Patents by Inventor Yuki Umemura

Yuki Umemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240021439
    Abstract: A wiring board manufacturing method including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface toward an opposite surface thereof; a step B of forming, on the first surface of the glass substrate, a first surface wiring layer including a hydrofluoric acid resistant metal film and a copper layer; a step C of etching a surface of the glass substrate opposite to the first surface to form a through via in the laser-modified portion and form a second surface of the glass substrate, the second surface being an opposite surface to the first surface; a through via treatment step D of removing an etching residue of glass adhered to the hydrofluoric acid resistant metal film; and a step E of forming a through electrode in the through via.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 18, 2024
    Applicant: TOPPAN INC.
    Inventors: Tomoyuki ISHII, Takehisa TAKADA, Yuki UMEMURA
  • Publication number: 20240014047
    Abstract: A method for manufacturing a wiring board, including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface to an opposite surface of the glass substrate; a step B of forming a first surface wiring layer including a MIM capacitor on the first surface of the glass substrate; a step C of performing an etching process on a surface of the glass substrate opposite to the first surface to form a through via in the laser-modified portion and form a second surface of the glass substrate opposite to the first surface; and a step D of forming a through electrode in the through via and forming, on the second surface, a second surface wiring layer that is connected to the first surface wiring layer via the through electrode.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 11, 2024
    Applicant: TOPPAN INC.
    Inventors: Yuki UMEMURA, Takehisa TAKADA, Tomoyuki ISHII
  • Publication number: 20230240009
    Abstract: A wiring board includes a first wiring layer disposed on the first adhesion layer; and a second wiring layer disposed on the second adhesion layer, wherein a proportion of copper remaining in the first wiring layer is represented by C=B/A (%), where A is a total area of the first wiring layer, B is an area of copper in the first wiring layer, and C is a remaining copper ratio C defined as the proportion of copper remaining in the first wiring layer, and wherein when the remaining copper ratio C is set to 70 to 100%, the first adhesion layer is comprised of at least one material having a first predetermined Young's modulus, and the first wiring layer is comprised of at least one material having a second predetermined Young's modulus, the first predetermined Young's modulus being 0.1 to 0.85 times the second predetermined Young's modulus.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Applicant: TOPPAN INC.
    Inventors: Takeshi TAKADA, Yuki UMEMURA
  • Publication number: 20220396496
    Abstract: An electrode active material for lithium-ion secondary batteries that has a sufficiently high initial capacity, improved charge-and-discharge cycle characteristics, and improved coulombic efficiency in the mid-term charge-and-discharge cycles can be obtained by a phosphorus-containing low-crystalline vanadium sulfide comprising vanadium, phosphorus, and sulfur as constituent elements, the composition ratio of the phosphorus to the vanadium (P/V) being 0.1 to 1.0 in terms of the molar ratio, the composition ratio of the sulfur to the vanadium (S/V) being 4.00 to 10.00 in terms of the molar ratio.
    Type: Application
    Filed: August 26, 2020
    Publication date: December 15, 2022
    Inventors: Yuki Umemura, Tomonari Takeuchi, Hikari Sakaebe
  • Publication number: 20210351094
    Abstract: A package substrate that prevents breakage of a core substrate is provided. A package substrate includes a core substrate made of a brittle material, at least one insulating layer formed on one surface or both surfaces of the core substrate, and one or more wiring layers formed on the insulating layer and/or in the insulating layer, the core substrate being exposed from an outer peripheral portion of the insulating layer, and the insulating layer being chamfered.
    Type: Application
    Filed: July 15, 2021
    Publication date: November 11, 2021
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Yuki UMEMURA, Akane KOBAYASHI
  • Patent number: 10293597
    Abstract: According to one embodiment, a tablet printing apparatus includes: a conveyor belt that includes a suction hole connected to a suction chamber, and conveys a tablet while sucking the tablet to the suction hole; an ink jet print head that has a nozzle surface where a nozzle is formed, and is located above the conveyor belt such that the nozzle surface faces the conveyor belt, and performs printing on the tablet conveyed by the conveyor belt; and a control plate that is located on the upstream side of the print head in the conveying direction of the tablet between the conveyor belt and the height position of the nozzle surface of the print head, and controls an airflow generated between the conveyor belt and the print head.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: May 21, 2019
    Assignee: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Azusa Hirano, Yasutsugu Tsuruoka, Yuki Umemura, Junsuke Komito
  • Patent number: 10220640
    Abstract: According to one embodiment, a tablet printing apparatus includes: a conveyor belt including a suction hole to suck a tablet; and an ink jet print head configured to perform printing on the tablet; wherein the conveyor belt further includes a plurality of protrusions formed around the suction hole and configured to support the tablet in contact with the tablet, and a recess formed between the protrusions and communicated with the suction hole, each of the protrusions has a bottom surface, an upper surface, area of which is smaller than that of the bottom surface, and a side surface having an inclined surface, the protrusions support the tablet such that a gap is formed between a surface of the tablet on conveyor belt side and the suction hole, and a suction force is applied to the gap and space of the recess through the suction hole to suck the tablet.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: March 5, 2019
    Assignee: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Yasutsugu Tsuruoka, Hironori Haijima, Toru Kuribayashi, Yuki Umemura
  • Publication number: 20180311974
    Abstract: According to one embodiment, a tablet printing apparatus includes: a conveyor belt including a suction hole to suck a tablet; and an ink jet print head configured to perform printing on the tablet; wherein the conveyor belt further includes a plurality of protrusions formed around the suction hole and configured to support the tablet in contact with the tablet, and a recess formed between the protrusions and communicated with the suction hole, each of the protrusions has a bottom surface, an upper surface, area of which is smaller than that of the bottom surface, and a side surface having an inclined surface, the protrusions support the tablet such that a gap is formed between a surface of the tablet on conveyor belt side and the suction hole, and a suction force is applied to the gap and space of the recess through the suction hole to suck the tablet.
    Type: Application
    Filed: April 26, 2018
    Publication date: November 1, 2018
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Yasutsugu Tsuruoka, Hironori Haijima, Toru Kuribayashi, Yuki Umemura
  • Publication number: 20180229493
    Abstract: According to one embodiment, a tablet printing apparatus includes: a conveyor belt that includes a suction hole connected to a suction chamber, and conveys a tablet while sucking the tablet to the suction hole; an ink jet print head that has a nozzle surface where a nozzle is formed, and is located above the conveyor belt such that the nozzle surface faces the conveyor belt, and performs printing on the tablet conveyed by the conveyor belt; and a control plate that is located on the upstream side of the print head in the conveying direction of the tablet between the conveyor belt and the height position of the nozzle surface of the print head, and controls an airflow generated between the conveyor belt and the print head.
    Type: Application
    Filed: February 15, 2018
    Publication date: August 16, 2018
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Azusa HIRANO, Yasutsugu Tsuruoka, Yuki Umemura, Junsuke Komito