Patents by Inventor Yuki SHINBORI

Yuki SHINBORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8809900
    Abstract: A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: August 19, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Satoshi Sato, Hisataka Ito, Yasunari Ooyabu, Yuki Shinbori
  • Patent number: 8796712
    Abstract: A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: August 5, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yasunari Ooyabu, Satoshi Sato, Yuki Shinbori, Shinya Ota, Hisataka Ito
  • Publication number: 20140199795
    Abstract: A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween.
    Type: Application
    Filed: March 14, 2014
    Publication date: July 17, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Hisataka ITO, Yuki SHINBORI, Satoshi SATO
  • Patent number: 8723167
    Abstract: A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: May 13, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Satoshi Sato, Hisataka Ito, Yasunari Ooyabu, Yuki Shinbori
  • Patent number: 8680557
    Abstract: A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: March 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yuki Shinbori, Yasunari Ooyabu, Satoshi Sato, Hisataka Ito
  • Publication number: 20120305969
    Abstract: A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 6, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Satoshi SATO, Hisataka ITO, Yasunari OOYABU, Yuki SHINBORI
  • Publication number: 20120248484
    Abstract: A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer.
    Type: Application
    Filed: March 26, 2012
    Publication date: October 4, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Satoshi SATO, Hisataka ITO, Yasunari OOYABU, Yuki SHINBORI
  • Publication number: 20120248485
    Abstract: A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board.
    Type: Application
    Filed: March 27, 2012
    Publication date: October 4, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki SHINBORI, Yasunari Ooyabu, Satoshi Sato, Hisataka Ito
  • Publication number: 20120160412
    Abstract: A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween.
    Type: Application
    Filed: December 20, 2011
    Publication date: June 28, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Hisataka ITO, Yuki SHINBORI, Satoshi SATO
  • Publication number: 20120083056
    Abstract: A light emitting diode sealing member includes a light emitting diode sealing layer, and a lens mold layer laminated on the light emitting diode sealing layer.
    Type: Application
    Filed: September 29, 2011
    Publication date: April 5, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki SHINBORI, Yasunari OOYABU, Satoshi SATO, Hisataka ITO
  • Publication number: 20110316032
    Abstract: A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.
    Type: Application
    Filed: June 23, 2011
    Publication date: December 29, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Satoshi Sato, Yuki SHINBORI, Shinya OTA, Hisataka ITO