Abstract: There is provided a new film for manufacturing a semiconductor device that is superior to prevent contamination of a semiconductor chip having an excellent balance of holding power during dicing a semiconductor wafer even where the semiconductor wafer is thin, peeling property when peeling the semiconductor chip that is obtained by dicing together with its adhesive layer, and low contamination property in which there is no attachment of cutting debris to the semiconductor chip. A film for manufacturing a semiconductor device that is used when manufacturing a semiconductor device has a base layer, a first pressure-sensitive adhesive layer that is provided on the base layer, a radiation curing-type second pressure-sensitive adhesive layer that is provided on the first pressure-sensitive adhesive layer and cured by radiation irradiation in advance, and an adhesive layer that is provided on the second pressure-sensitive adhesive layer.

Abstract: The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 ?m.

Abstract: The present invention provides an adhesive film with a dicing sheet having a pressure-sensitive adhesive layer on a base material and also having a peelable adhesive film on the pressure-sensitive adhesive layer, that has an excellent peeling property when peeling a semiconductor chip obtained by dicing and an adhesive film attached thereto together without impairing the holding power even during dicing a thin semiconductor wafer, and a method of manufacturing the same. The adhesive film with a dicing sheet of the present invention is formed by sequentially laminating a pressure-sensitive adhesive layer and an adhesive layer on a base material, in which the intensity of an Si—K? ray on at least one region on a surface of the pressure-sensitive adhesive layer to be pasted onto the adhesive layer is 0.01 to 100 kcps.

Abstract: Disclosed is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a base material sheet, a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the pressure-sensitive adhesive composition, in which pieces of the layered clay mineral are arranged substantially perpendicular to the base material sheet.

Abstract: A pressure-sensitive adhesive tape, which has a pressure-sensitive adhesive layer with its storage modulus controlled within an adequate range, and which suitably prevents resin leakage during a sealing step in the production of a semiconductor device using a metal lead frame. The pressure-sensitive adhesive tape includes, on a base sheet, a pressure-sensitive adhesive layer containing a silicone-based pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the silicone-based pressure-sensitive adhesive composition.

Abstract: Provided is a cleaning member, which is capable of removing minute foreign matter, preferably foreign matter of a submicron level simply, exactly, and sufficiently, without contaminating a cleaning site. Further provided is a delivery member with a cleaning function having the cleaning member and a method of cleaning a substrate processing apparatus using the delivery member with a cleaning function. The cleaning member of the present invention includes a cleaning layer having a plurality of protrusions of a columnar structure on the surface, in which an aspect ratio of the protrusions of a columnar structure is 5 or more.

Abstract: Provided is a cleaning member capable of removing minute foreign matter, in particular foreign matter of a submicron level simply, exactly, and sufficiently without contaminating a cleaning site. Further provided is a carrying member provided with a cleaning function having the cleaning member and a method of cleaning a substrate processing equipment with the use of the cleaning member or the carrying member provided with a cleaning function. The cleaning member includes a layer member having a plurality of protrusions of a columnar structure on a surface, in which each of the protrusions of a columnar structure has a carbon-based nanostructure.

Abstract: Provided is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a substrate, a pressure-sensitive adhesive layer containing a lipophilic layered clay mineral, in which the layered clay mineral is in a state of being peeled and dispersed, and the interlayer distance of the layered clay mineral is 50 ? or more.

Abstract: The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

Abstract: The present invention is a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on an ultraviolet-ray transmitting base and a die-bonding film provided on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is formed by laminating the die-bonding film onto a pressure-sensitive adhesive layer precursor formed from an acrylic polymer comprising an acrylic ester as a main monomer, a hydroxyl group-containing monomer at a ratio in the range of 10 to 40 mol % with respect to 100 mol % of the acrylic ester, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecular at a ratio in the range of 70 to 90 mol % with respect to 100 mol % of the hydroxyl group-containing monomer, and then curing by irradiating with an ultraviolet ray from the base side, and the die-bonding film is formed from an epoxy resin.