Abstract: An inverter device includes a heat dissipation casing having a principal surface, heat dissipation fins arranged on an opposite side to the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent to the region corresponding to the heat dissipation fins on the principal surface, a semiconductor module arranged in the region corresponding to the heat dissipation fins on the principal surface and including a diode module and an inverter module, an inrush-current suppression resistor sealed by a sealing material in the first concave portion and electrically connected between the diode module and the inverter module, and a regenerative resistor sealed by the sealing material in the second concave portion and electrically connected between the diode module and the inverter module.

Abstract: An inverter device includes a heat dissipation casing having a principal surface, heat dissipation fins arranged on an opposite side to the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent to the region corresponding to the heat dissipation fins on the principal surface, a semiconductor module arranged in the region corresponding to the heat dissipation fins on the principal surface and including a diode module and an inverter module, an inrush-current suppression resistor sealed by a sealing material in the first concave portion and electrically connected between the diode module and the inverter module, and a regenerative resistor sealed by the sealing material in the second concave portion and electrically connected between the diode module and the inverter module.

Abstract: A resonance suppression control block includes a high-pass filter for extracting an AC component of DC link voltage, and a gain section for outputting a correction signal obtained by multiplying the AC component by a gain. A control unit controls an inverter based on a signal obtained by adding the correction signal to the voltage instruction. Thus, a power conversion apparatus with a simple configuration can be obtained that can suppress resonance of a DC link section and omit extra work for performing adjustment again in accordance with a power supply frequency.

Abstract: To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization, in addition to alleviating load applied on a molded resin, a semiconductor module includes: a semiconductor element; a placing frame on which the semiconductor element is placed; a control substrate onto which a control component for controlling the semiconductor element is mounted; and a molded resin in which the semiconductor element, the placing frame, and the control substrate are integrally molded. Fixing bases exposed from the molded resin are provided on the control substrate for fixing the semiconductor module onto a chassis.

Abstract: A resonance suppression control block includes a high-pass filter for extracting an AC component of DC link voltage, and a gain section for outputting a correction signal obtained by multiplying the AC component by a gain. A control unit controls an inverter based on a signal obtained by adding the correction signal to the voltage instruction. Thus, a power conversion apparatus with a simple configuration can be obtained that can suppress resonance of a DC link section and omit extra work for performing adjustment again in accordance with a power supply frequency.