Abstract: A 1-butene/ethylene copolymer (A) satisfying the following requirements (A1) to (A5). (A1) a content of constituent units (i) derived from 1-butene is in a range of 70 to 99.9 mol %, and a content of constituent units (ii) derived from ethylene is in a range of 0.1 to 30 mol % [provided that a total of constituent units (i) and constituent units (ii) is 100 mol %]; (A2) an isotactic pentad fraction (mmmm) calculated by 13C-NMR is in a range of 80 to 99.9%; (A3) an intrinsic viscosity [?] measured in decalin at 135° C. is in a range of 0.7 to 2.0 dl/g; (A4) a melt flow rate (MFR) measured at 190° C. and a load of 2.16 kg in accordance with ASTM D1238 is 1 to 100 g/10 min; and (A5) a melting peak is not observed during second temperature raising in calorimetry with a differential scanning calorimeter (DSC).

Abstract: The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.

Abstract: The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.