Patents by Inventor Yuki Yano
Yuki Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12107024Abstract: An object is to provide a technique that can suppress wet-spreading of an adhesive used to bond a case and a metal base to each other and secure the height position of the adhesive required to fill a gap created between the case and the metal base. A semiconductor device includes a metal base, an insulating substrate arranged on the metal base, a semiconductor element mounted on the insulating substrate, and a case bonded on the metal base so as to surround side surfaces of the insulating substrate and the semiconductor element, in which a pair of metal oxide films having a protruding shape is provided on a peripheral edge portion of the metal base, and the case is bonded to the metal base by an adhesive arranged in a region between the metal oxide films in the pair.Type: GrantFiled: February 28, 2022Date of Patent: October 1, 2024Assignee: Mitsubishi Electric CorporationInventors: Takayuki Onaka, Yuki Yano
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Publication number: 20240321720Abstract: A semiconductor device includes an insulating substrate having a circuit pattern, a plurality of semiconductor elements bonded onto the circuit pattern via first bonding portions, and a lead electrode to which each of the plurality of semiconductor elements is bonded via a second bonded portion, wherein the lead electrode is composed of a plurality of lead electrode pieces crossing at least one semiconductor element of the plurality of semiconductor elements, and the plurality of lead electrode pieces are bonded to each other via third bonded portions.Type: ApplicationFiled: September 17, 2021Publication date: September 26, 2024Applicant: Mitsubishi Electric CorporationInventors: Yuki YANO, Yoji KAWAUCHI
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Publication number: 20240282157Abstract: A control unit of an information processing device acquires a request to add an item to a vehicle, acquires first information that is information according to whether the vehicle has a structure for adding an item, determining a fee for adding the item to the vehicle based on the one piece of information and the information about the item, and outputting the information about the fee.Type: ApplicationFiled: January 25, 2024Publication date: August 22, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Nariaki AMANO, Yukinori II, Yusuke MAEDA, Takeshi MURAKAMI, Atsuki SAKURAI, Yuichiro YANO, Yuki KATAI, Yoshiaki SUGIYAMA, Taisei NISHIMORI, Seiichi TAGAWA, Shinichi TAKEDA, Yuta TONE
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Publication number: 20240249208Abstract: An information processing device includes a control unit that executes: obtaining a request to add an item to a vehicle; obtaining first information that is information depending on whether the vehicle has a structure for adding an item; determining a factory that provides a service for adding the item to the vehicle based on the first information and information about the item; and outputting information about the factory.Type: ApplicationFiled: December 8, 2023Publication date: July 25, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Nariaki AMANO, Yukinori II, Yusuke MAEDA, Takeshi MURAKAMI, Atsuki SAKURAI, Yuichiro YANO, Yuki KATAI, Yoshiaki SUGIYAMA, Taisei NISHIMORI, Seiichi TAGAWA, Shinichi TAKEDA, Yuta TONE
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Patent number: 12028725Abstract: A message relay apparatus and a message relay method that achieve high message reachability taking communication network situation into consideration are provided. A message relay apparatus 100 interposed between an application 20 and a device 30 includes a device communication state determination functional unit 131 that determines communication availability with the device 30, a network state estimation unit 133 that estimates a network state based on the communication availability, and a message processing unit 110 that determines forwarding availability of an application message based on the network state and buffers the application message when forwarding is not available.Type: GrantFiled: February 4, 2020Date of Patent: July 2, 2024Assignee: Nippon Telegraph and Telephone CorporationInventors: Kojun Koshiji, Naoki Higo, Takuma Tsubaki, Toshimitsu Tsubaki, Takeshi Kuwahara, Masanao Nakano, Yuki Yano, Takao Kurahashi
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Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device
Patent number: 11901326Abstract: An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.Type: GrantFiled: December 9, 2021Date of Patent: February 13, 2024Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Satoru Ishikawa, Yuki Yano, Shohei Ogawa, Kiyoshi Arai -
Publication number: 20230396181Abstract: A power conversion device includes a power converter including a semiconductor module, to convert input power and output the converted power, and a capacitor electrically connected to the semiconductor module. The capacitor includes a capacitor-side terminal surface on which a capacitor-side terminal is arranged, and the capacitor-side terminal surface faces a module-side terminal surface of the semiconductor module.Type: ApplicationFiled: May 22, 2023Publication date: December 7, 2023Inventors: Yuki YANO, Hiroyuki KUWAHARA, Yoshio MORI, Masamitsu TAKIZAWA, Jun KANDA
