Abstract: To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.

Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member separating the first and second electrode layers. The insulating member has a tapered shape in cross section. With the above configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the insulating member has a tapered shape in cross section, adhesion performance of the insulating member can be enhanced, thus making it possible to prevent short-circuit between the first and second electrode layers.

Abstract: To provide a thin film capacitor in which warpage is less likely to occur. A thin film capacitor includes: a metal foil having roughened upper and lower surfaces; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a dielectric film covering the lower surface of the metal foil and made of a dielectric material having a thermal expansion coefficient smaller than that of the metal foil; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the first dielectric film without contacting the metal foil. The lower surface of the metal foil is thus covered with the dielectric film having a small thermal expansion coefficient, thereby making it possible to prevent the occurrence of warpage.

Abstract: To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle ?a formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

Abstract: To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same plane. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the metal foil is surface-roughened, a larger capacitance can be obtained.

Abstract: To provide a thin film capacitor having high flexibility. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The particle diameter of crystal at a non-roughened center part of the metal foil is less than 15 ?m in the planar direction and less than 5 ?m in the thickness direction. This can not only enhance the flexibility of the metal foil to reduce a short-circuit failure in a state where the thin film capacitor is incorporated in a multilayer substrate but also enhance positional accuracy.

Abstract: To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.

Abstract: To provide a thin film capacitor having high adhesion performance with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The first and second electrode layers are formed in an area surrounded by an outer peripheral area of the upper surface of the metal foil so as not to cover the outer peripheral area. The outer peripheral area of the roughened upper surface of the metal foil is thus exposed, so that adhesion performance with respect to a circuit substrate can be enhanced.

Abstract: An object is to provide a technique that can suppress wet-spreading of an adhesive used to bond a case and a metal base to each other and secure the height position of the adhesive required to fill a gap created between the case and the metal base. A semiconductor device includes a metal base, an insulating substrate arranged on the metal base, a semiconductor element mounted on the insulating substrate, and a case bonded on the metal base so as to surround side surfaces of the insulating substrate and the semiconductor element, in which a pair of metal oxide films having a protruding shape is provided on a peripheral edge portion of the metal base, and the case is bonded to the metal base by an adhesive arranged in a region between the metal oxide films in the pair.

Abstract: An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.

Abstract: An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.

Abstract: A message relay apparatus and a message relay method that achieve high message reachability taking communication network situation into consideration are provided. A message relay apparatus 100 interposed between an application 20 and a device 30 includes a device communication state determination functional unit 131 that determines communication availability with the device 30, a network state estimation unit 133 that estimates a network state based on the communication availability, and a message processing unit 110 that determines forwarding availability of an application message based on the network state and buffers the application message when forwarding is not available.

Abstract: A duct includes: a tube that is formed to extend from an indoor of a building or a movable body and that allows an outside and the indoor to communicate with each other; an electromagnetic wave inhibiting sloped surface that is formed on an inner surface of the tube and extends to be sloped to approach an axial line of the tube from the outside toward the indoor in an axial direction of the tube and that reflects an electromagnetic wave; and an electromagnetic wave selecting inner peripheral member that has a tubular shape covering the electromagnetic wave inhibiting sloped surface from an inner peripheral side and is capable of selectively transmitting only an electromagnetic wave of a specific frequency incident on the tube.

Abstract: An evaluating method includes an evaluating step of evaluating a state of mild cognitive impairment for a subject to be evaluated, using (i) at least one value of concentration values of Put, ?-ABA, Ala, Arg, Asn, Cit, Glu, Gln, Gly, His, Ile, Leu, Lys, Met, Orn, Phe, Pro, Ser, Thr, Trp, Tyr, Val, Taurine, 1-MeHis, 3-MeHis, aAAA, aAiBA, ADMA, Allyl Cys, bABA, bAiBA, Cystathionine, Cysteic acid, EtGly, GABA, hArg, Hypotaurine, Hypro, Kyn, Pyrazole-1-Ala, MCSO, MeCys, N6-AcLys, N8-AcSpd, Opthalmic acid, PEA, Pipecolic acid, Sar, SDMA, Spd, Spm, and Thioproline and test values of Alb, Folate, WBC, RBC, Hb, Ht, and PLT in blood of the subject, or (ii) a value of a formula including an explanatory variable to be substituted with the at least one value, calculated using the at least one value and the formula.

