Abstract: A highly stable bond is obtained with variations in the bond being suppressed. A bonding method includes: disposing a temperature measurement unit such that temperatures of a first component and a second component can be measured; measuring the temperatures of the first component and the second component using the temperature measurement unit, with the second component being irradiated with a laser beam; reducing output of the laser beam when the measured temperature of the second component is higher than or equal to a first threshold value; and terminating the output of the laser beam when the measured temperature of the first component is higher than or equal to a second threshold value after the temperature of the second component is higher than or equal to the first threshold value.

Abstract: A power conversion device includes a power converter including a semiconductor module, to convert input power and output the converted power, and a capacitor electrically connected to the semiconductor module. The capacitor includes a capacitor-side terminal surface on which a capacitor-side terminal is arranged, and the capacitor-side terminal surface faces a module-side terminal surface of the semiconductor module.

Abstract: This inspection device includes an infrared acquisition unit for acquiring infrared light detected by an infrared camera for detecting infrared light from an inspected object that includes an electroconductive member, an intensity-determining unit for determining the detection intensity of the infrared light, and a scratch-determining unit for determining whether or not there is a scratch on the electroconductive member on the basis of the detection intensity of the infrared light.

Abstract: An object of the present disclosure is to suppress damage to or occurrence of cracks on an upper surface of a semiconductor element when a bonding material for connecting a metal lead electrode to a semiconductor element is supplied onto the semiconductor element by screen printing. According to the present disclosure, a semiconductor device (101) includes a plurality of semiconductor elements (1), an insulating substrate (2) having a mounting area (2a1) where the plurality of semiconductor elements (1) are mounted on an upper surface thereof and a non-mounting area (2a2) protruding upward from the mounting area (2a1) and where no plurality of semiconductor elements (1) are mounted, and a metal lead electrode (4) bonded to an upper surface of each of the semiconductor elements (1) with a bonding material (3a), in which a difference in height between the mounting area (2a1) and the non-mounting area (2a2) is greater than or equal to a thickness of each of the semiconductor elements (1).

Abstract: The object is to provide a technology for enabling reduction of adhesion of a bonding material to a particular electrode. A semiconductor device includes: a semiconductor element with a surface including a first electrode and a second electrode; a protective film formed on the surface of the semiconductor element and having insulating properties, the protective film exposing the first electrode and the second electrode; a metal lead electrode bonded to the first electrode exposed from the protective film; and a bonding material with which the first electrode exposed from the protective film is bonded to the metal lead electrode. The metal lead electrode includes an abutment portion being a protrusion abutting the protective film and blocking between the bonding material and the second electrode in a cross-sectional view.

Abstract: An object is to provide a technique that can suppress wet-spreading of an adhesive used to bond a case and a metal base to each other and secure the height position of the adhesive required to fill a gap created between the case and the metal base. A semiconductor device includes a metal base, an insulating substrate arranged on the metal base, a semiconductor element mounted on the insulating substrate, and a case bonded on the metal base so as to surround side surfaces of the insulating substrate and the semiconductor element, in which a pair of metal oxide films having a protruding shape is provided on a peripheral edge portion of the metal base, and the case is bonded to the metal base by an adhesive arranged in a region between the metal oxide films in the pair.

Abstract: A semiconductor device includes an insulating substrate having a circuit pattern, a plurality of semiconductor elements bonded onto the circuit pattern via first bonding portions, and a lead electrode to which each of the plurality of semiconductor elements is bonded via a second bonded portion, wherein the lead electrode is composed of a plurality of lead electrode pieces crossing at least one semiconductor element of the plurality of semiconductor elements, and the plurality of lead electrode pieces are bonded to each other via third bonded portions.

Abstract: A message relay apparatus and a message relay method that achieve high message reachability taking communication network situation into consideration are provided. A message relay apparatus 100 interposed between an application 20 and a device 30 includes a device communication state determination functional unit 131 that determines communication availability with the device 30, a network state estimation unit 133 that estimates a network state based on the communication availability, and a message processing unit 110 that determines forwarding availability of an application message based on the network state and buffers the application message when forwarding is not available.

Abstract: An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.

Abstract: A power conversion device includes a power converter including a semiconductor module, to convert input power and output the converted power, and a capacitor electrically connected to the semiconductor module. The capacitor includes a capacitor-side terminal surface on which a capacitor-side terminal is arranged, and the capacitor-side terminal surface faces a module-side terminal surface of the semiconductor module.

Abstract: An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.

