Patents by Inventor Yuki Kanai

Yuki Kanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240221383
    Abstract: An image capturing apparatus capable of capturing essential parts in high resolution comprises an image capturing unit configured to include an optical system that forms a low-resolution region on the central side of a light-receiving surface and a high-resolution region on the peripheral side of the light-receiving surface, wherein the image capturing unit is arranged on a vehicle so that an image of a lower side and forward-rearward direction of the vehicle is formed in the high-resolution region of the light-receiving surface of the image capturing unit by the optical system.
    Type: Application
    Filed: December 20, 2023
    Publication date: July 4, 2024
    Inventors: Yuki KANAI, Jun KAWATA
  • Publication number: 20240032251
    Abstract: A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.
    Type: Application
    Filed: April 19, 2023
    Publication date: January 25, 2024
    Applicant: Fujitsu Limited
    Inventors: Hideo Kubo, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Kenji Sasabe, Keita Hirai, Yuki Kanai, Toru Kobayashi, Hiroshi Satou, Takashi Urai, Hiromasa Miyata
  • Publication number: 20230320029
    Abstract: A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.
    Type: Application
    Filed: February 1, 2023
    Publication date: October 5, 2023
    Applicant: Fujitsu Limited
    Inventors: Yuki Kanai, Kenji Sasabe, Keita Hirai, Hideo Kubo, Atsushi Endo, Masahide Kodama, Takashi Urai
  • Publication number: 20230240046
    Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.
    Type: Application
    Filed: October 31, 2022
    Publication date: July 27, 2023
    Applicant: Fujitsu Limited
    Inventors: Kenji Sasabe, Hideo Kubo, Keita Hirai, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Yuki Kanai, Takashi Urai
  • Patent number: 11246236
    Abstract: A liquid cooling jacket with first and second heat receivers and a biasing spring. The first heat receiver having a first refrigerant pipe through which a refrigerant flow and a first heat conductive sheet that receives heat by being in contact with a cooling target. The second heat receiver is configured to approach and separate from the first heat receiver while facing the first heat conductive sheet. The spring biases the first heat receiver and the second heat receiver in an approaching direction.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: February 8, 2022
    Assignee: FUJITSU LIMITED
    Inventors: Takashi Urai, Yuki Kanai
  • Patent number: 11032936
    Abstract: An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: June 8, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Takaya Nakayama, Jiro Tsujimura, Yuki Kanai, Yoichi Sato
  • Patent number: 10939583
    Abstract: An electronic component cooling module includes a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, and a height maintaining portion that maintains a dimension in a height direction, and a supporter configured to support the tube, and a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: March 2, 2021
    Assignee: FUJITSU LIMITED
    Inventor: Yuki Kanai
  • Publication number: 20200390006
    Abstract: A liquid cooling jacket includes a first heat receiver configured to include a first refrigerant pipe through which a refrigerant flows and a first heat conductive sheet that receives heat by being in contact with a cooling target, a second heat receiver capable of approaching and separating from the first heat receiver and configured to face the first heat conductive sheet, and a spring configured to bias the first heat receiver and the second heat receiver in an approaching direction.
    Type: Application
    Filed: June 3, 2020
    Publication date: December 10, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Urai, Yuki Kanai
  • Publication number: 20200337182
    Abstract: An electronic component cooling module includes a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, and a height maintaining portion that maintains a dimension in a height direction, and a supporter configured to support the tube, and a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 22, 2020
    Applicant: FUJITSU LIMITED
    Inventor: Yuki KANAI
  • Publication number: 20200163249
    Abstract: An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.
    Type: Application
    Filed: November 1, 2019
    Publication date: May 21, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Takaya Nakayama, Jiro Tsujimura, Yuki KANAI, yoichi SATO
  • Patent number: 10607917
    Abstract: A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: March 31, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Takaya Nakayama, Takeshi Nishiyama, Jiro Tsujimura, Yuki Kanai
  • Publication number: 20190363034
    Abstract: A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.
