Patents by Inventor Yuki Tateyama

Yuki Tateyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10173408
    Abstract: In a peeling starting portion preparing method of a laminate, for the laminate including a first substrate and a second substrate peelably attached via an adsorption layer, a knife is inserted with a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer so as to prepare the peeling starting portion at the interface. The knife includes a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, and at least a part of the adsorption layer is scraped off by a ridge line portion including the ridge line.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: January 8, 2019
    Assignee: AGC Inc.
    Inventors: Yuki Tateyama, Yasunori Ito, Hiroshi Utsugi
  • Publication number: 20170266947
    Abstract: In a peeling starting portion preparing method of a laminate, for the laminate including a first substrate and a second substrate peelably attached via an adsorption layer, a knife is inserted with a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer so as to prepare the peeling starting portion at the interface. The knife includes a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, and at least a part of the adsorption layer is scraped off by a ridge line portion including the ridge line.
    Type: Application
    Filed: June 7, 2017
    Publication date: September 21, 2017
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Yuki TATEYAMA, Yasunori ITO, Hiroshi UTSUGI
  • Patent number: 6031026
    Abstract: In a first step, a crosslinkable organopolysiloxane oil (2) is mixed with an inorganic filler (3) in a flow jet mixer (1) to form a flowing silicone rubber compound. In a second step, the silicone rubber compound is fed into a tank (6) equipped at the bottom with a vacuum discharge pump (8) and maintained in vacuum where the compound is continuously deaerated, and a thixotropy controlling agent (10) is then added and mixed with the compound in a mixer (9). In a third step, a crosslinking agent (12) is added and mixed with the silicone rubber compound in a KRC kneader (11), and the compound is degassed in a mixer (13). The process continuously produces an RTV silicone rubber composition which is anti-sagging and improved in applicability on use.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: February 29, 2000
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yuki Tateyama, Yoshiharu Konya, Takao Kanaya
  • Patent number: 5266631
    Abstract: The present process of producing a room temperature curable organopolysiloxane composition is characterized in that an organopolysiloxane represented by the following general formula (1) or (2): ##STR1## wherein X represents a hydrolyzable group such as an alkoxy group, R.sup.1 and R.sup.2 each represent a monovalent hydrocarbon group such as an alkyl group and a phenyl group, n is a positive integer, and a is 2 or 3, and a finely divided silica are mixed and thereafter a condensation catalyst is mixed. According to the present process, a curable composition which will not slump can be obtained without using a slump preventive.
    Type: Grant
    Filed: June 12, 1992
    Date of Patent: November 30, 1993
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masatoshi Arai, Kazutoshi Fujioka, Yuki Tateyama
  • Patent number: 4328150
    Abstract: The invention provides a novel epoxy-based curable resin composition suitable for encapsulation of electronic devices such as transistors, ICs, LSIs and the like. The composition comprises an epoxy compound, a novolac-type phenolic resin as the curing agent, an organophosphine compound such as triphenylphosphine and trilaurylphosphine as a curing accelerator and an inorganic filler. The advantages obtained by the combined use of the novolac-type phenolic resin and the organophosphine compound are very specific and the resin composition is imparted with remarkable flowability in molding and stability in storage in addition to the excellent electric properties at high temperatures and anti-moisture resistance of the cured shaped articles molded therefrom.
    Type: Grant
    Filed: March 12, 1981
    Date of Patent: May 4, 1982
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kiyohiro Kondow, Tetuo Yoshida, Yuki Tateyama