Patents by Inventor Yuki TOKIMATSU

Yuki TOKIMATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11522443
    Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: December 6, 2022
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Ryosuke Tsumagari, Shigekatsu Nagatomo, Yuto Kubo, Yuki Tokimatsu
  • Publication number: 20200321858
    Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Ryosuke TSUMAGARI, Shigekatsu NAGATOMO, Yuto KUBO, Yuki TOKIMATSU
  • Patent number: 10491134
    Abstract: An electrical machine includes a first substrate, a second substrate, and a conduction support. The first substrate has a mounting surface. The second substrate is disposed in an overlay direction from the first substrate. The conduction support electrically grounds the second substrate and supports the second substrate while keeping approximately no contact with the mounting surface of the first substrate.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: November 26, 2019
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Ryosuke Tsumagari, Tetsuo Yanagimoto, Makoto Nakaya, Yuki Tokimatsu
  • Publication number: 20170077832
    Abstract: An electrical machine includes a first substrate, a second substrate, and a conduction support. The first substrate has a mounting surface. The second substrate is disposed in an overlay direction from the first substrate. The conduction support electrically grounds the second substrate and supports the second substrate while keeping approximately no contact with the mounting surface of the first substrate.
    Type: Application
    Filed: August 24, 2016
    Publication date: March 16, 2017
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Ryosuke TSUMAGARI, Tetsuo YANAGIMOTO, Makoto NAKAYA, Yuki TOKIMATSU