Patents by Inventor Yuki SEKINE

Yuki SEKINE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11004821
    Abstract: A wire bonding method comprises: preparing a wire bonding apparatus; a step of forming a free air ball; a first height measuring step of measuring the height of a first electrode by detecting whether the free air ball is grounded to the first electrode; a second height measuring step of measuring the height of a second electrode by detecting whether the free air ball is grounded to the second electrode; a first bonding step of controlling the height of a bonding tool based on the measurement result in the first height measuring step, and bonding the free air ball to the first electrode; and a second bonding step of controlling the height of the bonding tool based on the measurement result in the second height measuring step, and bonding a wire to the second electrode to connect the first and the second electrodes. Thus, electrodes can be correctly bonded.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: May 11, 2021
    Assignee: SHINKAWA LTD.
    Inventors: Yusuke Maruya, Yuki Sekine
  • Patent number: 10607959
    Abstract: A discharge examination device for examining discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire to procure the discharge therebetween includes a current detection unit, a timer unit and a discharge determination unit. The current detection unit detects a discharge current flowing through the wire. The timer unit measures discharge detection time after application of the voltage before detection of the discharge current. The discharge determination unit determines whether or not the discharge is abnormal based on the discharge detection time. With this, a discharge examination device, a wire-bonding apparatus, and a discharge examination method that are capable of detecting abnormality of discharge are provided.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: March 31, 2020
    Assignee: SHINKAWA LTD.
    Inventors: Kazumasa Sasakura, Hiroaki Yoshino, Yuki Sekine
  • Publication number: 20190287941
    Abstract: A wire bonding method comprises: preparing a wire bonding apparatus; a step of forming a free air ball; a first height measuring step of measuring the height of a first electrode by detecting whether the free air ball is grounded to the first electrode; a second height measuring step of measuring the height of a second electrode by detecting whether the free air ball is grounded to the second electrode; a first bonding step of controlling the height of a bonding tool based on the measurement result in the first height measuring step, and bonding the free air ball to the first electrode; and a second bonding step of controlling the height of the bonding tool based on the measurement result in the second height measuring step, and bonding a wire to the second electrode to connect the first and the second electrodes. Thus, electrodes can be correctly bonded.
    Type: Application
    Filed: August 22, 2017
    Publication date: September 19, 2019
    Applicant: SHINKAWA LTD.
    Inventors: Yusuke MARUYA, Yuki SEKINE
  • Publication number: 20160358879
    Abstract: A discharge examination device for examining discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire to procure the discharge therebetween includes a current detection unit, a timer unit and a discharge determination unit. The current detection unit detects a discharge current flowing through the wire. The timer unit measures discharge detection time after application of the voltage before detection of the discharge current. The discharge determination unit determines whether or not the discharge is abnormal based on the discharge detection time. With this, a discharge examination device, a wire-bonding apparatus, and a discharge examination method that are capable of detecting abnormality of discharge are provided.
    Type: Application
    Filed: August 17, 2016
    Publication date: December 8, 2016
    Applicant: SHINKAWA LTD.
    Inventors: KAZUMASA SASAKURA, HIROAKI YOSHINO, YUKI SEKINE
  • Patent number: 9467929
    Abstract: A wireless terminal according to an embodiment includes a display unit, a wireless LAN communication unit, a wireless WAN communication unit, and a control unit. The control unit acquires, when a radio wave intensity of a wireless signal output from a wireless LAN access point detected by the wireless LAN communication unit satisfies a predetermined condition, notification information corresponding to the wireless LAN access point by the wireless WAN communication unit or by the wireless LAN communication unit, and to indicates the notification information with an indication unit.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: October 11, 2016
    Assignee: YAHOO JAPAN CORPORATION
    Inventor: Yuki Sekine
  • Publication number: 20140211645
    Abstract: A wireless terminal according to an embodiment includes a display unit, a wireless LAN communication unit, a wireless WAN communication unit, and a control unit. The control unit acquires, when a radio wave intensity of a wireless signal output from a wireless LAN access point detected by the wireless LAN communication unit satisfies a predetermined condition, notification information corresponding to the wireless LAN access point by the wireless WAN communication unit or by the wireless LAN communication unit, and to indicates the notification information with an indication unit.
    Type: Application
    Filed: January 10, 2014
    Publication date: July 31, 2014
    Applicant: YAHOO JAPAN CORPORATION
    Inventor: Yuki SEKINE