Patents by Inventor Yuki Tsutsumi

Yuki Tsutsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210054152
    Abstract: Provided are a heat-curable resin composition capable of being turned into a cured product having a high glass-transition temperature, a low dielectric tangent and a superior adhesion to a metal foil; and an adhesive agent, film, prepreg, laminate, circuit board as well as printed-wiring board using such heat-curable resin composition. The heat-curable resin composition contains: (A) a polyphenylene ether resin having reactive double bonds at molecular chain ends; (B) a (meth)acrylic acid ester compound; (C) a cyclic imide compound containing, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (D) a reaction initiator.
    Type: Application
    Filed: July 28, 2020
    Publication date: February 25, 2021
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Hiroyuki IGUCHI, Atsushi TSUURA, Naoyuki KUSHIHARA, Yuki KUDO
  • Publication number: 20210024139
    Abstract: A method for producing a vehicle rear module that includes: a clear member monolithically including a lamp section and a window section; and a colored member for shielding at least part of a vehicle interior from the exterior. The method for producing the vehicle rear module comprises: a step for injecting a transparent resin from a single resin injection hole into a first cavity to form the clear member; and a step for injecting a colored resin from a plurality of resin injection holes into a second cavity to form the colored member.
    Type: Application
    Filed: March 19, 2019
    Publication date: January 28, 2021
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Yasuaki Tsutsumi, Daisuke Mochizuki, Hideaki Yamamoto, Takenao Yoshimura, Yuki Takahashi, Masaaki Nakabayashi, Hiroaki Hara, Masayuki Kobayashi, Masaru Kaneko
  • Publication number: 20210017337
    Abstract: Provided are a novel aromatic bismaleimide compound capable of being turned into a film without using a film-forming agent, and dissolved even in a solvent other than a high-boiling aprotic polar solvent; a production method of such compound; and a heat-curable cyclic imide resin composition that contains such compound, and is capable of being cured at a low temperature and turned into a cured product superior in mechanical properties, heat resistance, relative permittivity, dielectric tangent, moisture resistance and adhesiveness. The aromatic bismaleimide compound is represented by the following formula (1): wherein X1 independently represents a divalent group, m represents a number of 1 to 30, n represents a number of 1 to 5, each of A1 and A2 independently represents a divalent aromatic group. The heat-curable cyclic imide resin composition contains the above compound as a component (A), a reaction initiator (B) and an organic solvent (C).
    Type: Application
    Filed: July 7, 2020
    Publication date: January 21, 2021
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Yuki KUDO, Hiroyuki IGUCHI, Atsushi TSUURA
  • Patent number: 10865304
    Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 15, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoyuki Kushihara, Yuki Kudo, Kazuaki Sumita, Yoshihiro Tsutsumi, Yoshihira Hamamoto
  • Publication number: 20200387569
    Abstract: At least one processor of a sentence extraction system specifies at least one candidate sentence based on a predetermined extraction condition, the candidate sentence being a candidate for a sentence to be extracted from among a plurality of sentences; specifies at least one linked sentence that has a link to the at least one candidate sentence; and determines whether to extract the at least one linked sentence, based on whether to extract the at least one candidate sentence.
    Type: Application
    Filed: June 6, 2019
    Publication date: December 10, 2020
    Inventors: Yuki NAKAYAMA, Makoto TSUTSUMI, Koji MURAKAMI
  • Publication number: 20200325334
    Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.
    Type: Application
    Filed: March 24, 2020
    Publication date: October 15, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki IGUCHI, Yoshinori TAKAMATSU, Yuki KUDO, Atsushi TSUURA, Yoshihiro TSUTSUMI
  • Publication number: 20200317916
    Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.
    Type: Application
    Filed: March 24, 2020
    Publication date: October 8, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Hiroyuki IGUCHI, Yuki KUDO, Atsushi TSUURA
  • Patent number: 10793712
    Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 6, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Naoyuki Kushihara, Norifumi Kawamura, Yuki Kudo
  • Publication number: 20200223775
    Abstract: A carbon dioxide electrolytic device of an embodiment includes: an anode part including an anode which oxidizes water or hydroxide ions to produce oxygen; a cathode part including a cathode which reduces carbon dioxide to produce a carbon compound, a cathode solution flow path which supplies a cathode solution to the cathode, and a gas flow path which supplies carbon dioxide to the cathode; a separator which separates the anode part and the cathode part; and a differential pressure control unit which controls a differential pressure between a pressure of the cathode solution and a pressure of the carbon dioxide so as to adjust a production amount of the carbon dioxide produced by a reduction reaction in the cathode part.
    Type: Application
    Filed: March 26, 2020
    Publication date: July 16, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yuki KUDO, Akihiko ONO, Masakazu YAMAGIWA, Eishi TSUTSUMI, Yoshitsune SUGANO, Ryota KITAGAWA, Jun TAMURA, Satoshi MIKOSHIBA
  • Patent number: 10659062
    Abstract: A lock detector (8) detects an unlocked state from an output of a phase frequency comparator (1). A counter (9) counts a reference signal, in a case where an unlocked state is detected by the lock detector (8). A parameter controlling circuit (10) acquires the count value of the counter (9), and controls switching on and off of a switch (12) for a D/A converter (11) that generates a signal to be added to an output of a loop filter (3), and the output voltage of the D/A converter (11) so that the count value of the counter (9) falls within a set value.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 19, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yuki Yanagihara, Koji Tsutsumi, Mitsuhiro Shimozawa
  • Patent number: 10646934
    Abstract: The negative land includes: a first region in which a space between the upper cutting edge and the lower cutting edge becomes wider toward the outer circumferential surface; and a second region which is continuous to the first region and in which the space becomes wider toward the rotation axis. In a cross section perpendicular to the rotation axis, the rake face includes a return face continuous to the outer circumferential surface, the return face being recessed opposite to a rotation direction of the drill. When a first boundary represents a boundary between the outer circumferential surface and the first region and a second boundary represents a boundary between the first region and the second region, a length of the first boundary is larger than a length of the second boundary in a direction parallel to the rotation axis. The second boundary is continuous to the return face.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: May 12, 2020
    Assignee: Sumitomo Electric Hardmetal Corp.
