Patents by Inventor Yuki Ohnishi

Yuki Ohnishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230301209
    Abstract: According to one embodiment, a semiconductor storage device includes a first electrode and a second electrode spaced in a first direction and a phase change layer provided between the first electrode and the second electrode. The phase change layer comprises at least one of germanium (Ge), antimony (Sb), and tellurium (Te). The phase change layer is configured to be able to transition to a first state in which a volume ratio of an amorphous phase to a crystalline phase is a first ratio, a second state in which the volume ratio is a second ratio larger than the first ratio, and a third state in which the volume ratio is a third ratio larger than the second ratio.
    Type: Application
    Filed: September 1, 2022
    Publication date: September 21, 2023
    Inventors: Hiroyuki ODE, Yuki OHNISHI, Ibuki WATANABE
  • Patent number: 8945303
    Abstract: The subject is providing a crystallizing device of a biopolymer, which made to form biopolymer crystal efficiently in crystallization solution of a small amount of biopolymers by applying a low voltage and not to make an electrode disturb but observable a state of crystal formation. As an electrode for applying an electric field to a biopolymer solution, a transparent conductor, which does not disturb crystal formation, is used. Between the transparent conductor electrodes 2s, the electric insulating member 4 is placed and the crystallization solution 1 for a small amount of biopolymers is maintained inter-electrode. A biopolymer is efficiently crystallized by applying a low voltage supplied from the voltage generator 5 to the transparent conductor electrode 2. A crystal formation state of a biopolymer is optically observable from the electrode side of a transparent conductor. Orientation control of the biopolymer can be performed by an electric field formed by the above-mentioned voltage application.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: February 3, 2015
    Assignee: Institute of National Colleges of Technology, Japan
    Inventors: Takashi Wakamatsu, Yuki Ohnishi
  • Publication number: 20110308948
    Abstract: The subject is providing a crystallizing device of a biopolymer, which made to form biopolymer crystal efficiently in crystallization solution of a small amount of biopolymers by applying a low voltage and not to make an electrode disturb but observable a state of crystal formation. As an electrode for applying an electric field to a biopolymer solution, a transparent conductor, which does not disturb crystal formation, is used. Between the transparent conductor electrodes 2s, the electric insulating member 4 is placed and the crystallization solution 1 for a small amount of biopolymers is maintained inter-electrode. A biopolymer is efficiently crystallized by applying a low voltage supplied from the voltage generator 5 to the transparent conductor electrode 2. A crystal formation state of a biopolymer is optically observable from the electrode side of a transparent conductor. Orientation control of the biopolymer can be performed by an electric field formed by the above-mentioned voltage application.
    Type: Application
    Filed: February 18, 2010
    Publication date: December 22, 2011
    Inventors: Takashi Wakamatsu, Yuki Ohnishi
  • Publication number: 20100127387
    Abstract: [Summary] [Object] To suppress warpage of a ceramic substrate, and to prevent a reduction in radiation efficiency. [Means for Settlement] A power semiconductor module includes a module casing fitted with a radiator, and a common unit retained by the module casing. The common unit has: a ceramic substrate having a circuit surface disposed with a semiconductor element, and a radiation surface brought into abutting contact with the radiator; and a package formed by exposing the radiation surface and sealing the circuit surface with heat resistant resin. The circuit surface and the radiation surface are respectively formed of metal layers 51 formed on the ceramic substrate, and the metal layer 51 forming the radiation surface has: by forming a buffer pattern 512 including a groove part extending along a circumferential part thereof, a radiation pattern 510 formed on an inner side of the buffer pattern 512; and an outer peripheral pattern 511 formed on an outer side of the buffer pattern 512.
    Type: Application
    Filed: May 18, 2007
    Publication date: May 27, 2010
    Applicant: Sansha Electric Manufacturing Co., Ltd.
    Inventors: Osamu Soda, Yuki Ohnishi, Kazunori Inami, Toshio Uchida