Patents by Inventor Yuki TERADO

Yuki TERADO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor element driving circuit and semiconductor element driving device
    Patent number: 11990894
    Abstract: A semiconductor device includes a first switch and a first driver. The first switch selects and outputs one of a power supply potential and a generated potential as a first switch output potential based on a synchronization signal from a transmission circuit and a delayed signal delayed from the synchronization signal. The first driver charges a gate of a bipolar transistor element based on the synchronization signal of the transmission circuit and the first switch output potential.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: May 21, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Jun Fukudome, Kazuya Hokazono, Mitsutaka Hano, Yuki Terado
  • Semiconductor package with plurality of grooves on lower surface
    Patent number: 11798869
    Abstract: A semiconductor package includes: a plurality of die pads; a plurality of semiconductor chips provided on the plurality of die pads respectively; a plurality of lead terminals connected to the plurality of semiconductor chips respectively; and a package sealing the plurality of die pads, the plurality of semiconductor chips, and the plurality of lead terminals, the plurality of die pads and the plurality of lead terminals are exposed from a lower surface of the package, and on the lower surface of the package, grooves are provided among the die pads adjacent to one another and among the lead terminals adjacent to one another.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: October 24, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuki Terado, Shiori Uota, Shinji Sakai
  • SEMICONDUCTOR ELEMENT DRIVING CIRCUIT AND SEMICONDUCTOR ELEMENT DRIVING DEVICE
    Publication number: 20230076712
    Abstract: A semiconductor device includes a first switch and a first driver. The first switch selects and outputs one of a power supply potential and a generated potential as a first switch output potential based on a synchronization signal from a transmission circuit and a delayed signal delayed from the synchronization signal. The first driver charges a gate of a bipolar transistor element based on the synchronization signal of the transmission circuit and the first switch output potential.
    Type: Application
    Filed: June 1, 2022
    Publication date: March 9, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Jun FUKUDOME, Kazuya HOKAZONO, Mitsutaka HANO, Yuki TERADO
  • SEMICONDUCTOR PACKAGE
    Publication number: 20220278029
    Abstract: A semiconductor package includes: a plurality of die pads; a plurality of semiconductor chips provided on the plurality of die pads respectively; a plurality of lead terminals connected to the plurality of semiconductor chips respectively; and a package sealing the plurality of die pads, the plurality of semiconductor chips, and the plurality of lead terminals, the plurality of die pads and the plurality of lead terminals are exposed from a lower surface of the package, and on the lower surface of the package, grooves are provided among the die pads adjacent to one another and among the lead terminals adjacent to one another.
    Type: Application
    Filed: August 16, 2021
    Publication date: September 1, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuki TERADO, Shiori UOTA, Shinji SAKAI