Abstract: An object is to provide a technique that can suppress wet-spreading of an adhesive used to bond a case and a metal base to each other and secure the height position of the adhesive required to fill a gap created between the case and the metal base. A semiconductor device includes a metal base, an insulating substrate arranged on the metal base, a semiconductor element mounted on the insulating substrate, and a case bonded on the metal base so as to surround side surfaces of the insulating substrate and the semiconductor element, in which a pair of metal oxide films having a protruding shape is provided on a peripheral edge portion of the metal base, and the case is bonded to the metal base by an adhesive arranged in a region between the metal oxide films in the pair.

Abstract: An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.

Abstract: An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.

Abstract: A message relay apparatus and a message relay method that achieve high message reachability taking communication network situation into consideration are provided. A message relay apparatus 100 interposed between an application 20 and a device 30 includes a device communication state determination functional unit 131 that determines communication availability with the device 30, a network state estimation unit 133 that estimates a network state based on the communication availability, and a message processing unit 110 that determines forwarding availability of an application message based on the network state and buffers the application message when forwarding is not available.

Abstract: A duct includes: a tube that is formed to extend from an indoor of a building or a movable body and that allows an outside and the indoor to communicate with each other; an electromagnetic wave inhibiting sloped surface that is formed on an inner surface of the tube and extends to be sloped to approach an axial line of the tube from the outside toward the indoor in an axial direction of the tube and that reflects an electromagnetic wave; and an electromagnetic wave selecting inner peripheral member that has a tubular shape covering the electromagnetic wave inhibiting sloped surface from an inner peripheral side and is capable of selectively transmitting only an electromagnetic wave of a specific frequency incident on the tube.

Abstract: An evaluating method includes an evaluating step of evaluating a state of mild cognitive impairment for a subject to be evaluated, using (i) at least one value of concentration values of Put, ?-ABA, Ala, Arg, Asn, Cit, Glu, Gln, Gly, His, Ile, Leu, Lys, Met, Orn, Phe, Pro, Ser, Thr, Trp, Tyr, Val, Taurine, 1-MeHis, 3-MeHis, aAAA, aAiBA, ADMA, Allyl Cys, bABA, bAiBA, Cystathionine, Cysteic acid, EtGly, GABA, hArg, Hypotaurine, Hypro, Kyn, Pyrazole-1-Ala, MCSO, MeCys, N6-AcLys, N8-AcSpd, Opthalmic acid, PEA, Pipecolic acid, Sar, SDMA, Spd, Spm, and Thioproline and test values of Alb, Folate, WBC, RBC, Hb, Ht, and PLT in blood of the subject, or (ii) a value of a formula including an explanatory variable to be substituted with the at least one value, calculated using the at least one value and the formula.

Abstract: In order to enable support information to be presented at a timing that is appropriate for a user, a movement support information presentation control apparatus according to an embodiment of the present invention estimates an audio environment and a visual environment that surrounds the user in addition to a driving performance of the user and an operation state of a driving apparatus 2. In addition, based on these estimation results, suitability of information presentation is determined for each type of presentation sections 81 to 83 and, when it is determined that information presentation is not suitable, control is performed so as to postpone an information presentation operation by a corresponding presentation section.

Abstract: A duct includes: a tube that is formed to extend from an indoor of a building or a movable body and that allows an outside and the indoor to communicate with each other; an electromagnetic wave inhibiting sloped surface that is formed on an inner surface of the tube and extends to be sloped to approach an axial line of the tube from the outside toward the indoor in an axial direction of the tube and that reflects an electromagnetic wave; and an electromagnetic wave selecting inner peripheral member that has a tubular shape covering the electromagnetic wave inhibiting sloped surface from an inner peripheral side and is capable of selectively transmitting only an electromagnetic wave of a specific frequency incident on the tube.

Abstract: An aircraft sensor system includes an aircraft sensor module provided in an aircraft. The sensor module is an outdoor temperature sensor module configured to measure outdoor temperature of the aircraft. The sensor module includes an energy harvesting element configured to generate power from vibration generated by the aircraft; a power storage unit configured to store power generated by the energy harvesting element; a sensor configured to operate by the power from at least one of the energy harvesting element and the power storage unit; and a wireless communication unit configured to operate by at least one of the power from the energy harvesting element and the power from the power storage unit, and transmit measurement data measured by the sensor to an external device via wireless communication. The sensor module is provided to a wing tip end portion that is a free end of a wing body of the aircraft.