Patents by Inventor Yuki SETA

Yuki SETA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with reverse and observe surfaces
    Patent number: 12757752
    Abstract: A semiconductor device capable of suppressing separation of a sealing resin at an internal reverse surface is provided. The semiconductor device includes a semiconductor element, a first lead on which the semiconductor element is mounted, and a sealing resin covering the semiconductor element and a part of the lead. The lead includes an obverse surface to which the semiconductor element is bonded, a reverse surface facing away from the obverse surface in a thickness direction of the first lead and exposed from the sealing resin, and an internal reverse surface facing the same side as a side that the reverse surface faces in the thickness direction and covered with the sealing resin. The internal reverse surface includes an irregular portion.
    Type: Grant
    Filed: December 4, 2023
    Date of Patent: October 6, 2026
    Assignee: Rohm Co., Ltd.
    Inventors: Daichi Niwa, Yuki Seta, Koshun Saito
  • SEMICONDUCTOR DEVICE
    Publication number: 20240120261
    Abstract: A semiconductor device capable of suppressing separation of a sealing resin at an internal reverse surface is provided. The semiconductor device includes a semiconductor element, a first lead on which the semiconductor element is mounted, and a sealing resin covering the semiconductor element and a part of the lead. The lead includes an obverse surface to which the semiconductor element is bonded, a reverse surface facing away from the obverse surface in a thickness direction of the first lead and exposed from the sealing resin, and an internal reverse surface facing the same side as a side that the reverse surface faces in the thickness direction and covered with the sealing resin. The internal reverse surface includes an irregular portion.
    Type: Application
    Filed: December 4, 2023
    Publication date: April 11, 2024
    Inventors: Daichi NIWA, Yuki SETA, Koshun SAITO