Patents by Inventor Yuki Kaneshiro

Yuki Kaneshiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220390874
    Abstract: In a carrier core material according to the present invention, the volume moment mean D [4, 3] of O. Bluntness measured with an injection type image analysis particle size distribution meter is equal to or greater than 65% and equal to or less than 80%, and the volume moment mean D [4, 3] of ISO Roundness is equal to or greater than 80% and equal to or less than 86%. In this way, it is possible to suppress development memory and carrier adherence.
    Type: Application
    Filed: September 14, 2020
    Publication date: December 8, 2022
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Yuto KAMAI, Shinya SASAKI, Yuki KANESHIRO
  • Patent number: 11041229
    Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 22, 2021
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kyoso Masuda, Kenichi Inoue, Yuki Kaneshiro, Atsushi Ebara, Yoshiyuki Michiaki, Kozo Ogi, Takahiro Yamada, Masahiro Yoshida
  • Publication number: 20190194778
    Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
    Type: Application
    Filed: August 31, 2017
    Publication date: June 27, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kyoso MASUDA, Kenichi INOUE, Yuki KANESHIRO, Atsushi EBARA, Yoshiyuki MICHIAKI, Kozo OGI, Takahiro YAMADA, Masahiro YOSHIDA
  • Patent number: 9248504
    Abstract: There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: February 2, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yuki Kaneshiro, Shinichi Suenaga, Hidefumi Fujita, Minoru Kishida
  • Patent number: 9211587
    Abstract: There are provided a cuprous oxide powder having a smaller particle diameter than that of conventional cuprous oxide powders, and a method for producing the cuprous oxide powder by a chemical reducing process. In a method for producing a cuprous oxide powder by adding a reducing agent, such as a reducing sugar, to a solution containing copper hydroxide, which is formed by adding one of an alkali solution and a copper ion containing solution to the other thereof, to deposit cuprous oxide particles by reduction, 0.00001 to 0.04 moles (10 to 40000 ppm) of ferrous ions with respect to the amount of copper ions in the copper ion containing solution are added to the copper ion containing solution before forming copper hydroxide, to produce a cuprous oxide powder which has a mean primary particle diameter of not greater than 0.5 micrometers when it is measured by a scanning electron microscope (SEM), the cuprous oxide powder having a 50% particle diameter (D50 diameter) of not greater than 0.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: December 15, 2015
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yuki Kaneshiro, Shinichi Suenaga, Akihiro Asano
  • Publication number: 20140199204
    Abstract: There are provided a cuprous oxide powder having a smaller particle diameter than that of conventional cuprous oxide powders, and a method for producing the cuprous oxide powder by a chemical reducing process. In a method for producing a cuprous oxide powder by adding a reducing agent, such as a reducing sugar, to a solution containing copper hydroxide, which is formed by adding one of an alkali solution and a copper ion containing solution to the other thereof, to deposit cuprous oxide particles by reduction, 0.00001 to 0.04 moles (10 to 40000 ppm) of ferrous ions with respect to the amount of copper ions in the copper ion containing solution are added to the copper ion containing solution before forming copper hydroxide, to produce a cuprous oxide powder which has a mean primary particle diameter of not greater than 0.5 micrometers when it is measured by a scanning electron microscope (SEM), the cuprous oxide powder having a 50% particle diameter (D50 diameter) of not greater than 0.
    Type: Application
    Filed: September 13, 2012
    Publication date: July 17, 2014
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yuki Kaneshiro, Shinichi Suenaga, Akihiro Asano
  • Patent number: 8629078
    Abstract: To provide an oxidation catalyst capable of burning PM of diesel engine exhausts gas at a low temperature, and hardly subjected to poisoning due to sulfur oxide. A composite oxide contains Ce, Bi, and M (wherein M is one or more elements selected from Mg, Ca, Sr, and Ba) and oxygen, and is manufactured, with a molar ratio of Ce, Bi, M expressed by Ce:Bi:M=(1?x?y):x:y, satisfying 0<x?0.4, and 0<y?0.4. This composite oxide is suitable as a PM combustion catalyst, and is hardly subjected to poisoning due to sulfur oxide.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: January 14, 2014
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yuki Kaneshiro, Takuya Yano, Akira Nagatomi
  • Publication number: 20130177471
    Abstract: There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
    Type: Application
    Filed: September 12, 2011
    Publication date: July 11, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yuki Kaneshiro, Shinichi Suenaga, Hidefumi Fujita, Minoru Kishida
  • Patent number: 8071501
    Abstract: A composite oxide for exhaust gas purification catalysts, which comprises Ce, Bi, R and oxygen and satisfies 0<x?0.4 and 0<y<1.0 when the molar ratio of Ce, Bi and R of the oxide is represented as (1?x?y), x and Y respectively. The composite oxide has an X-ray diffraction peak corresponding to that of a fluorite structure. In the composite oxide, R contains one or two of Pr and Tb. The exhaust gas purification catalyst is favorable for a PM combustion catalyst.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: December 6, 2011
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yuki Kaneshiro, Akira Nagatomi
  • Publication number: 20100111778
    Abstract: A composite oxide for exhaust gas purification catalysts, which comprises Ce, Bi, R and oxygen and satisfies 0<x?0.4 and 0<y<1.0 when the molar ratio of Ce, Bi and R of the oxide is represented as (1?x?y), x and Y respectively. The composite oxide has an X-ray diffraction peak corresponding to that of a fluorite structure. In the composite oxide, R contains one or two of Pr and Tb. The exhaust gas purification catalyst is favorable for a PM combustion catalyst.
    Type: Application
    Filed: October 10, 2007
    Publication date: May 6, 2010
    Applicants: Autoneworks Technologies, LTD., Summitomo Wiring Systems, LTD., Sumitomo Electric Industries LTD.
    Inventors: Yuki Kaneshiro, Akira Nagatomi
  • Publication number: 20090288401
    Abstract: To provide an oxidation catalyst capable of burning PM of diesel, engine exhausts gas at a low temperature, and hardly subjected to poisoning due to sulfur oxide. A composite oxide contains Ce, Bi, and M (wherein M is one or more elements selected from Mg, Ca, Sr, and Ba) and oxygen, and is manufactured, with a molar ratio of Ce, Bi, M expressed by Ce:Bi:M=(1?x?y):x:y, satisfying 0<x?0.4, and 0<y?0.4. This composite oxide is suitable as a PM combustion catalyst, and is hardly subjected to poisoning due to sulfur oxide.
    Type: Application
    Filed: October 12, 2007
    Publication date: November 26, 2009
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Yuki Kaneshiro, Takuya Yano, Akira Nagatomi