Abstract: A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).

Abstract: A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).

Abstract: A sealant film including a layered film that includes a sealable resin layer including a heat seal layer (A) as a surface layer; and a base material layer (B), in which the sealable resin layer is formed of a resin layer having a 1% secant modulus of 200 MPa or less and has a thickness of 15 ?m to 50 ?m, the heat seal layer (A) has a 1% secant modulus of 20 MPa to 45 MPa and a thickness of 5 ?m or more, and the base material layer (B) has a 1% secant modulus of 250 MPa or more and a thickness of 1 ?m to 30 ?m. Thus, the sealant film not only has good adhesion and suitable openability with respect to the surface to be adhered to but also achieves excellent pressure resistance that prevents the occurrence of opening even under high-pressure treatment.

Abstract: An easily unsealable laminate film for use in bonding of a resin-based nonwoven fabric includes: a heat-seal layer (A) as one superficial layer to be bonded to the resin-based nonwoven fabric; an interlayer (B) that is laminated on the heat-seal layer (A) and includes, as resin components, an ethylene-based resin (b1) with a melt flow rate of 5 g to 50 g/10 min at 190° C. and a butene-based resin (b2); and a surface layer (C) as another superficial layer, wherein the resin components in the interlayer (B) have an ethylene-based resin (b1) content of 50 mass % to 80 mass % and a butene-based resin (b2) content of 20 mass % to 50 mass %. The easily unsealable laminate film can achieve preferred easy unsealability and a high sealing strength at a high temperature.