in liquid, and a heat exchanger that adjusts a temperature of liquid introduced into the detector, wherein the heat exchanger includes a pipe having a winding portion, and a cast in which the winding portion is embedded, the pipe is formed of resin, and the cast is formed of an alloy having a melting point lower than a continuous use temperature of the resin.

Abstract: A detector for a liquid chromatograph, includes a detector that detects components in liquid, a pipe that guides liquid to the detector, a casing that contains at least part of the pipe and the detector and has a bottom portion, and a thermal insulator provided on the bottom portion in the casing, wherein a discharge port is provided in the bottom portion of the casing, the thermal insulator has an upper surface and a lower surface, a first opening is provided in the upper surface of the thermal insulator, and a second opening is provided in the lower surface of the thermal insulator to overlap with the discharge port in a plan view, a flow path that guides liquid from the first opening to the second opening is provided in the thermal insulator, and the flow path has a bend portion.

Abstract: A method for processing a substrate includes a step of providing a substrate and a first step. In the step of providing a substrate, a substrate having a first film and a second film formed on the first film and having a pattern formed thereon is provided. In the first step, a protective film is formed on a side wall of the first film by a product generated by sputtering of the second film while a first processing gas is turned into plasma and the first film is etched simultaneously with the sputtering of the second film.

Abstract: A method for processing a substrate includes a step of providing a substrate and a first step. In the step of providing a substrate, a substrate having a first film and a second film formed on the first film and having a pattern formed thereon is provided. In the first step, a protective film is formed on a side wall of the first film by a product generated by sputtering of the second film while a first processing gas is turned into plasma and the first film is etched simultaneously with the sputtering of the second film.

Abstract: A solder alloy has an alloy composition consisting of, in mass %, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La and Ce: 0.1% or less in total, with the balance being Sn. The alloy composition satisfies the following relationship (1): 2.93?{(Ge/Sn)+(Bi/Ge)}×(Bi/Sn) (1). In the relationship (1), each of Sn, Ge, and Bi represents the content (mass %) in the alloy composition.

Abstract: A method for processing a substrate includes a step of providing a substrate and a first step. In the step of providing a substrate, a substrate having a first film and a second film formed on the first film and having a pattern formed thereon is provided. In the first step, a protective film is formed on a side wall of the first film by a product generated by sputtering of the second film while a first processing gas is turned into plasma and the first film is etched simultaneously with the sputtering of the second film.

Abstract: A solder alloy has an alloy composition consisting of, in mass %, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La and Ce: 0.1% or less in total, with the balance being Sn. The alloy composition satisfies the following relationship (1): 2.93?{(Ge/Sn)+(Bi/Ge)}×(Bi/Sn) (1). In the relationship (1), each of Sn, Ge, and Bi represents the content (mass %) in the alloy composition.

Abstract: A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, and optionally Fe: 0.005 to 0.015% and P: 0.1% or less, with the balance being Sn.

Abstract: A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, and optionally Fe: 0.005 to 0.015% and P: 0.1% or less, with the balance being Sn.