Abstract: An electronic apparatus has a housing in which a substrate with an electronic component mounted thereon, a thermoplastic hot-melt resin, and a substrate holding part are accommodated. The interior of the housing is divided by the substrate into a plurality of spaces. In the plurality of spaces, a distance between the substrate or the electronic component on the substrate and the substrate holding part, the housing, another substrate, or the electronic component on the another substrate is 0.3 mm to 1.5 mm.

Abstract: An electronic apparatus includes, in a case, substrates with electronic components mounted thereon, a thermoplastic hot-melt resin, and a fluid branch member, wherein: the inside of the case is divided into a plurality of spaces; the plurality of spaces are at least any space among spaces between the case and the substrates and spaces between the substrates, and are filled with the thermoplastic hot-melt resin; and the fluid branch member is provided with an opening as an inlet for the thermoplastic hot-melt resin, and flow path parts for branching the thermoplastic hot-melt resin into multiple parts and guiding the same.

Abstract: An electronic apparatus has a housing in which a substrate with an electronic component mounted thereon, a thermoplastic hot-melt resin, and a substrate holding part are accommodated. The interior of the housing is divided by the substrate into a plurality of spaces. In the plurality of spaces, a distance between the substrate or the electronic component on the substrate and the substrate holding part, the housing, another substrate, or the electronic component on the another substrate is 0.3 mm to 1.5 mm.