    Inventors: Yuki Tsutsumi, Masaaki Jindai, Hirofumi Tamanishi
  • Patent number: 10597787
    Abstract: An electrochemical reaction device includes: an electrolytic solution tank to store an electrolytic solution; an oxidation electrode disposed in the electrolytic solution tank; a reduction electrode disposed in the electrolytic solution tank; and a generator connected to the oxidation electrode and the reduction electrode. At least one of the oxidation electrode or the reduction electrode has a porous structure containing fine pores.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: March 24, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akihiko Ono, Satoshi Mikoshiba, Yuki Kudo, Ryota Kitagawa, Jun Tamura, Eishi Tsutsumi, Yoshitsune Sugano, Masakazu Yamagiwa
  • Patent number: 10590550
    Abstract: An electrochemical reaction device includes a first unit group having a plurality of first electrochemical reaction units and a second unit group having a plurality of second electrochemical reaction units. Respective electrolytic tanks of the plurality of first electrochemical reaction units are serially connected with each other. Respective electrolytic tanks of the plurality of second electrochemical reaction units are serially connected with each other. The electrolytic tanks of the plurality of second electrochemical reaction units are parallelly connected to the electrolytic tanks of the plurality of first electrochemical reaction units.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: March 17, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akihiko Ono, Satoshi Mikoshiba, Yuki Kudo, Ryota Kitagawa, Jun Tamura, Yoshitsune Sugano, Eishi Tsutsumi, Masakazu Yamagiwa
  • Publication number: 20200083894
    Abstract: A phase-frequency comparator compares a reference signal with an output signal from a variable frequency divider, and outputs an up signal of frequency and a down signal of frequency depending on results of the comparison. An AND circuit performs an AND operation between the up signal and the down signal, and outputs a result of the operation as a retiming si al CLKretime. A flip-flop circuit holds an output signal from a frequency control circuit at timing of the output signal from the AND circuit, and outputs the held output signal. At ?? modulator determines a division ratio for the variable frequency divider on the basis of the output from the flip-flop circuit.
    Type: Application
    Filed: July 4, 2017
    Publication date: March 12, 2020
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji TSUTSUMI, Yuki YANAGIHARA, Mitsuhiro SHIMOZAWA
  • Publication number: 20200079954
    Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 12, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki KUSHIHARA, Yuki KUDO, Kazuaki SUMITA, Yoshihiro TSUTSUMI, Yoshihira HAMAMOTO
  • Publication number: 20200048464
    Abstract: Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.
    Type: Application
    Filed: July 26, 2019
    Publication date: February 13, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Naoyuki KUSHIHARA, Norifumi KAWAMURA, Yoshihira HAMAMOTO, Yuki KUDO
  • Publication number: 20200048455
    Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.
    Type: Application
    Filed: July 26, 2019
    Publication date: February 13, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Naoyuki KUSHIHARA, Yuki KUDO, Norifumi KAWAMURA, Yoshihira HAMAMOTO
  • Publication number: 20200048454
    Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.
    Type: Application
    Filed: July 3, 2019
    Publication date: February 13, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Naoyuki KUSHIHARA, Norifumi KAWAMURA, Yuki KUDO
  • Patent number: 10550488
    Abstract: The present embodiments provide: a reduction catalyst having high reaction efficiency, a reduction reactor including the same and a reduction method using the same. This catalyst includes a conductor and an organic layer comprises organic modifying groups capable of binding to the surface of the conductor, wherein the organic modifying groups contain a nitrogen-containing heterocycle.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: February 4, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Arisa Yamada, Satoshi Mikoshiba, Akihiko Ono, Yuki Kudo, Jun Tamura, Ryota Kitagawa, Eishi Tsutsumi, Masakazu Yamagiwa, Yoshitsune Sugano, Asahi Motoshige, Tomohito Ide
  • Patent number: 10544513
    Abstract: An electrochemical reaction device includes: a first electrolytic solution tank having a first storage part and a second storage part; a second electrolytic solution tank having a third storage part and a fourth storage part; a first reduction electrode layer immersed in a first electrolytic solution; a first oxidation electrode layer immersed in a second electrolytic solution; a first generator electrically connected to the first reduction electrode and the first oxidation electrode layer; a second reduction electrode layer immersed in a third electrolytic solution; a second oxidation electrode layer immersed in a fourth electrolytic solution; a second generator electrically connected to the second reduction electrode and the second oxidation electrode layer; and at least one flow path out of a first flow path connecting the first storage part and the fourth storage part and a second flow path connecting the second storage part and the third storage part.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: January 28, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akihiko Ono, Satoshi Mikoshiba, Jun Tamura, Ryota Kitagawa, Yuki Kudo, Eishi Tsutsumi, Masakazu Yamagiwa, Yoshitsune Sugano