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Patent number: 11804414Abstract: An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.Type: GrantFiled: January 4, 2022Date of Patent: October 31, 2023Assignee: Mitsubishi Electric CorporationInventors: Kazuhisa Osada, Yuki Yano, Satoru Ishikawa, Shohei Ogawa
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Publication number: 20220384283Abstract: An object is to provide a technique that can suppress wet-spreading of an adhesive used to bond a case and a metal base to each other and secure the height position of the adhesive required to fill a gap created between the case and the metal base. A semiconductor device includes a metal base, an insulating substrate arranged on the metal base, a semiconductor element mounted on the insulating substrate, and a case bonded on the metal base so as to surround side surfaces of the insulating substrate and the semiconductor element, in which a pair of metal oxide films having a protruding shape is provided on a peripheral edge portion of the metal base, and the case is bonded to the metal base by an adhesive arranged in a region between the metal oxide films in the pair.Type: ApplicationFiled: February 28, 2022Publication date: December 1, 2022Applicant: Mitsubishi Electric CorporationInventors: Takayuki ONAKA, Yuki YANO
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Publication number: 20220310463Abstract: An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.Type: ApplicationFiled: January 4, 2022Publication date: September 29, 2022Applicant: Mitsubishi Electric CorporationInventors: Kazuhisa OSADA, Yuki YANO, Satoru ISHIKAWA, Shohei OGAWA
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Publication number: 20220254749Abstract: An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.Type: ApplicationFiled: December 9, 2021Publication date: August 11, 2022Applicant: Mitsubishi Electric CorporationInventors: Shinsuke ASADA, Satoru ISHIKAWA, Yuki YANO, Shohei OGAWA, Kiyoshi ARAI
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Publication number: 20220210673Abstract: A message relay apparatus and a message relay method that achieve high message reachability taking communication network situation into consideration are provided. A message relay apparatus 100 interposed between an application 20 and a device 30 includes a device communication state determination functional unit 131 that determines communication availability with the device 30, a network state estimation unit 133 that estimates a network state based on the communication availability, and a message processing unit 110 that determines forwarding availability of an application message based on the network state and buffers the application message when forwarding is not available.Type: ApplicationFiled: February 4, 2020Publication date: June 30, 2022Inventors: Kojun Koshiji, Naoki Higo, Takuma TSUBAKI, Toshimitsu Tsubaki, Takeshi Kuwahara, Masanao Nakano, Yuki YANO, Takao KURAHASHI
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Patent number: 11313580Abstract: A duct includes: a tube that is formed to extend from an indoor of a building or a movable body and that allows an outside and the indoor to communicate with each other; an electromagnetic wave inhibiting sloped surface that is formed on an inner surface of the tube and extends to be sloped to approach an axial line of the tube from the outside toward the indoor in an axial direction of the tube and that reflects an electromagnetic wave; and an electromagnetic wave selecting inner peripheral member that has a tubular shape covering the electromagnetic wave inhibiting sloped surface from an inner peripheral side and is capable of selectively transmitting only an electromagnetic wave of a specific frequency incident on the tube.Type: GrantFiled: October 29, 2020Date of Patent: April 26, 2022Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Yuki Yano, Nobuyuki Kamihara
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Publication number: 20210278421Abstract: An evaluating method includes an evaluating step of evaluating a state of mild cognitive impairment for a subject to be evaluated, using (i) at least one value of concentration values of Put, ?-ABA, Ala, Arg, Asn, Cit, Glu, Gln, Gly, His, Ile, Leu, Lys, Met, Orn, Phe, Pro, Ser, Thr, Trp, Tyr, Val, Taurine, 1-MeHis, 3-MeHis, aAAA, aAiBA, ADMA, Allyl Cys, bABA, bAiBA, Cystathionine, Cysteic acid, EtGly, GABA, hArg, Hypotaurine, Hypro, Kyn, Pyrazole-1-Ala, MCSO, MeCys, N6-AcLys, N8-AcSpd, Opthalmic acid, PEA, Pipecolic acid, Sar, SDMA, Spd, Spm, and Thioproline and test values of Alb, Folate, WBC, RBC, Hb, Ht, and PLT in blood of the subject, or (ii) a value of a formula including an explanatory variable to be substituted with the at least one value, calculated using the at least one value and the formula.Type: ApplicationFiled: March 25, 2021Publication date: September 9, 2021Applicant: AJINOMOTO CO., INC.Inventors: Takeshi IKEUCHI, Yuki YANO, Hiroko KONDO, Wataru SATO, Naoko ARASHIDA, Satoko UENO, Rumi NISHIMOTO, Masashi HARADA
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Publication number: 20210229676Abstract: In order to enable support information to be presented at a timing that is appropriate for a user, a movement support information presentation control apparatus according to an embodiment of the present invention estimates an audio environment and a visual environment that surrounds the user in addition to a driving performance of the user and an operation state of a driving apparatus 2. In addition, based on these estimation results, suitability of information presentation is determined for each type of presentation sections 81 to 83 and, when it is determined that information presentation is not suitable, control is performed so as to postpone an information presentation operation by a corresponding presentation section.Type: ApplicationFiled: May 30, 2019Publication date: July 29, 2021Inventors: Yuki YANO, Tatsuya ISHIHARA, Takao KURAHASHI, Tadashi NUNOBIKI
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Publication number: 20210148599Abstract: A duct includes: a tube that is formed to extend from an indoor of a building or a movable body and that allows an outside and the indoor to communicate with each other; an electromagnetic wave inhibiting sloped surface that is formed on an inner surface of the tube and extends to be sloped to approach an axial line of the tube from the outside toward the indoor in an axial direction of the tube and that reflects an electromagnetic wave; and an electromagnetic wave selecting inner peripheral member that has a tubular shape covering the electromagnetic wave inhibiting sloped surface from an inner peripheral side and is capable of selectively transmitting only an electromagnetic wave of a specific frequency incident on the tube.Type: ApplicationFiled: October 29, 2020Publication date: May 20, 2021Inventors: Yuki YANO, Nobuyuki KAMIHARA
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Publication number: 20210123812Abstract: An aircraft sensor system includes an aircraft sensor module provided in an aircraft. The sensor module is an outdoor temperature sensor module configured to measure outdoor temperature of the aircraft. The sensor module includes an energy harvesting element configured to generate power from vibration generated by the aircraft; a power storage unit configured to store power generated by the energy harvesting element; a sensor configured to operate by the power from at least one of the energy harvesting element and the power storage unit; and a wireless communication unit configured to operate by at least one of the power from the energy harvesting element and the power from the power storage unit, and transmit measurement data measured by the sensor to an external device via wireless communication. The sensor module is provided to a wing tip end portion that is a free end of a wing body of the aircraft.Type: ApplicationFiled: August 15, 2018Publication date: April 29, 2021Inventors: Nobuyuki KAMIHARA, Yuki YANO, Kiyoka TAKAGI
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Publication number: 20190277862Abstract: An evaluating method includes an evaluating step of evaluating a state of mild cognitive impairment or Alzheimer's disease for a subject to be evaluated using a concentration value of at least one of ?-ABA, Ala, Arg, Asn, Cit, Gln, Glu, Gly, His, Ile, Leu, Lys, Met, Orn, Phe, Pro, Ser, Thr, Trp, Tyr, Val, Cysteine, Taurine, GABA, Hypotaurine, S-Adenosyl homocysteine, Sarcosine, Serotonin, Spermidine, hCit, 3-hKyn, aAiBA, N8-Acetylspermidine, Phosphoserine, bABA, ADMA, and Thioproline in blood of the subject.Type: ApplicationFiled: January 4, 2019Publication date: September 12, 2019Applicant: AJINOMOTO CO., INC.Inventors: Takeshi IKEUCHI, Nobuhiro KAWAI, Yuki YANO, Naoko ARASHIDA, Rumi NISHIMOTO, Kazutaka SHIMBO
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Publication number: 20190137516Abstract: An evaluating method includes an evaluating step of evaluating future risk of developing Alzheimer's disease for a subject to be evaluated having mild cognitive impairment using a concentration value of at least one of ?-ABA, Ala, Arg, Asn, Cit, Gln, Glu, Gly, His, Ile, Leu, Lys, Met, Orn, Phe, Pro, Ser, Thr, Trp, Tyr, Val, Cysteine, Taurine, bABA, Ethylglycine, Hypotaurine, 3-Me-His, 5-HydroxyTrp, aAiBA, and N8-Acetylspermidine in blood of the subject.Type: ApplicationFiled: January 4, 2019Publication date: May 9, 2019Applicant: AJINOMOTO CO., INC.Inventors: Takeshi Ikeuchi, Yuki Yano, Naoko Arashida, Rumi Nishimoto, Kazutaka Shimbo, Nobuhiro Kawai
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Publication number: 20120040415Abstract: A method is provided for producing an L-amino acid which includes the steps of culturing a bacterium, which belongs to the family Enterobacteriaceae and is able to produce an L-amino acid, in a medium containing glycerol as a carbon source to produce and accumulate an L-amino acid in the medium, and collecting the L-amino acid from the culture. The culture is performed as a fed-batch culture or a continuous culture, and a feed medium containing glycerol is added to the fermentation medium so that the glycerol concentration in the fermentation medium is 5 g/L or higher.Type: ApplicationFiled: June 28, 2011Publication date: February 16, 2012Inventors: Yuichi Nakahara, Yusuke Hagiwara, Yuri Nagai, Takuji Ueda, Kazuyuki Hayashi, Yuki Yano