Patents by Inventor Yuki MIYAISHI

Yuki MIYAISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11599023
    Abstract: There is provided a highly sensitive colorant-containing photosensitive resin composition for use in the formation of organic EL element barrier ribs. In one embodiment, the photosensitive resin composition for an organic EL element barrier rib comprises: (A) a binder resin; (B) at least one low molecular weight organic compound having a molar volume of 130 cm3/mol or less and being selected from the group consisting of aromatic carboxylic acids and compounds each having a plurality of phenolic hydroxyl groups; (C) a radiation sensitive compound; and (D) a colorant selected from the group consisting of black dyes and black pigments.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: March 7, 2023
    Assignee: SHOWA DENKO K.K.
    Inventors: Kentaro Furue, Yuki Miyaishi
  • Patent number: 11561469
    Abstract: A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as “trivalent or greater phenol compound”, and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). Ra to Rd and * in the formulas are as defined in the Specification.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: January 24, 2023
    Assignee: SHOWA DENKO K.K.
    Inventors: Kentaro Furue, Yuki Miyaishi, Shiyuko Nakamura
  • Patent number: 10866512
    Abstract: Provided is a positive photosensitive resin composition having high sensitivity, high definition, and high adhesiveness and being capable of maintaining blackness and high light-blocking properties, even after a high-temperature curing step, e.g., at 250° C. This positive photosensitive resin composition contains: a binder resin (A); a quinonediazide compound (B); and at least one type of black dye (C) selected from black dyes specified by the color indexes of solvent black 27-47. The black dye (C) is ideally specified by the color index of solvent black 27, 29, or 34. This composition is capable of being suitably used in positive radiation lithography and can be used to form organic EL element partitions and insulating films.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: December 15, 2020
    Assignee: SHOWA DENKO K.K.
    Inventors: Kentaro Furue, Yuki Miyaishi
  • Publication number: 20200081343
    Abstract: There is provided a highly sensitive colorant-containing photosensitive resin composition for use in the formation of organic EL element barrier ribs. In one embodiment, the photosensitive resin composition for an organic EL element barrier rib comprises: (A) a binder resin; (B) at least one low molecular weight organic compound having a molar volume of 130 cm3/mol or less and being selected from the group consisting of aromatic carboxylic acids and compounds each having a plurality of phenolic hydroxyl groups; (C) a radiation sensitive compound; and (D) a colorant selected from the group consisting of black dyes and black pigments.
    Type: Application
    Filed: September 9, 2019
    Publication date: March 12, 2020
    Applicant: SHOWA DENKO K.K.
    Inventors: Kentaro FURUE, Yuki Miyaishi
  • Publication number: 20200033726
    Abstract: A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as “trivalent or greater phenol compound”, and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). Ra to Rd and * in the formulas are as defined in the Specification.
    Type: Application
    Filed: April 6, 2018
    Publication date: January 30, 2020
    Applicant: SHOWA DENKO K.K.
    Inventors: Kentaro FURUE, Yuki MIYAISHI, Shiyuko NAKAMURA
  • Publication number: 20180253003
    Abstract: Provided is a positive photosensitive resin composition having high sensitivity, high definition, and high adhesiveness and being capable of maintaining blackness and high light-blocking properties, even after a high-temperature curing step, e.g., at 250° C. This positive photosensitive resin composition contains: a binder resin (A); a quinonediazide compound (B); and at least one type of black dye (C) selected from black dyes specified by the color indexes of solvent black 27-47. The black dye (C) is ideally specified by the color index of solvent black 27, 29, or 34. This composition is capable of being suitably used in positive radiation lithography and can be used to form organic EL element partitions and insulating films.
    Type: Application
    Filed: October 19, 2016
    Publication date: September 6, 2018
    Applicant: SHOWA DENKO K.K.
    Inventors: Kentaro FURUE, Yuki MIYAISHI