Abstract: In order to enable support information to be presented at a timing that is appropriate for a user, a movement support information presentation control apparatus according to an embodiment of the present invention estimates an audio environment and a visual environment that surrounds the user in addition to a driving performance of the user and an operation state of a driving apparatus 2. In addition, based on these estimation results, suitability of information presentation is determined for each type of presentation sections 81 to 83 and, when it is determined that information presentation is not suitable, control is performed so as to postpone an information presentation operation by a corresponding presentation section.

Abstract: A duct includes: a tube that is formed to extend from an indoor of a building or a movable body and that allows an outside and the indoor to communicate with each other; an electromagnetic wave inhibiting sloped surface that is formed on an inner surface of the tube and extends to be sloped to approach an axial line of the tube from the outside toward the indoor in an axial direction of the tube and that reflects an electromagnetic wave; and an electromagnetic wave selecting inner peripheral member that has a tubular shape covering the electromagnetic wave inhibiting sloped surface from an inner peripheral side and is capable of selectively transmitting only an electromagnetic wave of a specific frequency incident on the tube.

Abstract: An aircraft sensor system includes an aircraft sensor module provided in an aircraft. The sensor module is an outdoor temperature sensor module configured to measure outdoor temperature of the aircraft. The sensor module includes an energy harvesting element configured to generate power from vibration generated by the aircraft; a power storage unit configured to store power generated by the energy harvesting element; a sensor configured to operate by the power from at least one of the energy harvesting element and the power storage unit; and a wireless communication unit configured to operate by at least one of the power from the energy harvesting element and the power from the power storage unit, and transmit measurement data measured by the sensor to an external device via wireless communication. The sensor module is provided to a wing tip end portion that is a free end of a wing body of the aircraft.

Abstract: An evaluating method includes an evaluating step of evaluating a state of mild cognitive impairment or Alzheimer's disease for a subject to be evaluated using a concentration value of at least one of ?-ABA, Ala, Arg, Asn, Cit, Gln, Glu, Gly, His, Ile, Leu, Lys, Met, Orn, Phe, Pro, Ser, Thr, Trp, Tyr, Val, Cysteine, Taurine, GABA, Hypotaurine, S-Adenosyl homocysteine, Sarcosine, Serotonin, Spermidine, hCit, 3-hKyn, aAiBA, N8-Acetylspermidine, Phosphoserine, bABA, ADMA, and Thioproline in blood of the subject.

Abstract: An evaluating method includes an evaluating step of evaluating future risk of developing Alzheimer's disease for a subject to be evaluated having mild cognitive impairment using a concentration value of at least one of ?-ABA, Ala, Arg, Asn, Cit, Gln, Glu, Gly, His, Ile, Leu, Lys, Met, Orn, Phe, Pro, Ser, Thr, Trp, Tyr, Val, Cysteine, Taurine, bABA, Ethylglycine, Hypotaurine, 3-Me-His, 5-HydroxyTrp, aAiBA, and N8-Acetylspermidine in blood of the subject.

Abstract: A method is provided for producing an L-amino acid which includes the steps of culturing a bacterium, which belongs to the family Enterobacteriaceae and is able to produce an L-amino acid, in a medium containing glycerol as a carbon source to produce and accumulate an L-amino acid in the medium, and collecting the L-amino acid from the culture. The culture is performed as a fed-batch culture or a continuous culture, and a feed medium containing glycerol is added to the fermentation medium so that the glycerol concentration in the fermentation medium is 5 g/L or higher.