Patents by Inventor Yuki Tuji
Yuki Tuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9305958Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.Type: GrantFiled: January 15, 2015Date of Patent: April 5, 2016Assignee: SONY CORPORATIONInventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
-
Publication number: 20150123234Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.Type: ApplicationFiled: January 15, 2015Publication date: May 7, 2015Applicant: SONY CORPORATIONInventors: Hiroki HAGIWARA, Keiji SASANO, Hiroaki TANAKA, Yuki TUJI, Tsuyoshi WATANABE, Koji TSUCHIYA, Kenzo TANAKA, Takaya WADA, Noboru KAWABATA, Hirokazu YOSHIDA, Hironori YOKOYAMA
-
Patent number: 8947593Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.Type: GrantFiled: April 3, 2014Date of Patent: February 3, 2015Assignee: Sony CorporationInventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
-
Publication number: 20140218573Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.Type: ApplicationFiled: April 3, 2014Publication date: August 7, 2014Applicant: SONY CORPORATIONInventors: Hiroki HAGIWARA, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
-
Patent number: 8711280Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.Type: GrantFiled: June 22, 2012Date of Patent: April 29, 2014Assignee: Sony CorporationInventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
-
Publication number: 20130010145Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.Type: ApplicationFiled: June 22, 2012Publication date: January 10, 2013Applicant: Sony CorporationInventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama