Abstract: There is provided an information processing device determining necessity/non-necessity of adjustment of conditions for inspecting molding defects of a molded composition on a substrate the information processing device including: an image acquiring unit configured to acquire an image of the molded composition; an inspection unit configured to perform inspection of the molding defects from the image using a machine learning model; an information acquiring unit configured to acquire information relating to a molding defect of the composition on a reference substrate; and a determination unit configured to compare an inspection result acquired by inspecting the molding defects on the reference substrate using the inspection unit with the information relating to a molding defect of the composition that is acquired by the information acquiring unit and determine necessity/non-necessity of the adjustment of the conditions of the inspection based on a result of the comparison.

Abstract: There is provided an information processing device determining necessitynon-necessity of adjustment of conditions for inspecting molding defects of a molded composition on a substrate the information processing device including: an image acquiring unit configured to acquire an image of the molded composition; apt inspection unit configured to perform inspection of the molding defects from the image using a machine learning model; an information acquiring unit configured to acquire information relating to a molding defect of the composition on a reference substrate; and a determination, unit configured to compare an inspection result acquired by inspecting the molding defects on the reference substrate using the inspection unit with the information relating to a molding defect of the composition that is acquired by the information acquiring, unit and determine necessity/non-necessity of the adjustment of the conditions of the inspection based on a result of the comparison,

Abstract: A manufacturing method for a substrate with a stiffener is disclosed, the substrate being capable of ensuring a good flatness of a printed board when heated to a high temperature and then cooled. The method comprises a first step of preparing a printed board and a stiffener, the printed board including a wiring part and an insulating part formed of an organic insulating material, and the stiffener being formed of a material with a smaller coefficient of thermal expansion than that of the material of the printed board, and a second step of bonding the printed board and the stiffener with a thermosetting adhesive. In the second step, a curing process temperature for curing the thermosetting adhesive is equal to or higher than the glass transition point of the organic insulating material.