Patents by Inventor Yuki IKEBE

Yuki IKEBE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
    Publication number: 20230170377
    Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
    Type: Application
    Filed: January 26, 2023
    Publication date: June 1, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masanari YAMAGUCHI, Taizo TAKACHI, Shunsuke FURUSE, Takashi OINOUE, Yuki IKEBE
  • Imaging device, manufacturing method, and substrate dividing method
    Patent number: 11587970
    Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: February 21, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masanari Yamaguchi, Taizo Takachi, Shunsuke Furuse, Takashi Oinoue, Yuki Ikebe
  • IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
    Publication number: 20200212087
    Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
    Type: Application
    Filed: March 11, 2020
    Publication date: July 2, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masanari YAMAGUCHI, Taizo TAKACHI, Shunsuke FURUSE, Takashi OINOUE, Yuki IKEBE
  • Imaging device, manufacturing method, and substrate dividing method
    Patent number: 10622404
    Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: April 14, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Masanari Yamaguchi, Taizo Takachi, Shunsuke Furuse, Takashi Oinoue, Yuki Ikebe
  • IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
    Publication number: 20180197906
    Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
    Type: Application
    Filed: July 19, 2016
    Publication date: July 12, 2018
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masanari YAMAGUCHI, Taizo TAKACHI, Shunsuke FURUSE, Takashi OINOUE, Yuki IKEBE