    Type: Application
    Filed: May 9, 2019
    Publication date: November 28, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Takaya Nakayama, Takeshi Nishiyama, Jiro Tsujimura, Yuki KANAI
  • Patent number: 10331161
    Abstract: A power supply board includes: a first board including a top surface on which a processor is capable of being mounted, a bottom surface located on an opposite side of the top surface, and a plurality of first through holes and a plurality of second through holes capable of being electrically connected with the processor by penetrating through the first board from the top surface to the bottom surface; a second board arranged at a position distant from the bottom surface of the first board and provided with a power supply device; a first conductor mounted on the bottom surface of the first board and electrically connects the plurality of first through holes and the power supply device, and a second conductor mounted on the bottom surface of the first board and electrically connects the plurality of second through holes and the power supply device.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: June 25, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Yuki Kanai, Takashi Imamoto
  • Publication number: 20160192489
    Abstract: A power supply board includes: a first board including a top surface on which a processor is capable of being mounted, a bottom surface located on an opposite side of the top surface, and a plurality of first through holes and a plurality of second through holes capable of being electrically connected with the processor by penetrating through the first board from the top surface to the bottom surface; a second board arranged at a position distant from the bottom surface of the first board and provided with a power supply device; a first conductor mounted on the bottom surface of the first board and electrically connects the plurality of first through holes and the power supply device, and a second conductor mounted on the bottom surface of the first board and electrically connects the plurality of second through holes and the power supply device.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 30, 2016
    Inventors: Yuki KANAI, Takashi IMAMOTO
  • Patent number: 8973948
    Abstract: A fuel tank for a saddle-ride type vehicle includes a lower half body and an upper half body. The lower half body has a left lower flange part and a right lower flange part, the upper half body has a left upper flange part and a right upper flange part, and the fuel tank is constituted by welding the left lower flange part and the left upper flange part and welding the right lower flange part and the right upper flange part. Left and right fold parts and as folded downward are provided on the left and right upper flange parts.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 10, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventor: Yuki Kanai
  • Publication number: 20120274057
    Abstract: A fuel tank for a saddle-ride type vehicle includes a lower half body and an upper half body. The lower half body has a left lower flange part and a right lower flange part, the upper half body has a left upper flange part and a right upper flange part, and the fuel tank is constituted by welding the left lower flange part and the left upper flange part and welding the right lower flange part and the right upper flange part. Left and right fold parts and as folded downward are provided on the left and right upper flange parts.
    Type: Application
    Filed: April 26, 2012
    Publication date: November 1, 2012
    Applicant: HONDA MOTOR CO., LTD.
    Inventor: Yuki Kanai
  • Patent number: 8258938
    Abstract: A pressure detection unit includes a front-wheel transmitter and a rear-wheel transmitter operatively connected to wheel rims of a front wheel and a rear wheel, respectively. Inflation pressure signals transmitted from the front-wheel transmitter and the rear-wheel transmitter are received by a receiver. The receiver is arranged to be offset outward of a straight line connecting the front-wheel transmitter and the rear-wheel transmitter in the vehicle-body width direction. More specifically, the receiver is arranged in a space surrounded by a front cowl and a side panel, the space being between a coolant reserve tank and a radiator. The single receiver receives the signals transmitted from the front-wheel transmitter and the rear-wheel transmitter.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: September 4, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Masakuni Ando, Kunihiko Fukui, Yuki Kanai, Makoto Hattori, Koji Suzuki
  • Publication number: 20100134270
    Abstract: A pressure detection unit includes a front-wheel transmitter and a rear-wheel transmitter operatively connected to wheel rims of a front wheel and a rear wheel, respectively. Inflation pressure signals transmitted from the front-wheel transmitter and the rear-wheel transmitter are received by a receiver. The receiver is arranged to be offset outward of a straight line connecting the front-wheel transmitter and the rear-wheel transmitter in the vehicle-body width direction. More specifically, the receiver is arranged in a space surrounded by a front cowl and a side panel, the space being between a coolant reserve tank and a radiator. The single receiver receives the signals transmitted from the front-wheel transmitter and the rear-wheel transmitter.
    Type: Application
    Filed: September 30, 2009
    Publication date: June 3, 2010
    Inventors: Masakuni ANDO, Kunihiko Fukui, Yuki Kanai, Makoto Hattori, Koji Suzuki
  • Patent number: 6524993
    Abstract: A hydrogenation catalyst for hydrocarbon oils containing aromatic hydrocarbons is provided. The catalyst has a silica-magnesia oxide carrier with a magnesia content within a range from 25 to 50 weight percent calculated in terms of the metal oxide, to which a noble metal selected from among the group VIII metals of the periodic table is added as the active component. In addition, the pore characteristics of the catalyst are such that the volume of pores with a pore size of at least 4 nm as measured by a mercury porosimetry method is within the range from 0.3 to 0.6 ml/g, the volume of pores with a pore size of at least 200 nm as measured by a mercury porosimetry method is no more than 0.05 ml/g, the volume of pores with a pore size from 0.7 to 2 nm as measured by nitrogen adsorption-t-plot method is within the range from 0.2 to 0.3 ml/g, and the volume of pores with a pore size from 2 to 4 nm as measured by nitrogen adsorption-DH method is within the range from 0.15 to 0.2 ml/g.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: February 25, 2003
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Toshio Yamaguchi, Yuki Kanai, Hideharu Yokozuka
  • Patent number: D1048107
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: October 22, 2024
    Assignee: Hitachi Industrial Equipment Systems Co., Ltd.
    Inventors: Yuki Ishizuka, Yuuji Itou, Kazumasa Kanai, Toshiaki Yabe