Patents by Inventor Yuki KITAHARA
Yuki KITAHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250079014Abstract: In an apparatus in the related art, there is a problem that a rehabilitation menu presented by a rehabilitation planning apparatus or the like is not utilized. A rehabilitation menu determination assistance apparatus according to an example embodiment includes: patient information acquisition means for acquiring reference patients having individual information from past information; similarity score calculation means for calculating a similarity score indicating similarity of individual information between an input reference patient and the reference patients; similarity ranking determination means for ranking the reference patients in a descending order of the similarity score; and first rearrangement processing means for rearranging ranks of the reference patients so that the reference patients including more rehabilitation menus commonly performed for a plurality of the reference patients among rehabilitation menus operated on the reference patients are ranked higher.Type: ApplicationFiled: December 20, 2022Publication date: March 6, 2025Applicant: NEC CorporationInventors: Yusuke Ito, Yuki Kosaka, Shigemi Kitahara
-
Patent number: 12194806Abstract: A suspension arm includes a main body. The main body includes a curved portion curved along a longitudinal direction and has a closed section. The main body includes an inner side wall, an outer side wall, a first side wall, and a second side wall. The inner side wall corresponds to an inner side of a curve of the curved portion. The outer side wall corresponds to an outer side of the curve of the curved portion. A thickness of the inner side wall is larger than a thickness of the outer side wall. In sectional view of the main body perpendicular to the longitudinal direction, each of a length of the first side wall and a length of the second side wall is longer than each of a length of the inner side wall and a length of the outer side wall.Type: GrantFiled: March 28, 2022Date of Patent: January 14, 2025Assignee: NIPPON STEEL CORPORATIONInventors: Kenichiro Otsuka, Masafumi Azuma, Koichi Hamada, Ryo Tabata, Ryo Urushibata, Yuki Kitahara
-
Publication number: 20240123782Abstract: A suspension arm includes a main body. The main body includes a curved portion curved along a longitudinal direction and has a closed section. The main body includes an inner side wall, an outer side wall, a first side wall, and a second side wall. The inner side wall corresponds to an inner side of a curve of the curved portion. The outer side wall corresponds to an outer side of the curve of the curved portion. A thickness of the inner side wall is larger than a thickness of the outer side wall. In sectional view of the main body perpendicular to the longitudinal direction, each of a length of the first side wall and a length of the second side wall is longer than each of a length of the inner side wall and a length of the outer side wall.Type: ApplicationFiled: March 28, 2022Publication date: April 18, 2024Applicant: NIPPON STEEL CORPORATIONInventors: Kenichiro OTSUKA, Masafumi AZUMA, Koichi HAMADA, Ryo TABATA, Ryo URUSHIBATA, Yuki KITAHARA
-
Patent number: 11445093Abstract: A window camera includes: an image capturing unit, a housing, and a light-shielding member. The image capturing unit is configured to capture an image of outdoors from an indoor surface of a window. The housing includes an attachment surface having a rectangular shape and facing in parallel with the indoor surface. In the housing, the image capturing unit is provided to be recessed in the attachment surface such that an optical axis of the image capturing unit is aligned with an intersection of a pair of diagonal lines of the attachment surface. The light-shielding member protrudes from the attachment surface toward the indoor surface and has a rectangular frame shape along an outer shape of the attachment surface. The light-shielding member is formed of an elastic material and elastically deformable by pressing from the housing to close a gap between the indoor surface and the attachment surface.Type: GrantFiled: January 4, 2021Date of Patent: September 13, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Ryota Takeshige, Jumpei Hironaka, Junichi Matsuda, Yasuhiro Nomiyama, Takashi Kihara, Yuki Kitahara
-
Publication number: 20210211565Abstract: A window camera includes: an image capturing unit, a housing, and a light-shielding member. The image capturing unit is configured to capture an image of outdoors from an indoor surface of a window. The housing includes an attachment surface having a rectangular shape and facing in parallel with the indoor surface. In the housing, the image capturing unit is provided to be recessed in the attachment surface such that an optical axis of the image capturing unit is aligned with an intersection of a pair of diagonal lines of the attachment surface. The light-shielding member protrudes from the attachment surface toward the indoor surface and has a rectangular frame shape along an outer shape of the attachment surface. The light-shielding member is formed of an elastic material and elastically deformable by pressing from the housing to close a gap between the indoor surface and the attachment surface.Type: ApplicationFiled: January 4, 2021Publication date: July 8, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Ryota TAKESHIGE, Jumpei HIRONAKA, Junichi MATSUDA, Yasuhiro NOMIYAMA, Takashi KIHARA, Yuki KITAHARA
-
Patent number: 10698330Abstract: A carrier core material formed with ferrite particles, the skewness Rsk of the particle is equal to or more than ?0.40 but equal to or less than ?0.20, and the kurtosis Rku of the particle is equal to or more than 3.20 but equal to or less than 3.50. Here, the maximum height Rz of the particle is equal to or more than 2.20 ?m but equal to or less than 3.50 ?m. Moreover, the ferrite particle contains at least either of Mn and Mg elements. In this way, cracking or chipping in a concave-convex portion of a particle surface is unlikely to occur, and moreover, the amount of coating resin used can be reduced without properties such as electrical resistance being lowered.Type: GrantFiled: March 28, 2017Date of Patent: June 30, 2020Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.Inventors: Yuki Kitahara, Shou Ogawa
-
Publication number: 20190064688Abstract: A carrier core material formed with ferrite particles, the skewness Rsk of the particle is equal to or more than ?0.40 but equal to or less than ?0.20, and the kurtosis Rku of the particle is equal to or more than 3.20 but equal to or less than 3.50. Here, the maximum height Rz of the particle is equal to or more than 2.20 ?m but equal to or less than 3.50 ?m. Moreover, the ferrite particle contains at least either of Mn and Mg elements. In this way, cracking or chipping in a concave-convex portion of a particle surface is unlikely to occur, and moreover, the amount of coating resin used can be reduced without properties such as electrical resistance being lowered.Type: ApplicationFiled: March 28, 2017Publication date: February 28, 2019Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.Inventors: Yuki KITAHARA, Shou OGAWA
-
Patent number: 9437426Abstract: A method of manufacturing a semiconductor device including: a process of transferring a substrate into a processing chamber; a first gas supplying process of supplying a B atom-containing gas into the processing chamber; a first purging process of purging an inside of the processing chamber under an atmosphere of the B atom-containing gas supplied in the first gas supplying process; a second gas supplying process of supplying an Si atom-containing gas into the processing chamber to form a non-doped Si film on the substrate, after the first purging process; and a second purging process of purging the inside of the processing chamber under an atmosphere of the Si atom-containing gas.Type: GrantFiled: March 27, 2014Date of Patent: September 6, 2016Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Naoharu Nakaiso, Kazuhiro Yuasa, Yuki Kitahara
-
Publication number: 20140295648Abstract: Disclosed is a method of manufacturing a semiconductor device including: a process of transferring a substrate into a processing chamber; a first gas supplying process of supplying a B atom-containing gas into the processing chamber; a first purging process of purging an inside of the processing chamber under an atmosphere of the B atom-containing gas supplied in the first gas supplying process; a second gas supplying process of supplying an Si atom-containing gas into the processing chamber to form a non-doped Si film on the substrate, after the first purging process; and a second purging process of purging the inside of the processing chamber under an atmosphere of the Si atom-containing gas.Type: ApplicationFiled: March 27, 2014Publication date: October 2, 2014Applicant: Hitachi Kokusai Electric Inc.Inventors: Naoharu NAKAISO, Kazuhiro YUASA, Yuki KITAHARA