Abstract: A gas sensor element includes a heating portion and a ceramic layer. The ceramic layer has a first and second face, and is configured to be heated by the heating portion. The ceramic layer has an open-hole portion extending therethrough in a thickness direction from the first face toward the second face and constituting a through-hole for electrically connecting the first face to the second face. The open-hole portion is demarcated by a first inner wall face, and a second inner wall defining a recessed portion that is recessed inward of the ceramic layer. With the ceramic layer having a thickness of 1, the length of the recessed portion to the most distal position thereof from a position on the first inner wall face that is closest to a center axis of the open-hole portion is 0.05 or more and 0.20 or less.

Abstract: A wafer processing apparatus is configured to process a wafer by supplying mist to a surface of the wafer. The wafer processing apparatus includes a furnace in which the wafer is disposed, a gas supplying device configured to supply gas into the furnace, a mist supplying device configured to supply the mist into the furnace, and a controller. The controller is configured to execute a processing step by controlling the gas supplying device and the mist supplying device to supply the gas and the mist into the furnace, respectively. The controller is further configured to control the mist supplying device to stop supplying the mist into the furnace while controlling the gas supplying device to keep supplying the gas into the furnace when the processing step ends.

Abstract: A wafer processing apparatus is configured to process a wafer by supplying mist to a surface of the wafer. The wafer processing apparatus includes a furnace in which the wafer is disposed, a gas supplying device configured to supply gas into the furnace, a mist supplying device configured to supply the mist into the furnace, and a controller. The controller is configured to execute a processing step by controlling the gas supplying device and the mist supplying device to supply the gas and the mist into the furnace, respectively. The controller is further configured to control the mist supplying device to stop supplying the mist into the furnace while controlling the gas supplying device to keep supplying the gas into the furnace when the processing step ends.