Abstract: An image forming apparatus includes, an image forming portion configured to form a toner image on a sheet using printing toner and apply powder adhesive on the sheet, a fixing portion configured to heat the toner image formed on the sheet and the powder adhesive applied on the sheet by the image forming portion and fix the toner image and the powder adhesive to the sheet, and a bonding portion configured to bond the sheet with the powder adhesive by reheating the sheet having been heated by the fixing portion. The bonding portion is arranged above the image forming portion.

Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 ?m or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.

Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 ?m or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.

Abstract: An etching method is capable of etching titanium selectively in the presence of copper. An etching liquid used in the method is low in toxicity and excellent in storage stability. The etching liquid includes at least one acid, such as, sulfuric acid, hydrochloric acid, or trichloroacetic acid, and at least one organic sulfur compound, such as a thioketone compound or a thioether compound.

Abstract: An object of the present invention is to provide: an etching liquid which is capable of etching titanium selectively in the presence of copper, and is further low in toxicity and excellent in storage stability; and an etching method using this etching liquid. The etching liquid of the present invention which is a liquid includes at least one acid selected from the group consisting of sulfuric acid, hydrochloric acid, and trichloroacetic acid, and at least one organic sulfur compound selected from the group consisting of a thioketone compound and a thioether compound, and makes it possible to etch titanium selectively in the presence of copper.

Abstract: A display device includes a display component, a plastic frame, and a rear frame. The plastic frame supports the display component near an edge portion of the display component from a rear side of the display device relative to the display component. The rear frame is disposed on the rear side of the display device relative to the display component. The rear frame includes a fixing component that fixedly couples at least the plastic frame relative to the rear frame. The fixing component has an inner bent component that extends forward and inward of the display device from an edge part of the rear frame.

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of AB is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract: A display device includes a display component, a plastic frame, and a rear frame. The plastic frame supports the display component near an edge portion of the display component from a rear side of the display device relative to the display component. The rear frame is disposed on the rear side of the display device relative to the display component. The rear frame includes a fixing component that fixedly couples at least the plastic frame relative to the rear frame. The fixing component has an inner bent component that extends forward and inward of the display device from an edge part of the rear frame.

Abstract: A liquid crystal module includes a liquid crystal panel, a printed wiring board, a rear frame, a plurality of protrusion portions and first and second positioning portions. The rear frame supports the liquid crystal panel. The protrusion portions protrude from a rear face of the rear frame and fixedly support the printed wiring board on upper faces of the protrusion portions. The first and second positioning portions further protrude from at least one of the protrusion portions. The first positioning portion positions the printed wiring board in a first direction. The second positioning portion positions the printed wiring board in a second direction perpendicular to the first direction.

Abstract: A liquid crystal module includes a liquid crystal panel, a printed wiring board, a rear frame, a plurality of protrusion portions and first and second positioning portions. The rear frame supports the liquid crystal panel. The protrusion portions protrude from a rear face of the rear frame and fixedly support the printed wiring board on upper faces of the protrusion portions. The first and second positioning portions further protrude from at least one of the protrusion portions. The first positioning portion positions the printed wiring board in a first direction. The second positioning portion positions the printed wiring board in a second direction perpendicular to the first direction.