Abstract: A terminal includes an RF-DC conversion circuit outputting DC current by converting AC current received via wireless communication into DC current, a DC-DC converter connected to an output side of RF-DC conversion circuit to convert a voltage of DC current output from RF-DC conversion circuit to a predetermined voltage, and a controller controlling connection and disconnection between RF-DC conversion circuit and DC-DC converter. Controller acquires open circuit voltage Vin_oc on an output side of RF-DC conversion circuit, which is obtained when RF-DC conversion circuit and DC-DC converter are disconnected from each other, and target voltage ?Vin_oc (0<?<1) obtained by dividing open circuit voltage Vin_oc. When RF-DC conversion circuit and DC-DC converter are connected to each other, controller performs feedback control of DC-DC converter so that an input voltage Vin on a side where DC-DC converter is connected to RF-DC conversion circuit is equal to target voltage ?Vin_oc.

Abstract: A parking brake control apparatus 20 drives an electric motor 43B to advance a piston 39 according to an application request signal from a parking brake switch 19. The parking brake control apparatus 20 includes a running state detection portion that calculates a running state about whether a vehicle is running or stopped based on a wheel signal from a wheel speed sensor 18. When the running state cannot be calculated by the running state detection portion, the parking brake control apparatus 20 controls the electric motor 43B in such a manner that the thrust force of the piston 39 changes at a lower time rate of change than when the running state can be calculated.

Abstract: An energy harvest terminal includes a distribution circuit that distributes input radio wave power to at least two branch paths, a main rectification circuit that converts first radio wave power supplied to one of the at least two branch paths from the distribution circuit into DC output power, a DC-DC converter that performs voltage conversion on the DC output power of the main rectification circuit, a sub-rectification circuit that converts second radio wave power supplied to another of the at least two branch paths from the distribution circuit into DC output power, and an electricity storage device connected to an output of the DC-DC converter. The DC-DC converter performs a feedback control for equalizing an output voltage of the main rectification circuit and an output voltage of the sub-rectification circuit.

Abstract: An antenna device includes a substrate having a ground conductor, an antenna conductor disposed approximately parallel with the ground conductor with an air layer or a dielectric layer, plural short-circuiting conductors that connect the antenna conductor to the ground conductor, and a feed conductor disposed in a vicinity of one of the plural short-circuiting conductors and that feeds the antenna conductor with power. When a wavelength of frequency used in the antenna device is represented by ?, an outer circumferential length of the slot is approximately 1? to 2? and a width of the slot is 0.005? to 0.05?, an interval between the plural short-circuiting conductors is shorter than or equal to ?/2, and a distance between the antenna conductor and the ground conductor is 0.005? to 0.05?.

Abstract: A semiconductor wafer and a method for forming a semiconductor. The semiconductor wafer includes: a first semiconductor component having a first device; a second semiconductor component having a second device; an insulation layer laterally extending to the first semiconductor component and the second semiconductor component; and a grind layer configured on or adjacent to a backside of the semiconductor wafer. Therefore, chipping or cracking can be decreased or avoided when the grind layer is exposed during the thinning process (such as backside grinding).

Abstract: A semiconductor wafer and a method for forming a semiconductor. The semiconductor wafer includes: a first semiconductor component having a first device; a second semiconductor component having a second device; an insulation layer laterally extending to the first semiconductor component and the second semiconductor component; and a grind layer configured on or adjacent to a backside of the semiconductor wafer. Therefore, chipping or cracking can be decreased or avoided when the grind layer is exposed during the thinning process (such as backside grinding).

Abstract: A service providing system includes a control server and a physical resource(s) controlled by the control server. The control server has a virtual device providing unit(s) that provides at least one virtual object for controlling a physical resource(s), and a virtual infrastructure providing unit(s) that can provide, as a virtual object(s), a virtual infrastructure(s) configured using at least one virtual object provided by the virtual device providing unit(s), wherein the virtual infrastructure providing unit(s) can configure a virtual infrastructure(s) using the virtual object(s) provided by the virtual infrastructure providing unit(s), and can provide the virtual infrastructure(s) as a virtual object(s).

Abstract: A semiconductor device and a method for detecting a crack of the semiconductor device are provided. The semiconductor device includes a crack sensor having a SBD structure; the SBD structure at least is configured on a first side of a semiconductor body and configured to detect a crack on the first side of the semiconductor body. Therefore, a crack on the surface of the semiconductor device can be detected by the crack sensor with high precision and simple structure.

Abstract: A method for raising a polishing pad for polishing a silicon wafer, wherein a polishing pad made of foamed urethane resin is attached to a polishing machine, after dressing is performed, dummy polishing is performed, after processing to remove the polishing residues that have built up in the polishing pad by the dummy polishing is then performed, an amount of polishing residues in the polishing pad is measured, and a rise of the polishing pad subjected to the dummy polishing is judged based on the measured amount of polishing residues. As a result, a method for raising a polishing pad can improve the particle level in the polishing pad life early stage.

Abstract: The present invention provides a tool that can analyze a target in a sample with simple operations and can be downsized, and an analysis method using the same. The analysis cell of the present invention includes: a main substrate: a sample inlet cover member; and a gas outlet cover member. The main substrate includes a flow path, an inlet for a sample, and a gas outlet, and the inlet and the gas outlet communicate with an outside. The inlet communicates with an upstream end portion of the flow path and the gas outlet communicates with a downstream end portion of the flow path. The flow path has a shape that expands from an upstream side toward a downstream side of the flow path. The sample inlet cover member is a liquid-tight member and can be fixed to the inlet when the sample inlet cover member is in use. The gas outlet cover member is a liquid-tight and gas-permeable member and can be fixed to the gas outlet when the gas outlet cover member is in use.

