Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.

Abstract: A ceramic electronic component that includes a ceramic insulator and an inner conductor layer disposed in the ceramic insulator. The inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from Ti, Mg, and Zr, first insulator regions that contain at least one second metal element selected from Ti, Mg, and Zr and that are discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer, and a second insulator region containing a third metal element the same as the second metal element contained in the first insulator regions and present around the inner conductor layer.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer and a surface electrode on a surface of the electronic component body. The surface electrode includes a first sintered layer on the base ceramic layer, a second sintered layer on the first sintered layer, and a plating layer on the second sintered layer. A peripheral section of the first sintered layer has an exposed surface which is not overlaid with the second sintered layer or the plating layer.

Abstract: A ceramic electronic component that includes a ceramic insulator and an inner conductor layer disposed in the ceramic insulator. The inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from Ti, Mg, and Zr, first insulator regions that contain at least one second metal element selected from Ti, Mg, and Zr and that are discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer, and a second insulator region containing a third metal element the same as the second metal element contained in the first insulator regions and present around the inner conductor layer.

Abstract: In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO2, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu—Ba—Si based glass with a thickness of about 1 ?m to about 5 ?m is formed between the metal substrate and the low-temperature sintering ceramic layer.

Abstract: When firing a composite substrate structured to have stacked ceramic dielectric and ceramic magnetic layers, a glass constituent is diffused from the ceramic dielectric layer to the ceramic magnetic layer to, as a result, decrease sinterability of the ceramic dielectric layer or degrade insulation resistance characteristics thereof. When the ceramic dielectric includes 40 to 80% by weight of glass formed from 35 to 50% by weight of CaO, 0 to 20% by weight of Al2O3, 5 to 20% by weight of B2O3, and 30 to 50% by weight of SiO2; and 20 to 60% by weight of at least of alumina, forsterite, and/or quartz, this problem is avoided. The dielectric composition increases the viscosity of the glass, and suppresses constituent diffusion from the ceramic dielectric layer to the ceramic magnetic layer, because the glass is partially crystallized to form wollastonite during firing.

Abstract: In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO2, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu—Ba—Si based glass with a thickness of about 1 ?m to about 5 ?m is formed between the metal substrate and the low-temperature sintering ceramic layer.

Abstract: In a metal base substrate with a low-temperature sintering ceramic layer provided on a metal substrate, while making it possible to make the metal substrate from copper, the low-temperature sintering ceramic layer is less likely to crack or peel at the interface with the metal substrate, and the anti-peeling strength of a surface conductor is improved. In the metal base substrate, the thermal expansion coefficient of the metal substrate is greater than the thermal expansion coefficient of the low-temperature sintering ceramic layer, the average difference in thermal expansion coefficients of the metal substrate and the low-temperature sintering ceramic layer at approximately 25° C. to 400° C. is about 4 ppm/° C. to about 9 ppm/° C., and the low-temperature sintering ceramic layer has a Young's modulus less than about 120 GPa, and a flexural strength of about 200 MPa or more.