Abstract: A semiconductor device includes: a semiconductor element; sealing resin formed into a rectangular shape in a top view to seal the semiconductor element; a first heat radiation plate electrically connected to a first electrode, and protruding from a first side of the sealing resin in a top view; a second heat radiation plate electrically connected to a second electrode, and protruding from a second side facing the first side of the sealing resin in a top view; a first terminal electrically connected to the first electrode, and protruding from a third side intersecting with the first side of the sealing resin in a top view; and a second terminal electrically connected to the second electrode, and protruding from the third side of the sealing resin in a top view, wherein the first heat radiation plate and the second heat radiation plate can be fixed to the heatsink.

Abstract: A semiconductor device includes: a semiconductor element; a sealing resin; a gate terminal; a drain terminal; a source terminal; a heat dissipation plate electrically connected to the drain, and protruding from a second side intersecting with a first side of the sealing resin in top view; and a heat dissipation plate electrically connected to the drain, and protruding from a third side opposing the second side of the sealing resin in top view. At least a height position of a lower surface of a distal end portion of the heat dissipation plate and a height position of an upper surface of a proximal end portion of the heat dissipation plate or a height position of a lower surface of a distal end portion of the heat dissipation plate and a height position of an upper surface of a proximal end portion of the heat dissipation plate are the same.

Abstract: A switching device includes: a switching element; a die pad; a gate terminal; a first power terminal integral with the die pad; and a second power terminal, the gate terminal, the first power terminal, and the second power terminal are located on a side of a first direction of the die pad, the gate terminal, the first power terminal, and the second power terminal are arranged in a second direction orthogonal to the first direction in the following order: the gate terminal, the first power terminal, and the second power terminal or the second power terminal, the first power terminal, and the gate terminal, the switching element includes a first and a second gate pad, the first gate pad is closer to the gate terminal than the second gate pad is, the second gate pad is closer to the second power terminal than the first gate pad is.