Abstract: An operator is able to easily perform down-tuning while still achieving superior responsiveness and, in some cases, obtain an equivalent responsiveness as that obtained from the flow rate control device currently being used. In a flow rate control device that performs feedback control of a fluid control valve such that a measured flow rate closely approximates a target flow rate, there are provided a response lag input section that inputs a response lag set value, which is a value showing a response lag that an operator wishes to set, and a response lag generating section that generates response lags used in the feedback control in accordance with the response lag set values.

Abstract: Provided is a water-absorbing agent having an excellent ability to absorb and retain liquid and an excellent liquid suction power. The water-absorbing agent contains a polyacrylic acid (salt)-based water-absorbing resin as a main component and satisfies all of the following physical properties (a) to (e): (a) a weight average particle diameter (D50) is 300 ?m or more and less than 400 ?m; (b) a proportion of particles with a particle diameter of 600 ?m or more and less than 850 ?m is less than 10 weight %; (c) an average gap radius is 100 ?m or more and less than 180 ?m; (d) a CRC is 28 g/g or more and less than 34 g/g; and (e) an AAP is 24 g/g or more.

Abstract: An antenna device includes a first plate conductor that is disposed approximately in parallel to the GND conductor plate, of which one end is connected to the GND conductor plate, and the other end that is opposed to the one end is opened, and a second plate conductor that has approximately the same shape as that of the first plate conductor, of which one end is grounded to the GND conductor plate, of which the other end that is opposed to the one end is opened, that is disposed at a position obtained by rotating the first plate conductor approximately 180 degrees about an intersection line passing through an approximately central point of the GND conductor plate as an axis on the same plane as the first plate conductor on the GND conductor plate, and that has a ground portion at which the grounding is performed and an open portion at which the opening is performed at positions obtained by rotating the ground portion and the open portion of the first plate conductor approximately 180 degrees about the axis.

Abstract: An X-ray fluoroscopy and imaging and apparatus prevents error in a foot switch having a sensor. The detection sensor detects whether the operator is contacting each switch installed on the foot-switch. The information detected by the sensor is displayed as a textual format and/or an image that are visually recognizable, so that the operator can confirm the accuracy of a contacted-switch indication. Accordingly, the operator can comprehend instantly and accurately information relative to the switch currently selected.

Abstract: A service providing system includes a control server and a physical resource(s) controlled by the control server. The control server has a virtual device providing unit(s) that provides at least one virtual object for controlling a physical resource(s), and a virtual infrastructure providing unit(s) that can provide, as a virtual object(s), a virtual infrastructure(s) configured using at least one virtual object provided by the virtual device providing unit(s), wherein the virtual infrastructure providing unit(s) can configure a virtual infrastructure(s) using the virtual object(s) provided by the virtual infrastructure providing unit(s), and can provide the virtual infrastructure(s) as a virtual object(s).

Abstract: Provided are: a resin modifier with which flexibility, transparency and bleed resistance can be balanced at a high level; a resin composition; and a film using the same. The resin modifier includes a random copolymer composed of a structural unit derived from an aliphatic dibasic acid, a structural unit derived from an alkylenediol, and a structural unit derived from a polyalkylene ether glycol, which random copolymer has a hydroxyl group or a carboxyl group at a terminal. The polyalkylene ether glycol is preferably a polyethylene ether glycol, and the alkylenediol is preferably at least one selected from the group consisting of ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 2-methyl-1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, and hexanediol.

Abstract: A manufacturing method of a carrier for a double-side polishing apparatus, including: preparing a carrier base material and insert thicker than the carrier base material, inserting the insert into a holding hole so as to protrude the insert from both sides of the front surface and back surface of the carrier base material, measuring each of a front protruding amount of the insert protruded from front surface of the carrier base material and a back protruding amount of the insert protruded from back surface of the carrier base material, setting each rotational speed of the upper turn table and lower turn table in starting-up polishing of the carrier so as to decrease the difference between the front protruding amount and back protruding amount, and a starting-up polishing step to subject the carrier to starting-up polishing at each set rotational speed of the upper turn table and the lower turn table.

Abstract: A semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes a middle region which is configured between an upper region and a lower region; a doping concentration of a first conductivity type in the middle region is lower than the doping concentration of the first conductivity type in a drift layer. Therefore, a depletion layer may be extended and connected to the lower region when a backward biasing voltage is applied; an electric field of the upper region may be reduced.

Abstract: Provided are a gas detection method and a gas detector which have a high durability to silicone poisoning and is capable of detecting the type and the concentration of a target gas to be detected with certain accuracy even when the detector is used in an environment where a silicone compound exists. The gas detector employs a contact combustion-type gas sensor which includes two gas detection elements, each intermittently driven, and in which only one gas detection element is supplied with a gas through a silicone removal filter. Acquired in an energization duration of each of the gas detection elements are two or more pieces of output data by the one gas detection element and two or more pieces of output data by the other gas detection element, which constitutes output variation patterns for a test gas.

Abstract: Provided is a gas detector which has a high durability to silicone poisoning and of which power consumption is reduced. The gas detector includes a contact combustion-type gas sensor and detects a paraffinic hydrocarbon gas, a solvent gas, and a hydrogen gas. The contact combustion-type gas sensor is configured to include two gas detection elements that are disposed in two detection chambers partitioned from each other, respectively, and the gas inlet of one detection chamber is provided with a silicone removal filter. The paraffinic hydrocarbon gas is detected by one gas detection element disposed in the one detection chamber which is provided with the silicone removal filter. Furthermore, the solvent gas is detected by the other gas detection element which is disposed in the other detection chamber. Still furthermore, the hydrogen gas is detected by either the one gas detection element or the other gas detection element.